# US 12,114,432 B2 · Electronic device and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,114,432 B2 - Document ID: US12114432B2 - Status: Granted - Kind: B2 - Application number: 17/656,491 - Filed: 2022-03-25 - Published: 2022-07-07 - Granted: 2024-10-08 - Earliest claimed: 2020-03-06 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Noboru Kato - Web page: https://patentgrep.com/patent/US12114432B2 ## CPC - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 13/046: {Surface mounting (surface mounted components H05K3/341)} - H01Q 1/2225: {used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal} - H01Q 9/26: with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength (resonant loop antennas H01Q7/00) - H01Q 9/285: {Planar dipole (H01Q9/065 takes precedence; patch antenna H01Q9/0407)} - H05K 13/0015: {Orientation; Alignment; Positioning} - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/165: {incorporating printed inductors} - H05K 2201/0969: Apertured conductors - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract An electronic device is provided with an electronic component having a base material and a terminal electrode formed on a first surface of the base material, and a circuit substrate in which a pad for mounting the electronic component is formed on a first surface. A hole for light transmission is formed in the pad, and the pad and the terminal electrode are electrically and mechanically connected to each other with a cured product of optical firing paste obtained by receiving light from a second surface that is a surface opposite to the first surface of the circuit substrate. ## Claims ### Claim 1 An electronic device comprising: an electronic component having a base material and a terminal electrode disposed on a first surface of the base material; and a circuit substrate in which a pad for mounting the electronic component is disposed on a first surface of the circuit substrate, wherein the electronic component has a through hole extending from the first surface of the base material of the electronic component to a second surface opposite the first surface of the base material, the through hole electrically connecting the terminal electrode and a conductor pattern disposed on the second surface of the base material, wherein the pad and the terminal electrode are electrically and mechanically connected to each other with a cured product of an optical firing paste that is disposed between the terminal electrode and a conductor pattern disposed on the first surface of the circuit substrate, wherein the pad is configured to prevent light from passing therethrough, and wherein the base material comprises a material that prevents light from passing therethrough. ### Claim 2 (depends on 1) The electronic device according to claim 1, wherein the cured product of the optical firing paste is obtained by receiving light from the second surface of the base material of the electronic component. ### Claim 3 (depends on 2) The electronic device according to claim 2, wherein the pad does not transmit the light that cures the optical firing paste. ### Claim 4 (depends on 3) The electronic device according to claim 3, wherein the material of the base material does not transmit the light that cures the optical firing paste. ### Claim 5 (depends on 1) The electronic device according to claim 1, wherein the terminal electrode comprises at least one hole configured for light transmission. ### Claim 6 (depends on 5) The electronic device according to claim 5, wherein the at least one hole in the terminal electrode overlaps the through hole of the electronic component in a thickness direction thereof. ### Claim 7 (depends on 1) The electronic device according to claim 1, wherein the through hole of the electronic component comprises an interlayer connection conductor. ### Claim 8 (depends on 1) The electronic device according to claim 1, further comprising an IC mounted to the conductor pattern that is disposed on the second surface of the base material. ### Claim 9 (depends on 1) The electronic device according to claim 1, further comprising a resist film disposed on the second surface of the base material for covering the conductor pattern. ### Claim 10 (depends on 9) The electronic device according to claim 9, wherein the resist film comprises at least one window constructed for light transmission. ### Claim 11 A method for manufacturing an electronic device comprising: mounting on a circuit substrate an electronic component having a base material that does not transmit an ultraviolet light, with a terminal electrode formed on a first surface of the base material; forming a through hole in the electronic component that extends from the first surface of the base material to a second surface that is opposite to the first surface, such that the through hole electrically connects the terminal electrode to a conductor pattern disposed on the second surface of the base material; forming a pad on a first surface of the circuit substrate facing the electronic component; applying an optical firing paste to the pad, such that the optical firing paste is formed between the terminal electrode and a conductor pattern disposed on the first surface of the circuit substrate; mounting the electronic component on the circuit substrate in a state where the terminal electrode of the electronic component faces the pad via the optical firing paste; and emitting an ultraviolet light from the second surface of the base material of the electronic component to cause photocuring of the optical firing paste. ### Claim 12 (depends on 11) The method according to claim 11, further comprising configuring the pad to not transmit the light that cures the optical firing paste. ### Claim 13 (depends on 11) The method according to claim 11, further comprising forming at least one hole in the terminal electrode for light transmission. ### Claim 14 (depends on 13) The method according to claim 13, further comprising aligning the at least one hole in the terminal electrode with the through hole of the electronic component in a thickness direction thereof. ### Claim 15 (depends on 11) The method according to claim 11, further comprising mounting an IC on the conductor pattern that is disposed on the second surface of the base material. ### Claim 16 (depends on 11) The method according to claim 11, further comprising forming a resist film on the second surface of the base material that covers the conductor pattern and includes at least one window constructed for light transmission.