# US 12,119,279 B2 · Semiconductor device having at least one resin part that closes one or more corresponding ones of a plurality of threaded holes

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- Number: US 12,119,279 B2
- Document ID: US12119279B2
- Status: Granted
- Kind: B2
- Application number: 17/471,688
- Filed: 2021-09-10
- Published: 2022-05-12
- Granted: 2024-10-15
- Earliest claimed: 2020-11-12
- Assignees: Mitsubishi Electric Corporation
- Applicants: Mitsubishi Electric Corporation
- Inventors: Mamoru Togami; Toshitaka Sekine; Teruaki Nagahara; Hiroyuki Nakamura; Kazuhiro Kawahara; Kosuke Yamaguchi; Shota O
- Web page: https://patentgrep.com/patent/US12119279B2

## CPC

- H10W 46/00: Marks applied to devices, e.g. for alignment or identification
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 40/611: {Bolts or screws}
- F16B 37/14: Cap nuts; Nut caps or bolt caps
- F16B 41/005: {Measures against unauthorised operation of bolts, nuts or pins (F16B23/0007, F16B23/0061, F16B23/0069, F16B23/0076 and F16B31/02 take precedence; locks, keys E05B; for valves, taps or cocks F16K35/00; for pipe-joints with swivel-nuts F16L19/005)}
- H10W 46/401: {for identification or tracking}
- H10W 46/607: {Located on parts of packages, e.g. on encapsulations or on package substrates}
- H10W 70/429: {being the outer leads}
- H10W 78/00: Detachable holders for supporting packaged chips in operation
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- F16B: DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING (couplings for transmitting rotation F16D)

## Abstract

A semiconductor device includes: a package to seal a semiconductor element; a lead frame having one end portion connected to the semiconductor element and the other end portion protruding from a side surface of the package; a plurality of threaded holes formed in the package to enable the package to be fixed to the substrate; and a resin part capable of closing each of the plurality of threaded holes. A type name of the semiconductor device is represented by open and closed states of the respective threaded holes.

## Claims

### Claim 1

A semiconductor device to be mounted to a substrate, the semiconductor device comprising:
a package to seal a semiconductor element;
a lead frame having one end portion connected to the semiconductor element and an other end portion protruding from a side surface of the package;
a plurality of threaded holes formed in the package to enable the package to be fixed to the substrate; and
at least one resin part that closes one or more corresponding ones of the threaded holes, at least one of the threaded holes being in an open state, the closed one or more corresponding ones of the threaded holes being visible from outside the package, where a lowest surface of the at least one resin part is offset from a lowest surface of the package.

### Claim 2 (depends on 1)

The semiconductor device according to claim 1, wherein
the at least one resin part is thinner than the package.

### Claim 3 (depends on 2)

The semiconductor device according to claim 2, wherein
the at least one resin part is connected to each of the one or more corresponding ones of the threaded holes via a connection.

### Claim 4 (depends on 1)

The semiconductor device according to claim 1, wherein
the at least one resin part protrudes downward from each of the one or more corresponding ones of the threaded holes.

### Claim 5 (depends on 1)

The semiconductor device according to claim 1, wherein
a type name of the semiconductor device is represented by open and closed states of the threaded holes.

### Claim 6 (depends on 1)

The semiconductor device according to claim 1, wherein
the at least one resin part closes the one or more corresponding ones of the threaded holes so as to block a screw from passing through the one or more corresponding ones of the threaded holes.

### Claim 7 (depends on 1)

The semiconductor device according to claim 1, wherein
the at least one resin part is positioned within the one or more corresponding ones of the threaded holes, and
each of the threaded holes includes a structure having a common shape.

### Claim 8 (depends on 1)

The semiconductor device according to claim 1, wherein
the lowest surface of the at least one resin part is visible from outside the package.