# US 12,113,303 B2 · Electronic device comprising radio frequency cable

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- Number: US 12,113,303 B2
- Document ID: US12113303B2
- Status: Granted
- Kind: B2
- Application number: 18/073,081
- Filed: 2022-12-01
- Published: 2023-04-27
- Granted: 2024-10-08
- Earliest claimed: 2021-10-27
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Minseok Kim; Bumhee Bae; Jongwan Shim; Jeongnam Cheon
- Web page: https://patentgrep.com/patent/US12113303B2

## CPC

- H01Q 9/0414: {in a stacked or folded configuration}
- H01P 3/121: {integrated in a substrate}
- H01Q 9/045: {with particular feeding means (for circular polarisation H01Q9/0428)}
- H01Q 9/0478: {with means for suppressing spurious modes, e.g. cross polarisation}
- H01Q 21/08: the units being spaced along or adjacent to a rectilinear path {(waveguide fed H01Q21/0037)}
- H01Q 21/28: Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)}
- H01Q 1/243: {with built-in antennas}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)

## Abstract

An electronic device is provided. The electronic device includes a millimeter wave (mmWave) antenna including a plurality of conductive patches, a wireless communication circuit, and a radio frequency (RF) cable electrically connecting the mmWave antenna to the wireless communication circuit. A first portion of the RF cable includes a base dielectric, a metal plate disposed on one surface of the base dielectric, and a shielding film including a first region in contact with the metal plate, a second region spaced apart from the metal plate by a first height, and a third region configured to connect the first region and the second region, at least one waveguide is formed by the second region, the third region, and a portion of the metal plate, and the wireless communication circuit transmits and/or receives RF signals corresponding to the plurality of conductive patches through the at least one waveguide.

## Claims

### Claim 1

An electronic device comprising:
a millimeter wave (mmWave) antenna comprising a plurality of conductive patches;
a wireless communication circuit disposed inside the electronic device; and
a radio frequency (RF) cable electrically connecting the mmWave antenna to the wireless communication circuit,
wherein a first portion of the RF cable comprises:
a base dielectric,
a metal plate disposed on the base dielectric, and
a shielding film comprising a first region in contact with the metal plate, a second region spaced apart from the metal plate, and a third region disposed between the first region and the second region,
wherein at least one waveguide is formed by the second region, the third region, and a portion of the metal plate, and
wherein the wireless communication circuit is configured to transmit or receive RF signals corresponding to the plurality of conductive patches through the at least one waveguide.

### Claim 2 (depends on 1)

The electronic device of claim 1, wherein the first portion of the RF cable further comprises at least one dielectric included in the at least one waveguide formed by the metal plate and the shielding film.

### Claim 3 (depends on 2)

The electronic device of claim 2, wherein the at least one dielectric included in the at least one waveguide comprises air.

### Claim 4 (depends on 2)

The electronic device of claim 2, wherein the at least one dielectric included in the at least one waveguide comprises a first dielectric having a first dielectric constant and a second dielectric having a second dielectric constant.

### Claim 5 (depends on 1)

The electronic device of claim 1, wherein a number of the at least one waveguide is identical to a number of the plurality of conductive patches.

### Claim 6 (depends on 1)

The electronic device of claim 1,
wherein the RF cable further comprises at least one power transmission line, and
wherein the at least one power transmission line is formed on a layer identical to the metal plate.

### Claim 7 (depends on 1)

The electronic device of claim 1,
wherein the metal plate comprises a first metal plate disposed on one side of the base dielectric and a second metal plate disposed on another side of the base dielectric opposite to the one side of the base dielectric,
wherein the shielding film further comprises a fourth region in contact with the second metal plate, a fifth region spaced apart from the second metal plate, and a sixth region disposed between the fourth region and the fifth region, and
wherein the at least one waveguide is further formed by the fifth region, the sixth region, and a portion of the second metal plate.

### Claim 8 (depends on 1)

The electronic device of claim 1,
wherein the at least one waveguide is formed in the first portion of the RF cable, and
wherein the RF cable further comprises a first connection portion connected to the wireless communication circuit and a second connection portion connected to the plurality of conductive patches.

### Claim 9 (depends on 8)

The electronic device of claim 8, wherein an RF signal transmitted through the at least one waveguide is provided, through the first connection portion, to a signal line connected to the wireless communication circuit.

### Claim 10 (depends on 8)

The electronic device of claim 8, wherein an RF signal transmitted through the at least one waveguide is provided, through the second connection portion, to a signal line connected to the plurality of conductive patches.

### Claim 11

An electronic device comprising:
a first housing;
a second housing connected to the first housing and being rotatable relative to the first housing;
a hinge structure connecting the second housing to the first housing, the second housing being rotatable about a folding axis with respect to the first housing;
a millimeter wave (mmWave) antenna comprising a plurality of conductive patches;
a wireless communication circuit disposed inside the electronic device; and
a radio frequency (RF) cable electrically connecting the mmWave antenna to the wireless communication circuit,
wherein a first portion of the RF cable, which is formed in a region of the hinge structure corresponding to the folding axis, comprises:
a base dielectric,
a metal plate disposed on the base dielectric, and
a shielding film comprising a first region in contact with the metal plate, a second region spaced apart from the metal plate, and a third region disposed between the first region and the second region,
wherein at least one waveguide is formed by the second region, the third region, and a portion of the metal plate, and
wherein the wireless communication circuit is configured to at least one of transmit or receive RF signals corresponding to the plurality of conductive patches through the RF cable in which the at least one waveguide is formed.

### Claim 12 (depends on 11)

The electronic device of claim 11, wherein the first portion of the RF cable further comprises at least one dielectric included in the at least one waveguide formed by the metal plate and the shielding film.

### Claim 13 (depends on 11)

The electronic device of claim 11, wherein a number of the at least one waveguide is identical to a number of the plurality of conductive patches.

### Claim 14 (depends on 11)

The electronic device of claim 11,
wherein the RF cable further comprises at least one power transmission line, and
wherein the at least one power transmission line is formed on a layer identical to the metal plate.

### Claim 15 (depends on 11)

The electronic device of claim 11,
wherein the metal plate comprises a first metal plate disposed on one side of the base dielectric and a second metal plate disposed on another side of the base dielectric opposite to the one side of the base dielectric,
wherein the shielding film further comprises a fourth region in contact with the second metal plate, a fifth region spaced apart from the second metal plate, and a sixth region disposed between the fourth region and the fifth region, and
wherein the at least one waveguide is further formed by the fifth region, the sixth region, and a portion of the second metal plate.

### Claim 16

An electronic device comprising:
a millimeter wave (mmWave) antenna comprising a plurality of conductive patches;
a wireless communication circuit disposed inside the electronic device; and
a radio frequency (RF) cable electrically connecting the mmWave antenna to the wireless communication circuit,
wherein a first portion of the RF cable comprises:
a metal plate disposed inside the RF cable, and
a shielding film comprising a first region in contact with the metal plate, a second region spaced apart from the metal plate, and a third region disposed between the first region and the second region,
wherein at least one waveguide is formed by the second region, the third region, and a portion of the metal plate, and
wherein the wireless communication circuit is configured to at least one of transmit or receive RF signals corresponding to the plurality of conductive patches through the at least one waveguide.

### Claim 17 (depends on 16)

The electronic device of claim 16, wherein the first portion of the RF cable further comprises at least one dielectric included in the at least one waveguide formed by the metal plate and the shielding film.

### Claim 18 (depends on 17)

The electronic device of claim 17, wherein the at least one dielectric included in the at least one waveguide comprises a first dielectric having a first dielectric constant and a second dielectric having a second dielectric constant.

### Claim 19 (depends on 16)

The electronic device of claim 16,
wherein the RF cable further comprises at least one power transmission line, and
wherein the at least one power transmission line is formed on a layer identical to the metal plate.

### Claim 20 (depends on 19)

The electronic device of claim 19,
wherein the at least one power transmission line is disposed in a power transmission region, and
wherein the power transmission region is surrounded by a base dielectric material and the shielding film.

### Claim 21 (depends on 16)

The electronic device of claim 16, wherein a number of the at least one waveguide is identical to a number of the plurality of conductive patches.

### Claim 22 (depends on 16)

The electronic device of claim 16,
wherein the RF cable comprises a first connection portion partially formed at a first end of the RF cable and a second connection portion partially formed at a second end of the RF cable, and
wherein the first portion of the RF cable is formed in a region of the RF cable other than the first connection portion and the second connection portion.

### Claim 23 (depends on 16)

The electronic device of claim 16,
wherein the shielding film is formed of a flexible material, and
wherein the RF cable is disposed in a folding region of the electronic device, the folding region of the electronic device being configured to be folded or unfolded.

### Claim 24

A cable comprising:
a base dielectric layer;
a metal layer disposed on the base dielectric layer; and
a shielding film comprising a first region in contact with the metal layer, a second region spaced apart from the metal layer, and a third region disposed between the first region and the second region,
wherein at least one waveguide is formed by the second region, the third region, and a portion of the metal layer.

### Claim 25 (depends on 24)

The cable of claim 24, further comprising:
at least one dielectric included in the at least one waveguide formed by the metal layer and the shielding film.

### Claim 26 (depends on 25)

The cable of claim 25, wherein the at least one dielectric included in the at least one waveguide comprises air.

### Claim 27 (depends on 25)

The cable of claim 25, wherein the at least one dielectric included in the at least one waveguide comprises a first dielectric having a first dielectric constant and a second dielectric having a second dielectric constant.

### Claim 28 (depends on 24)

The cable of claim 24, further comprising:
at least one power transmission line,
wherein the at least one power transmission line is formed on a layer identical to the metal layer.

### Claim 29 (depends on 24)

The cable of claim 24,
wherein the metal layer comprises a first metal layer disposed on one side of the base dielectric layer and a second metal layer disposed on another side of the base dielectric layer opposite to the one side of the base dielectric layer,
wherein the shielding film further comprises a fourth region in contact with the second metal layer, a fifth region spaced apart from the second metal layer, and a sixth region disposed between the fourth region and the fifth region, and
wherein the at least one waveguide is formed by the fifth region, the sixth region, and a portion of the second metal layer.

### Claim 30 (depends on 24)

The cable of claim 24,
wherein the at least one waveguide is formed in the cable, and
wherein the cable further comprises a first connection portion connected to a wireless communication circuit and a second connection portion connected to a plurality of conductive patches for an antenna.

### Claim 31 (depends on 30)

The cable of claim 30, wherein a radio frequency (RF) signal transmitted through the at least one waveguide is provided, through the first connection portion, to a signal line connected to the wireless communication circuit.

### Claim 32 (depends on 30)

The cable of claim 30, wherein a radio frequency (RF) signal transmitted through the at least one waveguide is provided, through the second connection portion, to a signal line connected to the plurality of conductive patches.

### Claim 33

An electronic device comprising:
a cable comprising:
a base dielectric layer,
a metal layer disposed on the base dielectric layer, and
a shielding film comprising a first region in contact with the metal layer, a second region spaced apart from the metal layer, and a third region disposed between the first region and the second region, wherein at least one waveguide is formed by the second region, the third region, and a portion of the metal layer;
a millimeter wave (mmWave) antenna comprising a plurality of conductive patches; and
a wireless communication circuit disposed inside the electronic device,
wherein the wireless communication circuit transmits radio frequency (RF) signals to the plurality of conductive patches through the at least one waveguide formed by the cable.

### Claim 34 (depends on 33)

The electronic device of claim 33, wherein a number of the at least one waveguide is identical to a number of the plurality of conductive patches.
