# US 12,114,425 B2 · Cable assembly, signal transmission structure, and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,114,425 B2 - Document ID: US12114425B2 - Status: Granted - Kind: B2 - Application number: 17/942,442 - Filed: 2022-09-12 - Published: 2023-01-05 - Granted: 2024-10-08 - Earliest claimed: 2020-03-13 - Assignees: Huawei Technologies Co., Ltd. - Applicants: Huawei Technologies Co., Ltd. - Inventors: Guodong Zhang; Chong Chen; Jian Zhang; Shaoyong Xiang; Zhijun Qu; Changxing Sun - Web page: https://patentgrep.com/patent/US12114425B2 ## CPC - H05K 1/116: {Lands, clearance holes or other lay-out details concerning the surrounding of a via} - H05K 1/184: associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes - H01R 12/7076: {for connection between PCB and component, e.g. display} - H01R 12/714: {with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit} - H01R 13/24: resilient; resiliently-mounted - H05K 1/112: {directly combined with via connections} - H05K 1/181: associated with surface mounted components - H05K 2201/09509: Blind vias, i.e. vias having one side closed - H05K 2201/10356: Cables - H05K 2201/10901: Lead partly inserted in hole or via - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS ## Abstract A signal transmission structure includes a circuit board, a chip, and a cable assembly. The chip is assembled on one side of the circuit board, and the cable assembly is assembled on the other side of the circuit board. The cable assembly includes a cable, and the circuit board includes a plurality of conductive holes. The chip is electrically connected to the cable of the cable assembly using the conductive hole to transmit a signal of the chip using the cable. ## Claims ### Claim 1 A signal transmission structure comprising: a circuit board comprising: a plurality of conductive holes; a first side comprising a first surface; and a second side comprising a second surface; a chip assembled on the first surface and electrically coupled to each of the conductive holes, wherein the second side is away from the chip; and a cable assembly that is assembled on the second surface, that is configured to implement signal transmission with the chip, and that comprises: a plurality of cables that is electrically coupled to the conductive holes; a base comprising a third surface comprising one or more conductive parts configured to be grounded; and a plurality of cable units installed on the base, wherein each of the cable units comprises a grounding part electrically coupled to the one or more conductive parts, and wherein the chip further comprises a ground pin electrically coupled to the one or more conductive parts using a corresponding one of the conductive holes. ### Claim 2 (depends on 1) The signal transmission structure of claim 1, wherein the circuit board further comprises: a first pad electrically coupled to the chip and to a first end of a first conductive hole of the conductive holes; and a second pad electrically coupled to one of the cables and to a second end of the first conductive hole. ### Claim 3 (depends on 1) The signal transmission structure of claim 1, wherein each of the cable units further comprises: a signal connection terminal; and one of the cables electrically coupled to the signal connection terminal, and wherein the chip further comprises a signal pin electrically coupled to the signal connection terminal using the corresponding one of the conductive holes. ### Claim 4 (depends on 3) The signal transmission structure of claim 3, wherein a first arrangement density of the cable units on the base matches a second arrangement density of signal pins of the chip. ### Claim 5 (depends on 1) The signal transmission structure of claim 1, wherein the base is a metal base, and wherein the one or more conductive parts are at least a part of a region of the base. ### Claim 6 (depends on 1) The signal transmission structure of claim 1, wherein the base is an insulator, and wherein the one or more conductive parts are a metal plate that is fastened on the base and that comprises a compressible contact that is electrically coupled to the ground pin. ### Claim 7 (depends on 1) The signal transmission structure of claim 1, wherein each of the cable units further comprises a cable fastening head configured to fasten each of the cable units on the base. ### Claim 8 A device comprising: a signal transmission structure comprising: a circuit board comprising: a plurality of conductive holes; a first side comprising a first surface; and a second side comprising a second surface; a chip assembled on the first surface and electrically coupled to each of the conductive holes, wherein the second side is away from the chip; and a cable assembly that is assembled on the second surface, that is configured to implement signal transmission with the chip, and that comprises: a plurality of cables that is electrically coupled to the conductive holes; a base comprising a third surface comprising one or more conductive parts configured to be grounded; and a plurality of cable units installed on the base, wherein each of the cable units comprises a grounding part electrically coupled to the one or more conductive parts, and wherein the chip further comprises a ground pin electrically coupled to the one or more conductive parts using a corresponding one of the conductive holes. ### Claim 9 A cable assembly comprising: a base comprising a first surface comprising one or more conductive parts configured to be grounded; and a plurality of cable units installed on the base, wherein each of the cable units comprises: a cable; and a grounding part electrically coupled to the one or more conductive parts, wherein the one or more conductive parts are configured to be electrically coupled to a ground pin of a chip through a conductive hole on a circuit board. ### Claim 10 (depends on 9) The cable assembly of claim 9, wherein the cable comprises at least two signal wires, and wherein each of the cable units further comprises: a signal connection terminal, wherein each of the at least two signal wires is coupled to the signal connection terminal in a one-to-one manner; and a cable fastening head fastened on the base and disposed at a location at which each of the at least two signal wires is coupled to the signal connection terminal. ### Claim 11 (depends on 9) The cable assembly of claim 9, wherein the cable units are configured to couple to a plurality of signal pins of the chip in a one-to-one manner using the conductive hole on the circuit board, and wherein a first arrangement density of the cable units matches a second arrangement density of the signal pins. ### Claim 12 (depends on 9) The cable assembly of claim 9, wherein the base is a metal base, and wherein the one or more conductive parts are at least a part of a region of the base. ### Claim 13 (depends on 9) The cable assembly of claim 9, wherein the base is an insulator, and wherein the one or more conductive parts are a metal plate that is fastened on the base and that comprises a compressible contact that is configured to be electrically coupled to the ground pin of the chip. ### Claim 14 (depends on 9) The cable assembly of claim 9, wherein the base comprises at least two splicing parts. ### Claim 15 (depends on 9) The cable assembly of claim 9, wherein the base is an insulator, and wherein the one or more conductive parts are fastened on the first surface. ### Claim 16 (depends on 1) The signal transmission structure of claim 1, wherein the circuit board further comprises: a first pad electrically coupled to the chip and a corresponding one of the conductive holes; a second pad electrically coupled to one of the cables; and a wire located inside the circuit board, coupled to the corresponding one of the conductive holes, and electrically coupled to the second pad. ### Claim 17 (depends on 1) The signal transmission structure of claim 1, wherein the circuit board further comprises: a first pad electrically coupled to the chip; a second pad electrically coupled to one of the cables and a corresponding one of the conductive holes; and a wire located inside the circuit board, coupled to the corresponding one of the conductive holes, and electrically coupled to the first pad. ### Claim 18 (depends on 1) The signal transmission structure of claim 1, wherein the base is an insulator, and wherein the one or more conductive parts are fastened on the third surface. ### Claim 19 (depends on 8) The device of claim 8, wherein the circuit board further comprises: a first pad electrically coupled to the chip and to a first end of a first conductive hole of the conductive holes; and a second pad electrically coupled to one of the cables and to a second end of the first conductive hole. ### Claim 20 (depends on 8) The device of claim 8, wherein each of the cable units further comprises: a signal connection terminal; and one of the cables electrically coupled to the signal connection terminal, and wherein the chip further comprises a signal pin electrically coupled to the signal connection terminal using the corresponding one of the conductive holes.