# US 12,113,482 B2 · Amplifier device packages incorporating internal couplers > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,113,482 B2 - Document ID: US12113482B2 - Status: Granted - Kind: B2 - Application number: 17/518,883 - Filed: 2021-11-04 - Published: 2023-05-04 - Granted: 2024-10-08 - Earliest claimed: 2021-11-04 - Assignees: MACOM Technology Solutions Holdings, Inc. - Applicants: MACOM Technology Solutions Holdings, Inc. - Inventors: Kenneth Brewer - Web page: https://patentgrep.com/patent/US12113482B2 ## CPC - H03F 1/0205: {in transistor amplifiers} - H03F 1/0288: {using a main and one or several auxiliary peaking amplifiers whereby the load is connected to the main amplifier using an impedance inverter, e.g. Doherty amplifiers} - H03F 3/195: in integrated circuits - H03F 3/211: {using a combination of several amplifiers (H03F3/60 takes precedence)} - H03F 3/245: {with semiconductor devices only} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 76/134: having other interconnections parallel to the conductive base - H10W 90/00: Package configurations - H03F 2200/192: A hybrid coupler being used at the input of an amplifier circuit - H03F 2200/198: A hybrid coupler being used as coupling circuit between stages of an amplifier circuit - H03F 2200/204: A hybrid coupler being used at the output of an amplifier circuit - H03F 2200/451: the amplifier being a radio frequency amplifier - H10W 44/234: {Arrangements for impedance matching} - H03F: AMPLIFIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An amplifier package includes a plurality of input leads, a plurality of transistor amplifiers having inputs respectively coupled to one of the plurality of input leads, and a quadrature hybrid coupler within the amplifier package and coupled between the plurality of input leads and the plurality of transistor amplifiers, wherein the quadrature hybrid coupler is configured to divide an input signal received from a first of the plurality of input leads between the plurality of transistor amplifiers. ## Claims ### Claim 1 An amplifier package comprising: a plurality of input leads; a plurality of transistor amplifiers having inputs respectively coupled to one of the plurality of input leads; and a quadrature hybrid coupler within the amplifier package and coupled between the plurality of input leads and the plurality of transistor amplifiers, wherein the quadrature hybrid coupler is configured to divide an input signal received from a first of the plurality of input leads between the plurality of transistor amplifiers, wherein the quadrature hybrid coupler comprises a plurality of ports, and wherein none of the ports of the quadrature hybrid coupler are terminated within the amplifier package. ### Claim 2 (depends on 1) The amplifier package of claim 1, wherein the amplifier package comprises an overmold plastic (OMP) package. ### Claim 3 (depends on 1) The amplifier package of claim 1, further comprising a submount, wherein the plurality of transistor amplifiers and the quadrature hybrid coupler are on the submount. ### Claim 4 (depends on 1) The amplifier package of claim 1, wherein a first port of the plurality of ports is coupled to the first of the plurality of input leads and a second port of the plurality of ports is coupled to a second of the plurality of input leads. ### Claim 5 (depends on 4) The amplifier package of claim 4, wherein the second port of the plurality of ports is an isolated port of the quadrature hybrid coupler. ### Claim 6 (depends on 1) The amplifier package of claim 1, further comprising an input prematch circuit between the quadrature hybrid coupler and a first transistor amplifier of the plurality of transistor amplifiers. ### Claim 7 (depends on 1) The amplifier package of claim 1, wherein the quadrature hybrid coupler is a first quadrature hybrid coupler, and wherein the amplifier package further comprises: a plurality of output leads; and a second quadrature hybrid coupler within the amplifier package and coupled between the plurality of output leads and the plurality of transistor amplifiers, wherein the second quadrature hybrid coupler is configured to combine an output signal received from the plurality of transistor amplifiers. ### Claim 8 (depends on 7) The amplifier package of claim 7, wherein the second quadrature hybrid coupler comprises a plurality of ports, and wherein a first port of the plurality of ports is coupled to the first of the plurality of output leads and a second port of the plurality of ports is coupled to a second of the plurality of output leads. ### Claim 9 (depends on 1) The amplifier package of claim 1, wherein the quadrature hybrid coupler is a first quadrature hybrid coupler, and wherein the amplifier package further comprises: a second quadrature hybrid coupler within the amplifier package and coupled between the first quadrature hybrid coupler and a subset of the plurality of transistor amplifiers, wherein the second quadrature hybrid coupler is configured to divide an output signal received from the first quadrature hybrid coupler between the subset of the plurality of transistor amplifiers. ### Claim 10 An amplifier package comprising: a first input lead and a second input lead; a submount; a first transistor amplifier and a second transistor amplifier on the submount; and a quadrature hybrid coupler on the submount, the quadrature hybrid coupler comprising an input port, a first output port, a second output port, and an isolated port, wherein the input port is coupled to the first input lead, the isolated port is coupled to the second input lead, the first output port is coupled to the first transistor amplifier, and the second output port is coupled to the second transistor amplifier, and wherein the isolated port is terminated by a characteristic impedance that is external to the amplifier package. ### Claim 11 (depends on 10) The amplifier package of claim 10, further comprising an input prematch circuit between the first output port of the quadrature hybrid coupler and the first transistor amplifier. ### Claim 12 (depends on 10) The amplifier package of claim 10, wherein the quadrature hybrid coupler is a first quadrature hybrid coupler and the characteristic impedance is a first characteristic impedance, and wherein the amplifier package further comprises: a first output lead and a second output lead; and a second quadrature hybrid coupler on the submount, the second quadrature hybrid coupler comprising a first input port, a second input port, an output port, and an isolated port, wherein the first input port of the second quadrature hybrid coupler is coupled to the first transistor amplifier, the second input port of the second quadrature hybrid coupler is coupled to the second transistor amplifier, the isolated port of the second quadrature hybrid coupler is coupled to the first output lead, and the output port of the second quadrature hybrid coupler is coupled to the first output lead, and wherein the isolated port of the second quadrature hybrid coupler is terminated by a second characteristic impedance that is external to the amplifier package. ### Claim 13 (depends on 12) The amplifier package of claim 12, further comprising an output prematch circuit between the first input port of the second quadrature hybrid coupler and the first transistor amplifier, wherein the first characteristic impedance has a value of less than 50 ohms. ### Claim 14 (depends on 10) The amplifier package of claim 10, wherein the quadrature hybrid coupler is a first quadrature hybrid coupler, wherein the first transistor amplifier is a plurality of first transistor amplifiers, and wherein the amplifier package further comprises: a second quadrature hybrid coupler within the amplifier package and coupled between the first quadrature hybrid coupler and the plurality of first transistor amplifiers, wherein the second quadrature hybrid coupler is configured to divide an output signal received from the first quadrature hybrid coupler between respective ones of the plurality of first transistor amplifiers. ### Claim 15 (depends on 10) The amplifier package of claim 10, wherein the amplifier package comprises an overmold plastic (OMP) package in which an overmold material at least partially encapsulates the first transistor amplifier, the second transistor amplifier, and the quadrature hybrid coupler. ### Claim 16 (depends on 10) The amplifier package of claim 10, wherein the isolated port is configured to output signal reflections from the first output port and the second output port. ### Claim 17 An amplifier package coupled to an external characteristic impedance, the amplifier package comprising: a plurality of input leads and a plurality of output leads; a plurality of transistor amplifiers internal to the amplifier package; and a plurality of quadrature hybrid couplers internal to the amplifier package and coupled to the plurality of transistor amplifiers, each of the plurality of quadrature hybrid couplers comprising an isolated port coupled to one of the plurality of input leads or one of the plurality of output leads, wherein the one of the plurality of input leads or the one of the plurality of output leads is coupled between the isolated port and the external characteristic impedance. ### Claim 18 (depends on 17) The amplifier package of claim 17, wherein the amplifier package comprises an overmold plastic (OMP) package. ### Claim 19 (depends on 17) The amplifier package of claim 17, further comprising a submount, wherein the plurality of transistor amplifiers and the plurality of quadrature hybrid couplers are on the submount. ### Claim 20 (depends on 17) The amplifier package of claim 17, wherein the plurality of quadrature hybrid couplers comprises a first quadrature hybrid coupler and a second quadrature hybrid coupler, each comprising a plurality of ports, wherein a first port of the plurality of ports of the first quadrature hybrid coupler is coupled to the one of the plurality of input leads and a second port of the plurality of ports of the first quadrature hybrid coupler is coupled to another one of the plurality of input leads, and wherein a first port of the plurality of ports of the second quadrature hybrid coupler is coupled to the one of the plurality of output leads and a second port of the plurality of ports of the second quadrature hybrid coupler is coupled to another one of the plurality of output leads. ### Claim 21 (depends on 20) The amplifier package of claim 20, wherein the second port of the plurality of ports of the first and second quadrature hybrid coupler is an isolated port. ### Claim 22 (depends on 20) The amplifier package of claim 20, further comprising: an input prematch circuit between the first quadrature hybrid coupler and a first transistor amplifier of the plurality of transistor amplifiers; and an output prematch circuit between the second quadrature hybrid coupler and the first transistor amplifier of the plurality of transistor amplifiers.