Microelectromechanical microphone having a robust backplate
AssigneeTDK Corporation
InventorsAnton Leidl, Pirmin Rombach
Life of this patent
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Abstract
Technologies are provided for microelectromechanical microphones that can be robust to substantial pressure changes in the environment in which the micromechanical microphones operate. In some embodiments, a microelectromechanical microphone device can include a rigid plate defining multiple openings that permit passage of a pressure wave. The microelectromechanical microphone device also includes a stiffener member integrated into the rigid plate. The stiffener member causes stress to be distributed within the rigid plate in response to the pressure wave inducing deformation of the rigid plate.
Claims14
A microelectromechanical microphone device, the microphone device comprising:
- a rigid plate defining multiple openings configured to permit passage of a pressure wave;
- and
- a stiffener member integrated into the rigid plate,
- wherein the stiffener member is configured to cause stress to be distributed within the rigid plate in response to the pressure wave inducing deformation of the rigid plate,
- wherein the stiffener member is buried within the rigid plate, the stiffener member forming an interface with a portion of the rigid plate,
- wherein the stiffener member comprises one of a metal or an alloy of a first metal and a second metal, and
- wherein the alloy of the first metal and the second metal comprises AlCu.
A method comprising:
- forming a rigid plate defining multiple openings for permitting passage of a pressure wave;
- and
- integrating a stiffener member into the rigid plate,
- wherein the stiffener member is able to cause stress to be distributed within the rigid plate in response to the pressure wave inducing deformation of the rigid plate,
- wherein integrating the stiffener member into the rigid plate comprises forming the stiffener member during formation of the rigid plate,
- wherein forming the rigid plate comprises forming a first section of the rigid plate,
- wherein forming the stiffener member comprises depositing an amount of a first material onto a portion of the first section of the rigid plate,
- wherein the rigid plate comprises polycrystalline silicon, and
- wherein depositing the amount of the first material comprises depositing an oxide of silicon.
A device comprising:
- a microelectromechanical microphone device comprising:
- a rigid plate mechanically defining multiple openings configured to permit passage of a pressure wave;
- and
- a stiffener member integrated into the rigid plate, wherein the stiffener member is configured to cause stress to be distributed within the rigid plate in response to the pressure wave inducing deformation of the rigid plate, and wherein the stiffener member is buried within the rigid plate, the stiffener member forming an interface with a portion of the rigid plate;
- and
- a circuit coupled to the microelectromechanical microphone device and,
- wherein the circuit is configured to:
- receive a first signal indicative of a capacitance representative of an amplitude of the pressure wave, and
- generate a second signal representative of the amplitude of the pressure wave, and
- wherein the rigid plate comprises polycrystalline silicon, and wherein the stiffener member comprises an oxide of silicon.
Dependencies are inferred from the claim text.