# US 12,118,364 B2 · Touch sensing integrated circuit system, touch sensing system, and method for writing firmware > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,118,364 B2 - Document ID: US12118364B2 - Status: Granted - Kind: B2 - Application number: 18/297,313 - Filed: 2023-04-07 - Published: 2023-08-10 - Granted: 2024-10-15 - Earliest claimed: 2019-12-16 - Assignees: Silicon Works Co., Ltd. - Applicants: Silicon Works Co., Ltd. - Inventors: Gyu Chul Lee - Web page: https://patentgrep.com/patent/US12118364B2 ## CPC - G06F 9/4403: {Processor initialisation} - G06F 8/61: Installation - G06F 3/0416: {Control or interface arrangements specially adapted for digitisers} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract An embodiment is able to simplify the design and manufacturing process by unifying the step of writing boot loaders to the integrated circuits. ## Claims ### Claim 1 A touch sensing integrated circuit system comprising: a first nonvolatile memory configured to store a common boot loader which is capable of performing a master function and a slave function; a second nonvolatile memory configured to store the common boot loader which is capable of performing the master function and the slave function; a first integrated circuit configured to configure the common boot loader as a first boot loader to operate as a master based on a first external signal; and a second integrated circuit configured to configure the common boot loader as a second boot loader to operate as a slave based on a second external signal, wherein the first boot loader is configured to download a first firmware to operate as the master, and the first firmware is stored in the first nonvolatile memory together with the first boot loader operating as the master, and wherein the second boot loader is configured to download a second firmware to operate as the slave, and the second firmware is stored in the second nonvolatile memory together with the second boot loader operating as the slave. ### Claim 2 (depends on 1) The touch sensing integrated circuit system of claim 1, wherein the first integrated circuit and the second integrated circuit are microcontroller units (MCUs). ### Claim 3 (depends on 1) The touch sensing integrated circuit system of claim 1, wherein the first integrated circuit is configured to receive data on touch sensing from the second integrated circuit and to transmit data on touch coordinates to a host using the data on the touch sensing. ### Claim 4 (depends on 3) The touch sensing integrated circuit system of claim 3, wherein the first integrated circuit and the second integrated circuit are configured to generate data on touch sensing for different areas in a touch panel. ### Claim 5 (depends on 1) The touch sensing integrated circuit system of claim 1, wherein the first external signal and the second external signal are configured to be received from a host. ### Claim 6 (depends on 1) The touch sensing integrated circuit system of claim 1, wherein the common boot loader comprises identification data in a binary form indicating characteristics. ### Claim 7 (depends on 6) The touch sensing integrated circuit system of claim 6, wherein the common boot loader configured as the master and the common boot loader configured as the slave comprise same identification data. ### Claim 8 (depends on 3) The touch sensing integrated circuit system of claim 3, wherein the first integrated circuit is configured to download the first firmware from the host, and the second integrated circuit is configured to download the second firmware from the host. ### Claim 9 A touch sensing integrated circuit system comprising: a first integrated circuit configured to configure a common boot loader as a first boot loader to operate as a master based on a first external signal, wherein the common boot loader is capable of performing a master function and a slave function; a second integrated circuit configured to configure the common boot loader as a second boot loader to operate as a slave based on a second external signal; and a nonvolatile memory configured to store the common boot loader capable of performing the master function and the slave function and; another nonvolatile memory configured to store the common boot loader capable of performing the master function and the slave function, wherein the first boot loader is configured to download a first firmware to operate as the master based on the first external signal, and wherein the second boot loader is configured to download a second firmware to operate as the slave based on the second external signal, wherein the first firmware is configured to be stored in said another nonvolatile memory together with the first boot loader operating as the master, and wherein the second firmware is configured to be stored in the nonvolatile memory together with the second boot loader operating as the slave. ### Claim 10 (depends on 9) The touch sensing integrated circuit system of claim 9, wherein the first integrated circuit is configured to receive data on touch sensing from the second integrated circuit and to transmit data on touch coordinates to a host using the data on the touch sensing. ### Claim 11 (depends on 9) The touch sensing integrated circuit system of claim 9, wherein the common boot loader comprises identification data in a binary form indicating characteristics. ### Claim 12 (depends on 9) The touch sensing integrated circuit system of claim 9, wherein the common boot loader configured as the master and the common boot loader configured as the slave comprise same identification data. ### Claim 13 A touch sensing integrated circuit system comprising: a first nonvolatile memory configured to store a common boot loader which is capable of performing a master function and a slave function; a second nonvolatile memory configured to store the common boot loader which is capable of performing the master function and the slave function; a first integrated circuit configured to configure the common boot loader as a master boot loader to operate as a master; and a second integrated circuit configured to configure the common boot loader as a second boot loader to operate as a slave, wherein the master boot loader is configured to operate as the master based on an external signal and the second boot loader is configured to operate as the slave, wherein the master boot loader is configured to download a first firmware to operate as the master, wherein the second boot loader is configured to download a second firmware to operate as the slave, wherein the first firmware is configured to be stored in the first nonvolatile memory together with the master boot loader operating as the master, and wherein the second firmware is configured to be stored in the second nonvolatile memory together with the second boot loader operating as the slave. ### Claim 14 (depends on 13) The touch sensing integrated circuit system of claim 13, wherein the first integrated circuit is configured to receive data on touch sensing from the second integrated circuit and to transmit data on touch coordinates to a host using the data on the touch sensing. ### Claim 15 (depends on 13) The touch sensing integrated circuit system of claim 13, wherein the common boot loader configured as the master and the common boot loader configured as the slave comprise same identification data.