# US 12,113,508 B2 · Resonator device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,113,508 B2 - Document ID: US12113508B2 - Status: Granted - Kind: B2 - Application number: 17/545,092 - Filed: 2021-12-08 - Published: 2022-06-09 - Granted: 2024-10-08 - Earliest claimed: 2020-12-09 - Assignees: Seiko Epson Corporation - Applicants: Seiko Epson Corporation - Inventors: Masahiro Fujii; Tomoyuki Kamakura - Web page: https://patentgrep.com/patent/US12113508B2 ## CPC - H03H 9/02102: {of temperature influence (cutting angles H03H9/02015)} - H03H 9/1021: {the BAW device being of the cantilever type} - H03H 3/02: for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) - H03H 9/02047: {Treatment of substrates} - H03H 9/0519: {for cantilever (H03H9/1021 takes precedence)} - H03H 9/0547: {consisting of a vertical arrangement (H03H9/0566 takes precedence)} - H03H 9/125: Driving means, e.g. electrodes, coils - H03H 2003/022: {the resonators or networks being of the cantilever type} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) ## Abstract A resonator device includes: a resonator element that has a first surface on which a first mount electrode and a second mount electrode are disposed, and a second surface; a base that has a third surface which faces the first surface of the resonator element and on which a first base electrode and a second base electrode are disposed; a lid that has a fourth surface which faces the second surface of the resonator element; a first metal bump by which the first mount electrode and the first base electrode are bonded; a second metal bump by which the second mount electrode and the second base electrode are bonded; and a bonding member by which the second surface and the fourth surface are bonded. A loss tangent of the bonding member is larger than a loss tangent of the first metal bump and the second metal bump. ## Claims ### Claim 1 A resonator device, comprising: a resonator element that includes an excitation electrode, and that has a first surface on which a first mount electrode and a second mount electrode electrically coupled to the excitation electrode are disposed, and a second surface in a front-back relationship with the first surface; a base that has a third surface which faces the first surface of the resonator element and on which a first base electrode and a second base electrode are disposed; a lid that has a fourth surface which faces the second surface of the resonator element, and that is bonded to the base so as to accommodate the resonator element; a first metal bump by which the first mount electrode and the first base electrode are bonded and electrically coupled; a second metal bump by which the second mount electrode and the second base electrode are bonded and electrically coupled; and a bonding member by which the second surface and the fourth surface are bonded, wherein a loss tangent of the bonding member at a room temperature is larger than a loss tangent of the first metal bump and the second metal bump at the room temperature. ### Claim 2 (depends on 1) The resonator device according to claim 1, wherein the bonding member is a resin bump. ### Claim 3 (depends on 1) The resonator device according to claim 1, wherein the bonding member includes a first bonding member and a second bonding member, and the first bonding member and the second bonding member are disposed on inner sides with respect to the first metal bump and the second metal bump in a direction in which the first metal bump and the second metal bump are disposed. ### Claim 4 (depends on 3) The resonator device according to claim 3, wherein the first bonding member and the second bonding member are disposed such that at least a part thereof overlaps a line segment coupling a center of the first metal bump and a center of the second metal bump in a plan view from a direction orthogonal to the third surface. ### Claim 5 (depends on 4) The resonator device according to claim 4, wherein a center of the first bonding member and a center of the second bonding member are disposed so as to overlap the line segment coupling the center of the first metal bump and the center of the second metal bump in the plan view. ### Claim 6 (depends on 3) The resonator device according to claim 3, wherein in a plan view from a direction orthogonal to the third surface, the first bonding member and the second bonding member are disposed line-symmetrically with respect to a virtual center line which is orthogonal to a line segment coupling a center of the first metal bump and a center of the second metal bump and which equally divides the line segment. ### Claim 7 (depends on 1) The resonator device according to claim 1, wherein the bonding member is bonded to the second surface via a first metal layer. ### Claim 8 (depends on 7) The resonator device according to claim 7, wherein the first metal layer covers the bonding member and the fourth surface. ### Claim 9 (depends on 7) The resonator device according to claim 7, wherein the first metal layer contains gold. ### Claim 10 (depends on 7) The resonator device according to claim 7, wherein the lid is bonded to the base via a second metal layer containing gold. ### Claim 11 (depends on 10) The resonator device according to claim 10, wherein the first metal layer and the second metal layer are electrically coupled. ### Claim 12 (depends on 1) The resonator device according to claim 1 further comprising: an oscillation circuit formed on the base, wherein the excitation electrode and the oscillation circuit are electrically coupled via the first metal bump and the second metal bump.