# US 12,114,466 B2 · Heat pipe with in-plane heat spreader and loading mechanism > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,114,466 B2 - Document ID: US12114466B2 - Status: Granted - Kind: B2 - Application number: 17/132,477 - Filed: 2020-12-23 - Published: 2021-04-15 - Granted: 2024-10-08 - Earliest claimed: 2020-12-23 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Penchala Pratap Binni Boyina; Kathiravan D; Babu Triplicane Gopikrishnan; Prakash Kurma Raju; Deepak Sekar; Hari Shanker Thakur - Web page: https://patentgrep.com/patent/US12114466B2 ## CPC - H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps} - F28D 15/0233: {the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence)} - F28D 15/0275: {Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores} - F28D 15/04: with tubes having a capillary structure - G06F 1/203: {for portable computers, e.g. for laptops} - H10W 40/611: {Bolts or screws} - H10W 40/73: for cooling by change of state - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes. ## Claims ### Claim 1 A device comprising: one or more heat pipes thermally coupled to one or more heat sources; a heat spreader coupled to the one or more heat pipes, wherein the heat spreader is in-plane with the heat pipe; and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes, wherein the one or more loading mechanisms are in-plane with the heat spreader and the one or more heat pipes and the one or more loading mechanisms are comprised of a relatively high expansion material and of a relatively low expansion material. ### Claim 2 (depends on 1) The device of claim 1, wherein the heat spreader has a height that does not exceed a height of the one or more heat pipes. ### Claim 3 (depends on 1) The device of claim 1, wherein the one or more loading mechanisms each have a height that does not exceed a height of the one or more heat pipes. ### Claim 4 (depends on 1) The device of claim 1, wherein the heat spreader has a cut out profile that matches a profile of the one or more heat pipes and at least a portion of the one or more loading mechanisms. ### Claim 5 (depends on 1) The device of claim 1, wherein the one or more loading mechanisms are comprised of a bi-metal material. ### Claim 6 (depends on 5) The device of claim 5, wherein the bi-metal material includes copper and/or steel. ### Claim 7 A method comprising: determining a profile of one or more heat pipes; determining a profile of one or more loading mechanisms, wherein at least one of the one or more loading mechanisms are comprised of a relatively high expansion material and of a relatively low expansion material; cutting a heat spreader to include a profile that matches the profile of the one or more heat pipes; cutting the heat spreader to include a profile that at least partially matches the profile of the one or more loading mechanisms; securing the one or more heat pipes to the heat spreader; and securing the one or more loading mechanisms to at least a portion of the one or more heat pipes, wherein the one or more heat pipes, the heat spreader, and the one or more loading mechanisms are all in a same plane. ### Claim 8 (depends on 7) The method of claim 7, wherein the heat spreader has a height that does not exceed a height of the one or more heat pipes. ### Claim 9 (depends on 7) The method of claim 7, wherein the one or more loading mechanisms each have a height that does not exceed a height of the one or more heat pipes. ### Claim 10 (depends on 7) The method of claim 7, wherein the one or more loading mechanisms are comprised of a bi-metal material. ### Claim 11 (depends on 10) The method of claim 10, wherein the bi-metal material is copper and steel. ### Claim 12 An electronic device comprising: a substrate; one or more heat sources over the substrate; one or more heat pipes thermally coupled to the one or more heat sources; a heat spreader coupled to the one or more heat pipes, wherein the heat spreader is in-plane with the heat pipe; and one or more loading mechanisms comprised of a bi-metal material, wherein the one or more loading mechanisms are coupled to at least a portion of the one or more heat pipes and to the substrate, wherein the one or more loading mechanisms are in-plane with the heat spreader and the one or more heat pipes. ### Claim 13 (depends on 12) The electronic device of claim 12, wherein the heat spreader has a height that does not exceed a height of the one or more heat pipes. ### Claim 14 (depends on 12) The electronic device of claim 12, wherein the one or more loading mechanisms each have a height that does not exceed a height of the one or more heat pipes. ### Claim 15 (depends on 12) The electronic device of claim 12, wherein the heat spreader has a cut out profile that matches a profile of the one or more heat pipes and at least a portion of the one or more loading mechanisms. ### Claim 16 (depends on 12) The electronic device of claim 12, wherein the one or more loading mechanisms are comprised of a relatively high expansion material and of a relatively low expansion material. ### Claim 17 (depends on 12) The electronic device of claim 12, wherein the bi-metal material is copper and steel. ### Claim 18 (depends on 1) The device of claim 1, wherein the device is a laptop computer, a tablet, or a smartphone. ### Claim 19 (depends on 7) The method of claim 7, further comprising: securing the one or more heat pipes, the heat spreader, and the one or more loading mechanisms over a heat source in an electronic device. ### Claim 20 (depends on 12) The electronic device of claim 12, wherein the electronic device is a laptop computer, a tablet, or a smartphone.