# US 12,119,182 B2 · Multilayer ceramic electronic component including internal conductive layer including a plurality of holes > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,182 B2 - Document ID: US12119182B2 - Status: Granted - Kind: B2 - Application number: 17/837,243 - Filed: 2022-06-10 - Published: 2022-12-22 - Granted: 2024-10-15 - Earliest claimed: 2021-06-16 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Tomoaki Hirai - Web page: https://patentgrep.com/patent/US12119182B2 ## CPC - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/012: Form of non-self-supporting electrodes - H01G 4/1209: {characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence)} - H01G 4/1227: {based on alkaline earth titanates} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A multilayer ceramic electronic component includes a multilayer body including stacked ceramic layers, internal conductive layers stacked on the ceramic layers, and external electrodes each connected to the internal conductive layers. The internal conductive layers each include holes each having a different area equivalent diameter. The holes include first holes including ceramic pillars therein and second holes not including ceramic pillars therein. The ceramic pillars connect ceramic layers on sides of the internal conductive layers. When an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the holes existing in each of the internal conductive layers is 90% is defined as an area equivalent diameter D90, an abundance ratio of the first holes in a first population including holes each having the area equivalent diameter D90 or more is about 14% or more. ## Claims ### Claim 1 A multilayer ceramic electronic component comprising: a multilayer body including a plurality of stacked ceramic layers, a plurality of internal conductive layers stacked on the ceramic layers, a first main surface and a second main surface opposing each other in a height direction, a first side surface and a second side surface opposing each other in a width direction perpendicular or substantially perpendicular to the height direction, and a first end surface and a second end surface opposing each other in a length direction perpendicular or substantially perpendicular to the height direction and the width direction; and external electrodes each connected to the internal conductive layers; wherein the internal conductive layers each include a plurality of holes each having a different area equivalent diameter; the plurality of holes include first holes including ceramic pillars therein and second holes not including ceramic pillars therein, the ceramic pillars connecting ceramic layers on one side and one other side of the internal conductive layers; when an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the plurality of holes existing in each of the internal conductive layers is about 90% is defined as an area equivalent diameter D90, an abundance ratio of the first holes in a first population including holes each having the area equivalent diameter D90 or more is about 14% or more; and the abundance ratio of the first holes in the first population including holes having the area equivalent diameter D90 or more is higher than an abundance ratio of the first holes in a second population including holes each having an area equivalent diameter smaller than the area equivalent diameter D90. ### Claim 2 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the abundance ratio of the first holes in the first population including holes each having the area equivalent diameter D90 or more is about 29% or more. ### Claim 3 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the abundance ratio of the first holes in the first population including holes each having the area equivalent diameter D90 or more is about 14% or more and about 86% or less. ### Claim 4 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the abundance ratio of the first holes in the first population including holes each having the area equivalent diameter D90 or more is about 29% or more and about 86% or less. ### Claim 5 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a coverage of each of the internal conductive layers with respect to the ceramic layers is about 70% or more and about 99% or less. ### Claim 6 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the coverage of each of the internal conductive layers with respect to the ceramic layers is about 86% or more and about 93% or less. ### Claim 7 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the internal conductive layers each have a thickness of about 0.2 μm or more and about 2.0 μm or less. ### Claim 8 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the internal conductive layers each have a thickness of about 0.2 μm or more and about 0.3 μm or less. ### Claim 9 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the area equivalent diameter D90 is about 4.0 μm or less. ### Claim 10 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the area equivalent diameter D90 is about 1.9 μm or more and about 4.0 μm or less. ### Claim 11 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a thickness of each of the internal conductive layers is smaller than the area equivalent diameter D90. ### Claim 12 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a thickness of each of the internal conductive layers is half or less the area equivalent diameter D90. ### Claim 13 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein an average value of a circularity of the plurality of holes in the first population of holes each having the area equivalent diameter D90 or more is about 0.7 or less. ### Claim 14 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein an average value of a circularity of the plurality of holes in the first population of holes each having the area equivalent diameter D90 or more is about 0.46 or less. ### Claim 15 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein an average value of a circularity of the plurality of holes in the first population of holes each having the area equivalent diameter D90 or more is about 0.2 or more and about 0.7 or less. ### Claim 16 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein an average value of a circularity of the plurality of holes in the first population of holes each having the area equivalent diameter D90 or more is about 0.2 or more and about 0.46 or less. ### Claim 17 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a dimension of the multilayer body in the length direction is about 0.2 mm or more and about 6 mm or less, a dimension of the multilayer body in the height direction is about 0.05 mm or more and about 5 mm or less, and a dimension of the multilayer body in the width direction is about 0.1 mm or more and about 5 mm or less. ### Claim 18 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein each of the plurality of dielectric layers includes BaTiO3, CaTiO3, SrTiO3, or CaZrO3 as a main component. ### Claim 19 (depends on 18) The multilayer ceramic electronic component according to claim 18, wherein each of the plurality of dielectric layers includes Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound as a sub-component.