# US 12,119,255 B2 · Layered sheet, container, carrier tape, and electronic component packaging body > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,255 B2 - Document ID: US12119255B2 - Status: Granted - Kind: B2 - Application number: 17/793,538 - Filed: 2021-03-08 - Published: 2023-03-16 - Granted: 2024-10-15 - Earliest claimed: 2020-03-19 - Assignees: Denka Company Limited - Applicants: Denka Company Limited - Inventors: Yuko Fukuda; Junpei Fujiwara; Ryosuke Yanaka - Web page: https://patentgrep.com/patent/US12119255B2 ## CPC - H01L 21/6836 - B32B 27/08: of synthetic resin - B32B 27/20: using fillers, pigments, thixotroping agents - B32B 2250/02: 2 layers - B32B 2250/24: All layers being polymeric - B32B 2260/046: Synthetic resin - B32B 2264/108: Carbon, e.g. graphite particles - B32B 2305/30: Fillers, e.g. particles, powders, beads, flakes, spheres, chips - B32B 2313/04: Carbon - B32B 2398/20: Thermoplastics - B32B 2439/02: Open containers - H01L - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ## Abstract A layered sheet 10 includes a substrate layer 1, and surface layers 2 and 3 configured to be layered on at least one surface of the substrate layer 1. The substrate layer 1 contains a first thermoplastic resin and inorganic fillers. The surface layers 2 and 3 contain a second thermoplastic resin and a conductive material. A content of the inorganic fillers in the substrate layer 1 is 0.3 to 28 mass % based on a total amount of the substrate layer. ## Claims ### Claim 1 A layered sheet comprising: a substrate layer; and a surface layer configured to be layered on at least one surface of the substrate layer, wherein the substrate layer contains a first thermoplastic resin and inorganic fillers, wherein the surface layer contains a second thermoplastic resin and a conductive material, wherein the second thermoplastic resin includes a polycarbonate resin and a polyester resin, and wherein a content of the inorganic fillers in the substrate layer is 0.3 to 28 mass % based on a total amount of the substrate layer. ### Claim 2 (depends on 1) The layered sheet according to claim 1, wherein an average primary particle size of the inorganic fillers is 25 nm to 5.0 μm. ### Claim 3 (depends on 1) The layered sheet according to claim 1, wherein the substrate layer contains carbon black as the inorganic fillers. ### Claim 4 (depends on 1) The layered sheet according to claim 1, wherein the first thermoplastic resin includes a polycarbonate resin and a polyester resin, and the substrate layer contains, as the inorganic fillers, inorganic fillers formed of the same material as the conductive material contained in the surface layer. ### Claim 5 (depends on 1) The layered sheet according to claim 1, wherein a content of the conductive material in the surface layer is 10 to 30 mass % based on a total amount of the surface layer. ### Claim 6 (depends on 1) The layered sheet according to claim 1, wherein a thickness of the substrate layer is 70% to 97% of a thickness of the entire layered sheet. ### Claim 7 (depends on 1) A container configured to be a molded body of the layered sheet according to claim 1. ### Claim 8 (depends on 1) A carrier tape configured to be a molded body of the layered sheet according to claim 1 and be provided with an accommodation portion capable of accommodating an article. ### Claim 9 (depends on 8) An electronic component packaging body comprising: the carrier tape according to claim 8; an electronic component configured to be accommodated in the accommodation portion of the carrier tape; and a cover film configured to be adhered to the carrier tape as a lid material. ### Claim 10 (depends on 1) The layered sheet according to claim 1, wherein the first thermoplastic resin includes a styrene-based resin. ### Claim 11 A layered sheet comprising: a substrate layer; and a surface layer configured to be layered on at least one surface of the substrate layer, wherein the substrate layer contains a first thermoplastic resin and inorganic fillers, wherein the surface layer contains a second thermoplastic resin and a conductive material, and wherein the first thermoplastic resin includes a high-impact polystyrene resin, wherein the second thermoplastic resin includes a high-impact polystyrene resin. ### Claim 12 (depends on 11) The layered sheet according to claim 11, wherein an average primary particle size of the inorganic fillers is 25 nm to 5.0 μm. ### Claim 13 (depends on 11) The layered sheet according to claim 11, wherein the substrate layer contains carbon black as the inorganic fillers. ### Claim 14 (depends on 11) The layered sheet according to claim 11, wherein the substrate layer contains, as the first thermoplastic resin, a thermoplastic resin of the same kind as the second thermoplastic resin contained in the surface layer and contains, as the inorganic fillers, inorganic fillers formed of the same material as the conductive material contained in the surface layer. ### Claim 15 (depends on 11) The layered sheet according to claim 11, wherein a content of the conductive material in the surface layer is 10 to 30 mass % based on a total amount of the surface layer. ### Claim 16 (depends on 11) The layered sheet according to claim 11, wherein a thickness of the substrate layer is 70% to 97% of a thickness of the entire layered sheet. ### Claim 17 (depends on 11) A container configured to be a molded body of the layered sheet according to claim 11. ### Claim 18 (depends on 11) A carrier tape configured to be a molded body of the layered sheet according to claim 11 and be provided with an accommodation portion capable of accommodating an article. ### Claim 19 (depends on 18) An electronic component packaging body comprising: the carrier tape according to claim 18; an electronic component configured to be accommodated in the accommodation portion of the carrier tape; and a cover film configured to be adhered to the carrier tape as a lid material.