# US 12,113,267 B2 · Antenna assembly for a vehicle

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- Number: US 12,113,267 B2
- Document ID: US12113267B2
- Status: Granted
- Kind: B2
- Application number: 18/201,526
- Filed: 2023-05-24
- Published: 2023-09-21
- Granted: 2024-10-08
- Earliest claimed: 2019-01-01
- Assignees: Airgain Incorporated
- Applicants: Airgain, Inc.
- Inventors: Larry Greenstein; Joe L. Romack
- Web page: https://patentgrep.com/patent/US12113267B2

## CPC

- H05K 7/20854: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence)}
- H01Q 1/3275: {mounted on a horizontal surface of the vehicle, e.g. on roof, hood, trunk}
- H01Q 1/42: Housings not intimately mechanically associated with radiating elements, e.g. radome
- H05K 7/20481: {characterised by the material composition exhibiting specific thermal properties}
- H05K 7/20509: {Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures}
- H01Q 1/2291: {used in Bluetooth® or Wi-Fi® devices of Wireless Local Area Networks [WLAN] (H01Q1/241 takes precedence; WLAN in general H04W)}
- H01Q 1/241: {used in mobile communications, e.g. GSM (H01Q1/247, H01Q1/248 take precedence)}
- H01Q 1/3233: {particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems}
- H01Q 21/28: Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

A heat dissipation system for an antenna assembly for a vehicle is disclosed that provides enhanced heat removal attributes and that provides heat transfer from various components to a heat sink through different heat transfer flow paths to reduce the transfer of heat from high heat producing components to heat sensitive components. Improved heat insulation components can be added to maximize the thermal isolation between heat producing components and to prevent heat transferred from the vehicle into the antenna assembly.

## Claims

### Claim 1

A heat dissipation system for an antenna assembly for a vehicle, the antenna assembly having a modem that generates heat during operation and an amplifier, the heat dissipation system comprising:
a base comprising a sidewall, a component mounting surface and a heat sink, the heat sink comprising a plurality of heat dissipation elements; and
a first heat transfer plate in thermal contact with the modem;
a second heat transfer plate mounted on the amplifier;
wherein the modem is disposed on the component mounting surface;
wherein the first heat transfer plate is in thermal contact with a first area of the heat sink;
wherein the second heat transfer plate is in thermal contact with a second area of the heat sink;
wherein the first area of the heat sink is located on one side of the base, the second area of the heat sink is located on an opposing side of the base, and a third area of the heat sink is located at a rear section of the base.

### Claim 2 (depends on 1)

The heat dissipation system according to claim 1, wherein each of the plurality of heat dissipation elements is selected from the group comprising a fin and a pin.

### Claim 3 (depends on 1)

The heat dissipation system according to claim 1, wherein the base has a width ranging from 2.5 inches to 5.5 inches, and a length ranging from 6.0 inches to 8.0 inches.

### Claim 4 (depends on 1)

The heat dissipation system according to claim 1, wherein the first and second heat transfer plates are each made of material selected from the list consisting of copper, aluminum, graphite, carbon diamond, magnesium, gold, silver, aluminum nitride, silicon carbide, and zinc.

### Claim 5

A heat dissipating antenna assembly for a vehicle comprising:
a base comprising a sidewall, a component mounting surface and a heat sink, the heat sink comprising a plurality of heat dissipation elements;
a modem disposed on the component mounting surface;
an amplifier disposed on the component mounting surface;
an antenna board disposed within the base and comprising a plurality of antenna elements;
a first heat transfer plate in thermal contact with a first area of the heat sink and the modem;
a second heat transfer plate mounted on the amplifier and in thermal contact with a second area of the heat sink;
wherein the first area of the heat sink is located on one side of the base, the second area of the heat sink is located on an opposing side of the base, and a third area of the heat sink is located at a rear section of the base.

### Claim 6 (depends on 5)

The heat dissipating antenna assembly according to claim 5, wherein each of the plurality of heat dissipation elements is selected from the group consisting of a fin and a pin.

### Claim 7 (depends on 5)

The heat dissipating antenna assembly according to claim 5, wherein the base has a width ranging from 2.5 inches to 5.5 inches, and a length ranging from 6.0 inches to 8.0 inches.

### Claim 8 (depends on 5)

The heat dissipating antenna assembly according to claim 5, wherein the first and second heat transfer plates are each made of material selected from the list consisting of copper, aluminum, graphite, carbon diamond, magnesium, gold, silver, aluminum nitride, silicon carbide, and zinc.
