# US 12,119,278 B2 · Method of manufacturing a supporting glass substrate

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- Number: US 12,119,278 B2
- Document ID: US12119278B2
- Status: Granted
- Kind: B2
- Application number: 18/219,941
- Filed: 2023-07-10
- Published: 2023-11-02
- Granted: 2024-10-15
- Earliest claimed: 2014-09-25
- Assignees: Nippon Electric Glass Co., Ltd.
- Applicants: Nippon Electric Glass Co., Ltd.
- Inventors: Hiroki Katayama
- Web page: https://patentgrep.com/patent/US12119278B2

## CPC

- H10W 70/692: Ceramics or glasses
- B24B 37/07: characterised by the movement of the work or lapping tool
- B32B 17/06: comprising glass as the main or only constituent of a layer, next to another layer of a specific {material}
- C03C 3/091: containing aluminium
- C03C 3/093: containing zinc or zirconium
- C03C 19/00: Surface treatment of glass, not in the form of fibres or filaments, by mechanical means (sand-blasting, grinding, or polishing glass B24)
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/0198: {batch processes}
- H10W 74/01: Manufacture or treatment
- H10W 74/014: {using batch processing}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- B32B 2307/538: Roughness
- B32B 2457/14: Semiconductor wafers
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/9413: {on encapsulations}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS

## Abstract

Devised are a supporting substrate capable of contributing to an increase in density of a semiconductor package and a laminate using the supporting substrate. A supporting glass substrate of the present invention includes a polished surface on a surface thereof and has a total thickness variation of less than 2.0 μm.

## Claims

### Claim 1

A method of manufacturing a supporting glass substrate, the method comprising the steps of:
preparing a supporting glass substrate free of any through holes, the supporting glass substrate comprising a first surface and a second surface opposite to the first surface;
sandwiching the first surface and the second surface of the supporting glass substrate with a pair of polishing pads; and
polishing the first surface and the second surface of the supporting glass substrate, which is free of any through holes, so that the supporting glass substrate has a total thickness variation of less than 5.0 μm while rotating the supporting glass substrate and the pair of polishing pads together so that a part of the supporting glass substrate intermittently extends off from the polishing pads during the polishing.

### Claim 2 (depends on 1)

The method of manufacturing a supporting glass substrate according to claim 1, wherein the supporting glass substrate has a warpage level of 60 μm or less.

### Claim 3 (depends on 2)

The method of manufacturing a supporting glass substrate according to claim 2, wherein the supporting glass substrate has a Young's modulus of 65 GPa or more.

### Claim 4 (depends on 2)

The method of manufacturing a supporting glass substrate according to claim 2, wherein the supporting glass substrate has a polishing depth of 50 μm or less.

### Claim 5 (depends on 2)

The method of manufacturing a supporting glass substrate according to claim 2, wherein the supporting glass substrate has an arithmetic average roughness of 10 nm or less.

### Claim 6 (depends on 2)

The method of manufacturing a supporting glass substrate according to claim 2, wherein the supporting glass substrate is formed by an overflow down-draw method.

### Claim 7 (depends on 1)

The method of manufacturing a supporting glass substrate according to claim 1, wherein the supporting glass substrate has a Young's modulus of 65 GPa or more.

### Claim 8 (depends on 1)

The method of manufacturing a supporting glass substrate according to claim 1, wherein the supporting glass substrate has a polishing depth of 50 μm or less.

### Claim 9 (depends on 1)

The method of manufacturing a supporting glass substrate according to claim 1, wherein the supporting glass substrate has an arithmetic average roughness of 10 nm or less.

### Claim 10 (depends on 1)

The method of manufacturing a supporting glass substrate according to claim 1, wherein the supporting glass substrate is formed by an overflow down-draw method.