# US 12,119,276 B2 · Package structure with protective lid > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,276 B2 - Document ID: US12119276B2 - Status: Granted - Kind: B2 - Application number: 18/360,465 - Filed: 2023-07-27 - Published: 2023-11-16 - Granted: 2024-10-15 - Earliest claimed: 2021-04-29 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Wen-Yi Lin; Kuang-Chun Lee; Chien-Chen Li; Chen-Shien Chen - Web page: https://patentgrep.com/patent/US12119276B2 ## CPC - H10W 76/60: Seals - H10W 90/00: Package configurations - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 76/01: Manufacture or treatment - H10W 76/15: Containers comprising an insulating or insulated base - H10W 70/611: {for connecting multiple chips together} - H10W 72/90: Bond pads, in general - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A package structure is provided. The package structure includes a substrate and a chip-containing structure over the substrate. The package structure also includes a protective lid attached to the substrate through a first adhesive element and a second adhesive element. The first adhesive element has a first electrical resistivity, and the second adhesive element has a second electrical resistivity. The second electrical resistivity is greater than the first electrical resistivity. The second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and a portion of the second adhesive element is between the first adhesive element and the chip-containing structure. ## Claims ### Claim 1 A package structure, comprising: a substrate; a chip-containing structure over the substrate; and a protective lid attached to the substrate through a first adhesive element and a second adhesive element, wherein the first adhesive element has a first electrical resistivity, the second adhesive element has a second electrical resistivity, the second electrical resistivity is greater than the first electrical resistivity, the second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and a portion of the second adhesive element is between the first adhesive element and the chip-containing structure. ### Claim 2 (depends on 1) The package structure as claimed in claim 1, wherein the first adhesive element is closer to a center of a side edge of the substrate than the second adhesive element. ### Claim 3 (depends on 1) The package structure as claimed in claim 1, further comprising: a ground structure electrically connected to the first adhesive element. ### Claim 4 (depends on 1) The package structure as claimed in claim 1, further comprising: a ground structure electrically connected to the protective lid through the first adhesive element. ### Claim 5 (depends on 4) The package structure as claimed in claim 4, further comprising: a second ground structure, wherein the first adhesive element covers the ground structure and the second ground structure. ### Claim 6 (depends on 1) The package structure as claimed in claim 1, wherein the first adhesive element is in direct contact with the second adhesive element. ### Claim 7 (depends on 1) The package structure as claimed in claim 1, further comprising: a third adhesive element between the protective lid and the substrate, wherein the third adhesive element has a lower electrical resistivity than the second electrical resistivity of the second adhesive element. ### Claim 8 (depends on 7) The package structure as claimed in claim 7, wherein the third adhesive element is laterally surrounded by the second adhesive element. ### Claim 9 (depends on 7) The package structure as claimed in claim 7, further comprising: a second ground structure, wherein the third adhesive element covers the second ground structure. ### Claim 10 (depends on 7) The package structure as claimed in claim 7, wherein the third adhesive element is separated from the first adhesive element by the second adhesive element. ### Claim 11 A package structure, comprising: a substrate; a chip-containing structure over the substrate; and a protective lid attached to the substrate through a first adhesive element and a second adhesive element, wherein the first adhesive element and the second adhesive element are made of different materials, the second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and the first adhesive element is closer to a center of a side edge of the substrate than the second adhesive element. ### Claim 12 (depends on 11) The package structure as claimed in claim 11, wherein a portion of the second adhesive element is between the first adhesive element and the chip-containing structure. ### Claim 13 (depends on 11) The package structure as claimed in claim 11, wherein the protective lid is electrically connected to the first adhesive element. ### Claim 14 (depends on 13) The package structure as claimed in claim 13, further comprising: a ground structure covered by the first adhesive element. ### Claim 15 (depends on 11) The package structure as claimed in claim 11, wherein the first adhesive element is in direct contact with the second adhesive element. ### Claim 16 A package structure, comprising: a substrate; a chip-containing structure over the substrate; and a protective lid attached to the substrate through a first adhesive element and a second adhesive element, wherein the first adhesive element and the second adhesive element are made of different materials, the second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and a portion of the second adhesive element is between the first adhesive element and the chip-containing structure. ### Claim 17 (depends on 16) The package structure as claimed in claim 16, further comprising: a ground structure electrically connected to the protective lid through the first adhesive element. ### Claim 18 (depends on 17) The package structure as claimed in claim 17, further comprising: a second ground structure electrically connected to the protective lid through the first adhesive element, wherein the first adhesive element covers tops of the ground structure and the second ground structure. ### Claim 19 (depends on 16) The package structure as claimed in claim 16, wherein the second adhesive element laterally surrounds the first adhesive element. ### Claim 20 (depends on 16) The package structure as claimed in claim 16, further comprising: a third adhesive element between the protective lid and the substrate, wherein the third adhesive element is spaced apart from the first adhesive element, and the chip-containing structure is between the first adhesive element and the third adhesive element.