# US 12,119,257 B2 · Floating pin, wafer carrying device and depositing apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,257 B2 - Document ID: US12119257B2 - Status: Granted - Kind: B2 - Application number: 17/455,734 - Filed: 2021-11-19 - Published: 2022-07-07 - Granted: 2024-10-15 - Earliest claimed: 2021-01-06 - Assignees: Changxin Memory Technologies, Inc. - Applicants: Changxin Memory Technologies, Inc. - Inventors: Chaoqun Yu - Web page: https://patentgrep.com/patent/US12119257B2 ## CPC - H10P 72/7612: {characterised by lifting arrangements, e.g. lift pins} - C23C 16/4584: {the substrate being rotated} - H10P 72/7608: {characterised by a plurality of separate clamping members, e.g. clamping fingers} - H10P 72/7618: {characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel} - H10P 72/7621: {characterised by supporting two or more semiconductor substrates} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) ## Abstract The present application provides a floating pin, a wafer carrying device and a depositing apparatus, which relates to the technical field of semiconductor apparatus, and is used for solving the technical problem of low yield of a workpiece to be processed. The floating pin includes a pin body and a pin head connected to one end of the pin body, wherein the pin head protrudes in relation to a side surface of the pin body, and a side surface of a protruding part of the pin head is a curved surface. By reducing the distance between the pin head and the workpiece to be processed, the impact force on the workpiece to be processed when the pin head collides with the workpiece to be processed can be reduced, damages to the workpiece to be processed can be reduced, and the yield of the workpiece to be processed can be improved. ## Claims ### Claim 1 A floating pin, comprising a pin body and a pin head connected to one end of the pin body, wherein the pin head protrudes in relation to a side surface of the pin body, and a side surface of a protruding part of the pin head is a curved surface; wherein the floating pin is further provided with a pressure relief hole running through the pin body and the pin head; wherein the floating pin is further provided with a pressure relief hole running through a bottom surface of the pin body and a top surface of the pin head, or alternatively, the floating pin is further provided with a pressure relief hole running through the bottom surface of the pin body and the side surface of the pin head. ### Claim 2 (depends on 1) The floating pin according to claim 1, wherein the curved surface of the pin head forms a recess for accommodating an edge of a workpiece to be processed, and a surface of the recess is matched with a surface of the workpiece to be processed. ### Claim 3 (depends on 2) The floating pin according to claim 2, wherein the floating pin is mushroom-shaped. ### Claim 4 (depends on 2) The floating pin according to claim 2, wherein the pin head comprises a fixed cross-section portion connected to the pin body and a variable cross-section portion connected to the fixed cross-section portion, and a fillet transition is made between a side surface of the fixed cross-section portion and a side surface of the variable cross-section portion. ### Claim 5 (depends on 4) The floating pin according to claim 4, wherein the side surface of the variable cross-section portion is provided with the recess. ### Claim 6 (depends on 4) The floating pin according to claim 4, wherein surfaces where the fixed cross-section portion and the variable cross-section portion are connected to each other coincide. ### Claim 7 (depends on 4) The floating pin according to claim 4, wherein the fixed cross-section portion and the pin body are cylinders, and a radius of the fixed cross-section portion is greater than that of the pin body; and the variable cross-section portion is a truncated cone. ### Claim 8 (depends on 7) The floating pin according to claim 7, wherein the radius of the pin body, a height of the pin body and the radius of the fixed cross-section portion satisfy the following formula: c>2a>b; where a is the radius of the pin body, b is the radius of the fixed cross-section portion, and c is the height of the pin body. ### Claim 9 (depends on 7) The floating pin according to claim 7, wherein a taper of the truncated cone is less than or equal to 25 degrees. ### Claim 10 (depends on 7) The floating pin according to claim 7, wherein the pin body has a diameter of 6 mm±0.02 mm, the pin body has a height of 12 mm±0.02 mm, the fixed cross-section portion has the radius of 4 mm±0.05 mm, the fixed cross-section portion has a height of 1 mm±0.02 mm, and the variable cross-section portion has a height of 3 mm±0.02 mm. ### Claim 11 (depends on 1) The floating pin according to claim 1, wherein the floating pin is mushroom-shaped. ### Claim 12 (depends on 1) A wafer carrying device, comprising: a machine table with a revolving center, wherein the machine table comprises a carrying area provided around the revolving center and used for placing wafers, and an edge of the carrying area away from the revolving center is provided with mounting holes; and the floating pin according to claim 1 installed in the mounting hole, the pin body is inserted into the mounting hole, and at least part of the pin head extends to the carrying area. ### Claim 13 (depends on 12) A depositing apparatus, comprising a reaction chamber, within which the wafer carrying device according to claim 12 is provided. ### Claim 14 A floating pin, comprising a pin body and a pin head connected to one end of the pin body, wherein the pin head protrudes in relation to a side surface of the pin body, and a side surface of a protruding part of the pin head is a curved surface; wherein the floating pin is further provided with a pressure relief hole running through the pin body and the pin head; wherein the pressure relief hole is a through hole, which runs through central areas of the pin body and the pin head. ### Claim 15 (depends on 14) The floating pin according to claim 14, wherein the curved surface of the pin head forms a recess for accommodating an edge of a workpiece to be processed, and a surface of the recess is matched with a surface of the workpiece to be processed. ### Claim 16 (depends on 15) The floating pin according to claim 15, wherein the floating pin is mushroom-shaped. ### Claim 17 (depends on 15) The floating pin according to claim 15, wherein the pin head comprises a fixed cross-section portion connected to the pin body and a variable cross-section portion connected to the fixed cross-section portion, and a fillet transition is made between a side surface of the fixed cross-section portion and a side surface of the variable cross-section portion. ### Claim 18 (depends on 17) The floating pin according to claim 17, wherein the side surface of the variable cross-section portion is provided with the recess. ### Claim 19 (depends on 17) The floating pin according to claim 17, wherein surfaces where the fixed cross-section portion and the variable cross-section portion are connected to each other coincide. ### Claim 20 A floating pin, comprising a pin body and a pin head connected to one end of the pin body, wherein the pin head protrudes in relation to a side surface of the pin body, and a side surface of a protruding part of the pin head is a curved surface; wherein the curved surface of the pin head forms a recess for accommodating an edge of a workpiece to be processed, and a surface of the recess is matched with a surface of the workpiece to be processed; wherein the pin head comprises a fixed cross-section portion connected to the pin body and a variable cross-section portion connected to the fixed cross-section portion, and a fillet transition is made between a side surface of the fixed cross-section portion and a side surface of the variable cross-section portion; wherein the fixed cross-section portion and the pin body are cylinders, and a radius of the fixed cross-section portion is greater than that of the pin body; and the variable cross-section portion is a truncated cone; wherein the pin body has a diameter of 6 mm±0.02 mm, the pin body has a height of 12 mm±0.02 mm, the fixed cross-section portion has the radius of 4 mm±0.05 mm, the fixed cross-section portion has a height of 1 mm±0.02 mm, and the variable cross-section portion has a height of 3 mm±0.02 mm.