# US 12,119,240 B2 · Substrate drying device and method of drying substrate using the same preliminary class > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,240 B2 - Document ID: US12119240B2 - Status: Granted - Kind: B2 - Application number: 18/081,948 - Filed: 2022-12-15 - Published: 2023-06-15 - Granted: 2024-10-15 - Earliest claimed: 2021-12-15 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Ansook Sul; Sungyong Park; Sejin Park; Donok Choi - Web page: https://patentgrep.com/patent/US12119240B2 ## CPC - H10P 72/0408: {for drying} - B08B 3/12: by sonic or ultrasonic vibrations - B08B 7/0021: {by liquid gases or supercritical fluids} - H10P 70/20: {Cleaning during device manufacture} - H10P 70/80: {Cleaning only by supercritical fluids} - H10P 72/0406: {for cleaning followed by drying, rinsing, stripping, blasting or the like} - H10P 72/0414: {using mainly spraying means, e.g. nozzles} - H10P 72/7624: {characterised by the mechanical construction of the susceptor, stage or support} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL ## Abstract A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space. ## Claims ### Claim 1 A substrate drying device comprising: an upper chamber body comprising an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body comprising an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices comprising a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space, wherein the substrate holders comprise a support pin and a grip pin, the support pin is configured to support a lower surface of the wafer, and the grip pin is configured to grip a side surface of the wafer, and wherein the support pin is positioned separately from the grip pin without contacting the grip pin. ### Claim 2 (depends on 1) The substrate drying device of claim 1, wherein the grip pin comprises a first portion and a second portion, which have different vertical lengths from each other, and the length difference between the first portion and the second portion is 1 mm to 3 mm. ### Claim 3 (depends on 1) The substrate drying device of claim 1, wherein the plurality of vibration devices are arranged to support the wafer from under the wafer, and each of the substrate holders comprises a support pin configured to support a lower surface of the wafer. ### Claim 4 (depends on 3) The substrate drying device of claim 3, wherein the number of the vibration devices is at least four, one vibration device is arranged to support a center of a wafer, the other vibration devices are arranged at an equal interval to surround the one vibration device. ### Claim 5 (depends on 4) The substrate drying device of claim 4, wherein a distance between the one vibration device arranged at the center and each of the other vibration devices is 70 mm to 130 mm. ### Claim 6 (depends on 1) The substrate drying device of claim 1, wherein a surface of each of the substrate holders is configured to contact the wafer, and the surface of each of the substrate holders comprises a viscoelastic material. ### Claim 7 (depends on 1) The substrate drying device of claim 1, wherein each of the vibration modules comprises at least three ultrasonic vibrators, the ultrasonic vibrators are configured to generate ultrasonic waves having different frequencies from each other, one of the ultrasonic waves has a frequency in a range from 20 kHz to 60 kHz, another of the ultrasonic waves has a frequency in a range from 60 kHz to 100 kHz, and another of the ultrasonic waves has a frequency higher than about 100 kHz. ### Claim 8 A substrate drying device comprising: an upper chamber body comprising an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body comprising an outlet configured to discharge the supercritical fluid out of the chamber space; a plurality of substrate holders arranged in the chamber space, and configured to fix a wafer; and a plurality of vibration modules arranged in the chamber space, and configured to generate ultrasonic waves having different frequencies from each other, wherein the plurality of substrate holders comprise a support pin and a grip pin, the support pin is configured to support a lower surface of the wafer, and the grip pin is configured to grip a side surface of the wafer, and wherein the support pin is positioned separately from the grip pin without contacting the grip pin. ### Claim 9 (depends on 8) The substrate drying device of claim 8, wherein the plurality of vibration modules are arranged line-symmetric with respect to a line passing through a center of the wafer as a reference. ### Claim 10 (depends on 8) The substrate drying device of claim 8, wherein the plurality of vibration modules are arranged over the wafer. ### Claim 11 (depends on 8) The substrate drying device of claim 8, wherein the plurality of vibration modules are arranged on both sidewalls of the wafer. ### Claim 12 (depends on 8) The substrate drying device of claim 8, further comprising a wave transfer plate arranged between the plurality of vibration modules and the plurality of substrate holders. ### Claim 13 (depends on 12) The substrate drying device of claim 12, wherein the wave transfer plate has a mesh shape.