# US 12,118,726 B2 · Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,118,726 B2 - Document ID: US12118726B2 - Status: Granted - Kind: B2 - Application number: 17/575,705 - Filed: 2022-01-14 - Published: 2022-07-21 - Granted: 2024-10-15 - Earliest claimed: 2021-01-15 - Assignees: Kulicke and Soffa Industries, Inc. - Applicants: Kulicke and Soffa Industries, Inc. - Inventors: Peter Julius Klaerner - Web page: https://patentgrep.com/patent/US12118726B2 ## CPC - G06T 7/0006: {using a design-rule based approach} - G06T 7/0014: {using an image reference approach} - G06V 10/141: Control of illumination - G06V 10/74: Image or video pattern matching; Proximity measures in feature spaces - G06V 20/60: Type of objects - G06T 2207/10152: Varying illumination - G06T 2207/30141: Printed circuit board [PCB] - G06T 2207/30148: Semiconductor; IC; Wafer - G06T 2207/30168: Image quality inspection - G06V 2201/06: Recognition of objects for industrial automation - G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL - G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING ## Abstract A method of operating a pattern recognition system of an electronic device packaging machine is provided. The method includes the steps of: (a) imaging a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe; (b) utilizing a pattern recognition recipe in connection with an image from step (a) to determine if an acceptable level of matching occurs; and (c) automatically varying at least one parameter of at least one of (i) the image acquisition recipe and (ii) the pattern recognition recipe if the acceptable level of matching does not occur in step (b). ## Claims ### Claim 1 A method of operating a pattern recognition system of a wire bonding machine, the method comprising the steps of: (a) imaging a portion of a workpiece on the wire bonding machine using an image acquisition recipe, the portion of the workpiece including a fiducial marking of the workpiece, the image acquisition recipe including a plurality of parameters related to an imaging system of the pattern recognition system, the plurality of parameters including at least one of (i) one or more lighting parameters of the imaging system, (ii) one or more optical parameters of the imaging system, (iii) one or more position parameters of the imaging system, and (iv) one or more component parameters related to the imaging system; (b) utilizing a pattern recognition recipe in connection with an image from step (a) to determine if an acceptable level of matching occurs in connection with the fiducial marking of the workpiece to determine if a wire bonding operation may proceed, wherein the acceptable level of matching is determined by comparing a pattern from an acquired image taken by the imaging system with a reference pattern; (c) automatically varying at least one parameter of the image acquisition recipe if the acceptable level of matching does not occur in step (b); (d) repeating steps (a)-(c), using a new image acquisition recipe including the at least one parameter that was automatically varied, until an acceptable level of matching occurs in step (b); and (e) saving the new image acquisition recipe into memory if step (b) results in an acceptable level of matching. ### Claim 2 (depends on 1) The method of claim 1 wherein the pattern recognition system includes a control system for controlling the imaging system, and a computer. ### Claim 3 (depends on 1) The method of claim 1 wherein the one or more lighting parameters includes at least one of brightness of illumination, exposure time, camera gain, and light color. ### Claim 4 (depends on 2) The method of claim 2 wherein the pattern recognition recipe includes a plurality of image processing parameters used in connection with step (b). ### Claim 5 (depends on 4) The method of claim 4 wherein the plurality of image processing parameters includes at least one of image filtering parameters, image resolution parameters, parameters related to pattern matching, and parameters related to determining a level of matching in connection with step (b). ### Claim 6 (depends on 1) The method of claim 1 wherein the varying of the at least one parameter in step (c) results in the new image acquisition recipe. ### Claim 7 (depends on 1) The method of claim 1 wherein the pattern recognition recipe and the image acquisition recipe are included in a library, the library including a plurality of recipes stored in memory in connection with the wire bonding machine. ### Claim 8 (depends on 7) The method of claim 7 wherein, if an acceptable level of matching does not occur based on step (b), another one of the plurality of recipes stored in memory is selected, and steps (a) and (b) are repeated using the another of the plurality of recipes prior to step (c). ### Claim 9 A pattern recognition system of a wire bonding machine, the pattern recognition system comprising: an imaging system for imaging a portion of a workpiece on the wire bonding machine using an image acquisition recipe, the portion of the workpiece including a fiducial marking of the workpiece, the image acquisition recipe including a plurality of parameters related to the imaging system of the pattern recognition system, the plurality of parameters including at least one of (i) one or more lighting parameters of the imaging system, (ii) one or more optical parameters of the imaging system, (iii) one or more position parameters of the imaging system, and (iv) one or more component parameters related to the imaging system; a control system for controlling the imaging system; and a computer configured to utilize a pattern recognition recipe in connection with an image from the imaging system to determine if an acceptable level of matching occurs in connection with the fiducial marking of the workpiece to determine if a wire bonding operation may proceed, wherein the acceptable level of matching is determined by comparing a pattern from an acquired image taken by the imaging system with a reference pattern, the computer varying at least one parameter of the image acquisition recipe if the acceptable level of matching does not occur, the varying of the at least one parameter by the computer resulting in a new image acquisition recipe, the computer further configured to repeat imaging of the portion of the workpiece using the new image acquisition recipes until an acceptable level of matching occurs, the computer further configured to save the new image acquisition recipe that results in the acceptable level of matching into memory. ### Claim 10 (depends on 9) The pattern recognition system of claim 9 wherein the one or more lighting parameters includes at least one of brightness of illumination, exposure time, camera gain, and light color. ### Claim 11 (depends on 9) The pattern recognition system of claim 9 wherein the pattern recognition recipe includes a plurality of image processing parameters. ### Claim 12 (depends on 9) The pattern recognition system of claim 9 wherein the imaging of the portion of the workpiece and the utilizing of the pattern recognition recipe by the computer are repeated until the computer determines that an acceptable level of matching occurs. ### Claim 13 (depends on 9) The pattern recognition system of claim 9 wherein at least one of the image acquisition recipe and the pattern recognition recipe is one of a plurality of recipes stored in memory in connection with the pattern recognition system. ### Claim 14 (depends on 13) The pattern recognition system of claim 13 wherein, if an acceptable level of matching does not occur, another one of the plurality of recipes stored in memory is selected, and the imaging of the portion of the workpiece and the utilizing of the pattern recognition recipe by the computer are repeated using the another of the plurality of recipes. ### Claim 15 A wire bonding system comprising: a support structure for supporting a workpiece during a wire bonding operation; a bond head assembly carrying a wire bonding tool; and a pattern recognition system including (i) an imaging system for imaging a portion of the workpiece using an image acquisition recipe, the portion of the workpiece including a fiducial marking of the workpiece, the image acquisition recipe including a plurality of parameters related to the imaging system of the pattern recognition system, the plurality of parameters including at least one of (a) one or more lighting parameters of the imaging system, (b) one or more optical parameters of the imaging system, (c) one or more position parameters of the imagining system, and (d) one or more component parameters related to the imaging system, (ii) a control system for controlling the imaging system, and (iii) a computer configured to utilize a pattern recognition recipe in connection with an image from the imaging system to determine if an acceptable level of matching occurs in connection with the fiducial marking on the workpiece to determine if the wire bonding operation may proceed, wherein the acceptable level of matching is determined by comparing a pattern from an acquired image taken by the imaging system with a reference pattern, the computer varying at least one parameter of the image acquisition recipe if the acceptable level of matching does not occur, the varying of the at least one parameter by the computer resulting in a new image acquisition recipe, the computer further configured to repeat imaging of the portion of the workpiece using the new image acquisition recipes until an acceptable level of matching occurs, the computer further configured to save the new image acquisition recipe that results in the acceptable level of matching into memory. ### Claim 16 A method of operating a pattern recognition system of a wire bonding machine, the method comprising the steps of: (a) imaging a portion of a workpiece on the wire bonding machine using an image acquisition recipe, the portion of the workpiece including a fiducial marking of the workpiece, the image acquisition recipe including a plurality of parameters related to an imaging system of the pattern recognition system, the plurality of parameters including at least one of (i) one or more lighting parameters of the imaging system, (ii) one or more optical parameters of the imaging system, (iii) one or more position parameters of the imaging system, and (iv) one or more component parameters related to the imaging system; and (b) utilizing a pattern recognition recipe in connection with an image from step (a) to determine if an acceptable level of matching occurs in connection with the fiducial marking on the workpiece to determine if a wire bonding operation may proceed, wherein the acceptable level of matching is determined by comparing a pattern from an acquired image taken by the imaging system with a reference pattern, wherein each of the image acquisition recipe and the pattern recognition recipe is one of a plurality of recipes stored in memory in connection with the wire bonding machine, and the image acquisition recipe is automatically selected to be used in step (a) in an order based on prioritization criteria. ### Claim 17 (depends on 16) The method of claim 16 further comprising the step of automatically varying at least one parameter of the image acquisition recipe if the acceptable level of matching does not occur in step (b). ### Claim 18 (depends on 16) The method of claim 16 wherein if the acceptable level of matching does not occur in step (b), a selection is made to (i) repeat steps (a)-(b) with another of the plurality of recipes, or (ii) automatically vary at least one parameter of the image acquisition recipe.