# US 12,117,727 B2 · Metal plate for manufacturing deposition mask and manufacturing method for metal plate, and deposition mask and manufacturing method for deposition mask

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- Number: US 12,117,727 B2
- Document ID: US12117727B2
- Status: Granted
- Kind: B2
- Application number: 17/646,351
- Filed: 2021-12-29
- Published: 2022-04-21
- Granted: 2024-10-15
- Earliest claimed: 2017-11-14
- Assignees: Dai Nippon Printing Co., Ltd.
- Applicants: Dai Nippon Printing Co., Ltd.
- Inventors: Hiroki Oka; Sachiyo Matsuura; Chiaki Hatsuta; Chikao Ikenaga; Hideyuki Okamoto; Masato Ushikusa
- Web page: https://patentgrep.com/patent/US12117727B2

## CPC

- C23C 14/042: {using masks}
- C21D 1/30: Stress-relieving
- C21D 1/76: Adjusting the composition of the atmosphere
- C21D 6/001: {containing Ni (C21D6/004 takes precedence)}
- C21D 6/007: {containing Co}
- C21D 8/0236: {Cold rolling}
- C21D 8/0247: characterised by the heat treatment
- C21D 8/0278: involving a particular surface treatment (C21D8/0294 takes precedence)
- C21D 9/46: for sheet metals
- C22C 38/08: containing nickel {(C22C38/105 takes precedence)}
- C23F 1/02: Local etching
- C23F 1/28: for etching iron group metals
- C25D 1/04: Wires; Strips; Foils
- H05B 33/10: Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
- C21D 2261/00: Machining or cutting being involved
- C22C 38/105: {containing Co and Ni}
- C25D 3/562: {containing more than 50% by weight of iron or nickel or cobalt}
- H10K 59/00: Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K 71/166: {using selective deposition, e.g. using a mask}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- C21D: MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING (surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by this subclass C23F17/00; unidirectional solidification of eutectic materials or unidirectional demixing of eutectoid materials C30B)
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- C23F: NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE (working metal by laser beams B23K26/00; desurfacing by applying flames B23K7/00; working of metal by electro-erosion B23H; producing decorative effects by removing surface material, e.g. by engraving, by etching, B44C1/22; electrolytic etching or polishing C25F); INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.

## Claims

### Claim 1

A manufacturing method for a metal plate used for manufacturing a deposition mask, the method comprising:
a rolling step of rolling a base metal to obtain a metal plate that includes pits located in the surface of the metal plate as a result of the rolling step,
an inspection step of inspecting an inspection area on the surface of the metal plate, and
a modified rolling step of rolling the metal plate using adjusted rolling conditions based on results obtained from the inspection step to obtain a modified metal plate,
wherein the surface of the metal plate includes the inspection area having an area of 0.1 mm2 or more with some of the pits being located in the inspection area, and
wherein said inspection step comprises a calculation step of calculating a corrected pit volume density; and
wherein said modified rolling step includes adjusting the rolling conditions so that the corrected pit volume density of the modified metal plate is equal to or less than a first threshold of 15,000 μm3/mm2;
wherein the corrected pit volume density is calculated by dividing a corrected pit volume by the area of the inspection area;
wherein the corrected pit volume is a sum of volumes of parts of the pits located in the inspection area, said parts of the pits being a correction distance of 0.2 μm or more away from the surface in the thickness direction of the metal plate.

### Claim 2 (depends on 1)

The manufacturing method for a metal plate according to claim 1, wherein the metal plate is determined as good in the determination step when the corrected pit volume density is equal to or more than a second threshold and equal to or less than the first threshold.

### Claim 3 (depends on 2)

The manufacturing method for a metal plate according to claim 2, wherein the second threshold is 10 μm3/mm2.

### Claim 4 (depends on 1)

The manufacturing method for a metal plate according to claim 1, wherein the calculation step comprises a measurement step of measuring a depth of the pit at each position in the portion of the surface.

### Claim 5 (depends on 4)

The manufacturing method for a metal plate according to claim 4, wherein the depth of the pit is measured using a laser microscope in the measurement step.