# US 12,119,131 B2 · Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part

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- Number: US 12,119,131 B2
- Document ID: US12119131B2
- Status: Granted
- Kind: B2
- Application number: 17/397,500
- Filed: 2021-08-09
- Published: 2021-11-25
- Granted: 2024-10-15
- Earliest claimed: 2017-07-25
- Assignees: Senju Metal Industry Co., Ltd.; Osaka University
- Applicants: Senju Metal Industry Co., Ltd.; Osaka University
- Inventors: Jinting Jiu; Minoru Ueshima; Katsuaki Suganuma; Wanli Li
- Web page: https://patentgrep.com/patent/US12119131B2

## CPC

- H01B 1/026: {Alloys based on copper}
- C09D 11/037: characterised by the pigment
- C09D 11/52: Electrically conductive inks
- C22C 1/00: Making non-ferrous alloys (by electrothermic methods C22B4/00; by electrolysis C25C1/24, C25C3/36)
- C22C 5/08: with copper as the next major constituent
- C22C 9/00: Alloys based on copper
- C23C 18/08: characterised by the deposition of metallic material
- C23C 18/143: {Radiation by light, e.g. photolysis or pyrolysis}
- C23C 26/00: Coating not provided for in groups C23C2/00 - C23C24/00
- H01B 13/00: Apparatus or processes specially adapted for manufacturing conductors or cables
- H05K 3/12: using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

## Claims

### Claim 1

A method for synthesizing a copper-silver alloy, comprising:
an ink preparation step of mixing a copper salt particle, an amine-based solvent, and a silver salt particle, thereby preparing a copper-silver ink;
a coating step of coating a member to be coated with the copper-silver ink to form a coated member;
a crystal nucleus formation step of forming at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less from the copper-silver ink; and
a crystal nucleus synthesis step of synthesizing the crystal nucleus of copper and the crystal nucleus of silver, wherein
the crystal nucleus formation step contains a first-heating step where the coated member is heated at 70° ° C. to 300° C. for 1 minute to 300 minutes, and
the crystal nucleus synthesis step contains a second-heating step where the crystal nucleus of copper and the crystal nucleus of silver are irradiated with pulsed light having an energy density of 0.5 J/cm2 to 5.0 J/cm2 for an irradiation time of 1 s or less so that the copper-silver alloy is synthesized.

### Claim 2 (depends on 1)

The method for synthesizing a copper-silver alloy according to claim 1, wherein after the crystal nucleus formation step and before the crystal nucleus synthesis step, the coated member is cooled to a temperature region of lower than 60° C.

### Claim 3 (depends on 1)

The method for synthesizing a copper-silver alloy according to claim 1, wherein the copper-silver ink further contains a dispersion medium.

### Claim 4 (depends on 1)

The method for synthesizing a copper-silver alloy according to claim 1, comprising a preheating step of performing preheating at 25° C. or higher and lower than 70° ° C. for 0 minute to 10 minutes, after the coating step and before the crystal nucleus formation step.

### Claim 5 (depends on 1)

The method for synthesizing a copper-silver alloy according to claim 1, wherein the ink preparation step comprises the steps of:
mixing the amine-based solvent and the copper salt particle to prepare a solution, and
mixing the solution and the silver salt particle to prepare the copper-silver ink.

### Claim 6 (depends on 1)

The method for synthesizing a copper-silver alloy according to claim 1, wherein the energy density of the pulsed light is 0.5 J/cm2 to 4.0 J/cm2.

### Claim 7 (depends on 1)

The method for synthesizing a copper-silver alloy according to claim 1, wherein the crystal nucleus of copper and the crystal nucleus of silver diffuse and grow to synthesize the copper-silver alloy in the crystal nucleus synthesis step.

### Claim 8 (depends on 1)

The method for synthesizing a copper-silver alloy according to claim 1, wherein the irradiation time is from 1 μs to 1 s.

### Claim 9 (depends on 1)

A method for forming a conduction part, comprising the method for synthesizing a copper-silver alloy according to claim 1.