# US 12,119,181 B2 · Multilayer ceramic electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,181 B2 - Document ID: US12119181B2 - Status: Granted - Kind: B2 - Application number: 17/837,128 - Filed: 2022-06-10 - Published: 2022-12-22 - Granted: 2024-10-15 - Earliest claimed: 2021-06-16 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Tomoaki Hirai - Web page: https://patentgrep.com/patent/US12119181B2 ## CPC - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/012: Form of non-self-supporting electrodes - H01G 4/1209: {characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence)} - H01G 4/1227: {based on alkaline earth titanates} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A multilayer ceramic electronic component includes a multilayer body including stacked ceramic layers, internal conductive layers stacked on the ceramic layers, and external electrodes each connected to the internal conductive layers. The internal conductive layers each include holes each having different shapes and area equivalent diameters. When an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the holes existing in each of the internal conductive layers is about 90% is defined as an area equivalent diameter D90, an average value of circularity of the holes in a first population including holes each having the area equivalent diameter D90 or more is about 0.7 or less. ## Claims ### Claim 1 A multilayer ceramic electronic component comprising: a multilayer body including a plurality of stacked ceramic layers, a plurality of internal conductive layers stacked on the ceramic layers, a first main surface and a second main surface opposing each other in a height direction, a first side surface and a second side surface opposing each other in a width direction perpendicular or substantially perpendicular to the height direction, and a first end surface and a second end surface opposing each other in a length direction perpendicular or substantially perpendicular to the height direction and the width direction; and external electrodes each connected to the internal conductive layers; wherein the plurality of internal conductive layers each include a plurality of holes, each having a different shape and a different area equivalent diameter; when an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the plurality of holes existing in each of the internal conductive layers is about 90% is defined as an area equivalent diameter D90, an average value of circularity of the plurality of holes in a first population including holes each having the area equivalent diameter D90 or more is about 0.7 or less. ### Claim 2 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein an average value of circularity of the plurality of holes in the first population including holes each having the area equivalent diameter D90 or more is about 0.46 or less. ### Claim 3 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein an average value of circularity of the plurality of holes in the first population including holes, each having the area equivalent diameter D90 or more, is about 0.2 or more and about 0.7 or less. ### Claim 4 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein an average value of circularity of the plurality of holes in the first population including holes, each having the area equivalent diameter D90 or more, is about 0.2 or more and about 0.46 or less. ### Claim 5 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a coverage of each of the plurality of internal conductive layers with respect to each of the ceramic layers is about 70% or more and about 99% or less. ### Claim 6 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a coverage of each of the plurality of internal conductive layers with respect to each of the ceramic layers is about 86% or more and about 93% or less. ### Claim 7 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the internal conductive layers each have a thickness of about 0.2 μm or more and about 2.0 μm or less. ### Claim 8 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the plurality of internal conductive layers each have a thickness of about 0.2 μm or more and about 0.3 μm or less. ### Claim 9 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the area equivalent diameter D90 is about 4.0 μm or less. ### Claim 10 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the area equivalent diameter D90 is about 1.9 μm or more and about 4.0 μm or less. ### Claim 11 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a thickness of each of the plurality of internal conductive layers is smaller than the area equivalent diameter D90. ### Claim 12 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a thickness of each of the plurality of internal conductive layers is no more than about half of the area equivalent diameter D90. ### Claim 13 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a dimension of the multilayer body in the length direction is about 0.2 mm or more and about 6 mm or less, a dimension of the multilayer body in the height direction is about 0.05 mm or more and about 5 mm or less, and a dimension of the multilayer body in the width direction is about 0.1 mm or more and about 5 mm or less. ### Claim 14 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the multilayer body includes an inner layer portion, a first main surface-side outer layer portion and a second main surface-side outer layer sandwiching the inner layer portion in the height direction. ### Claim 15 (depends on 14) The multilayer ceramic electronic component according to claim 14, wherein the inner layer portion includes a plurality of the dielectric layers and the plurality of the internal conductive layers; and each of the first and second main surface-side outer layer portions includes a plurality of the dielectric layers. ### Claim 16 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein each of the plurality of dielectric layers includes BaTiO3, CaTiO3, SrTiO3, or CaZrO3 as a main component. ### Claim 17 (depends on 16) The multilayer ceramic electronic component according to claim 16, wherein each of the plurality of dielectric layers includes Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound as a sub-component. ### Claim 18 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein each of the plurality of dielectric layers has a thickness of about 0.2 μm or more and about 10 μm or less. ### Claim 19 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a number of the plurality of dielectric layers is 15 or more and 1200 or less.