# US 12,113,160 B2 · Display device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,113,160 B2 - Document ID: US12113160B2 - Status: Granted - Kind: B2 - Application number: 17/527,885 - Filed: 2021-11-16 - Published: 2022-05-19 - Granted: 2024-10-08 - Earliest claimed: 2020-11-17 - Assignees: LG Display Co., Ltd. - Applicants: LG Display Co., Ltd. - Inventors: JunHyuk Song; Hyokang Lee; Hyowon Kwon; MoonBae Gee; KiHan Kim - Web page: https://patentgrep.com/patent/US12113160B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 90/00: Package configurations - H10H 20/01: Manufacture or treatment - H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout} - H10H 20/0364: {of interconnections} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract According to an aspect of the present disclosure, the display device includes a lower substrate and a plurality of pixel substrates disposed on the lower substrate. The display device also includes a plurality of transistors disposed on the plurality of pixel substrates and a planarization layer disposed on the plurality of pixel substrates to cover upper portions of the plurality of transistors. The display device further includes a plurality of individual connection pads and a common connection pad disposed on the planarization layer. The display device also includes a plurality of light emitting diodes disposed on the plurality of individual connection pads and the common connection pad. At least one of the plurality of individual connection pads and the common connection pad may have a multilayer structure. ## Claims ### Claim 1 A display device, comprising: a lower substrate; a plurality of pixel substrates disposed on the lower substrate; a plurality of transistors disposed on the plurality of pixel substrates; a planarization layer disposed on the plurality of pixel substrates to cover upper portions of the plurality of transistors; a plurality of individual connection pads disposed on the planarization layer; a common connection pad disposed on the planarization layer; a plurality of light emitting diodes disposed on the plurality of individual connection pads and the common connection pad; and an adhesive layer electrically connecting the plurality of individual connection pads and the common connection pad to the plurality of light emitting diodes, wherein at least one of the plurality of individual connection pads and the common connection pad has a multilayer structure, and wherein at least one pixel substrate of the plurality of pixel substrates is between the lower substrate and the plurality of transistors. ### Claim 2 (depends on 1) The display device according to claim 1, wherein the common connection pad includes a lower common connection pad disposed on the planarization layer and an upper common connection pad disposed on the lower common connection pad. ### Claim 3 (depends on 2) The display device according to claim 2, wherein the upper common connection pad is made of a material having a higher adhesiveness to electrodes of the plurality of light emitting diodes than the lower common connection pad. ### Claim 4 (depends on 3) The display device according to claim 3, wherein the lower common connection pad is made of copper (Cu), and wherein the upper common connection pad is made of gold (Au), titanium (Ti), aluminum (Al) or molybdenum (Mo). ### Claim 5 (depends on 3) The display device according to claim 3, wherein the lower common connection pad includes copper, and wherein the upper common connection pad includes a material chosen from gold, titanium, aluminum or molybdenum. ### Claim 6 (depends on 2) The display device according to claim 2, wherein the upper common connection pad is disposed on an edge of the lower common connection pad. ### Claim 7 (depends on 6) The display device according to claim 6, wherein the upper common connection pad is further disposed on the lower common connection pad corresponding to a space between the plurality of individual connection pads. ### Claim 8 (depends on 7) The display device according to claim 7, wherein the upper common connection pad is disposed in a mesh form on the lower common connection pad. ### Claim 9 (depends on 2) The display device according to claim 2, wherein the plurality of individual connection pads includes a lower individual connection pad disposed on the planarization layer and an upper individual connection pad disposed on the lower individual connection pad, and wherein the upper individual connection pad has a shape corresponding to the upper common connection pad and is disposed on the lower individual connection pad. ### Claim 10 (depends on 1) The display device according to claim 1, further comprising: a power line disposed on the planarization layer; and an insulating layer disposed on the power line. ### Claim 11 (depends on 10) The display device according to claim 10, wherein the insulating layer includes a plurality of insulating patterns disposed on the power line. ### Claim 12 (depends on 10) The display device according to claim 10, wherein in the insulating layer, a portion relatively adjacent to the common connection pad has a smaller height than a portion relatively far from the common connection pad. ### Claim 13 (depends on 10) The display device according to claim 10, wherein the insulating layer is disposed to cover a side surface of the power line adjacent to the common connection pad. ### Claim 14 (depends on 10) The display device according to claim 10, wherein a distance between the plurality of individual connection pads and the common connection pad is greater than a distance between the common connection pad and the power line. ### Claim 15 A display device, comprising: a plurality of pixel substrates which is disposed on a lower substrate and in which a plurality of light emitting diodes is disposed, the plurality of pixel substrates being spaced apart from each other; a planarization layer covering upper portions of the plurality of pixel substrates; a plurality of individual connection pads disposed on the planarization layer so as to correspond to the plurality of light emitting diodes, respectively; a common connection pad disposed on the planarization layer and electrically connected to all of the plurality of light emitting diodes; and an adhesive layer electrically connecting the plurality of individual connection pads and the common connection pad to the plurality of light emitting diodes, wherein at least one of the plurality of individual connection pads and the common connection pad has a lower pad and an upper pad disposed on an edge of the lower pad. ### Claim 16 (depends on 15) The display device according to claim 15, wherein the upper pad is made of a different material from the lower pad. ### Claim 17 (depends on 15) The display device according to claim 15, wherein the upper pad is disposed in a mesh form on the lower pad. ### Claim 18 (depends on 15) The display device according to claim 15, further comprising: a first potential power line disposed on the planarization layer; and an insulating layer disposed on the first potential power line, wherein the common connection pad is disposed between the plurality of individual connection pads and the first potential power line. ### Claim 19 (depends on 18) The display device according to claim 18, wherein the insulating layer is disposed to cover a side surface of the first potential power line. ### Claim 20 A display device, comprising: a lower substrate having thereon a display area and a non-display area adjacent to the display area; a plurality of pixel substrates and a plurality of non-pixel substrates disposed on the lower substrate, the plurality of pixel substrates having thereon a plurality of light emitting diodes in the display area, the plurality of non-pixel substrates in the non-display area; a planarization layer covering upper portions of the plurality of pixel substrates; a plurality of individual connection pads disposed on the planarization layer and corresponding to the plurality of light emitting diodes, respectively; a common connection pad disposed on the planarization layer and electrically connected to all of the plurality of light emitting diodes; and an adhesive layer electrically connecting the plurality of individual connection pads and the common connection pad to the plurality of light emitting diodes and disposed to cover the entire upper surface of the planarization layer. ### Claim 21 (depends on 20) The display device according to claim 20, wherein the adhesive layer includes a plurality of conductive balls and a base member, and wherein the plurality of conductive balls is disposed in a single layer as being dispersed in the base member. ### Claim 22 (depends on 21) The display device according to claim 21, wherein each of the plurality of conductive balls are spaced apart from each other and not electrically connected to each other, and each plurality respectively electrically connects the plurality of individual connection pads and the common connection pad to the plurality of light emitting diodes. ### Claim 23 (depends on 21) The display device according to claim 21, a thickness of the adhesive layer is equal to or smaller than that of the planarization layer.