# US 12,113,158 B2 · Light emitting diode package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,113,158 B2 - Document ID: US12113158B2 - Status: Granted - Kind: B2 - Application number: 17/116,399 - Filed: 2020-12-09 - Published: 2021-03-25 - Granted: 2024-10-08 - Earliest claimed: 2018-06-11 - Assignees: Seoul Semiconductor Co., Ltd. - Applicants: Seoul Semiconductor Co., Ltd. - Inventors: Ji Ho Kim - Web page: https://patentgrep.com/patent/US12113158B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/831: characterised by their shape - H10H 20/8506: {Containers} - H10W 90/00: Package configurations - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A light emitting diode package includes a light emitting diode chip provided at a lower side thereof with a first electrode pad and a second electrode pad, a first lead and a second lead spaced apart from each other and contacting the first electrode pad and the second electrode pad of the light emitting diode chip to be electrically connected thereto, respectively, and a housing formed to surround the first lead and the second lead and having a cavity open at a top portion thereof. The first lead and the second lead have a first lead exposing plane and a second lead exposing plane disposed on a lower surface of the cavity of the housing and partially exposing the first lead and the second lead, respectively. ## Claims ### Claim 1 A light emitting diode package comprising: a light emitting diode chip including a first electrode pad and a second electrode pad; a first lead and a second lead spaced apart from each other and electrically connected to the first electrode pad and the second electrode pad of the light emitting diode chip, respectively; and a housing formed to surround the first lead and the second lead and having a cavity open at a top portion thereof, wherein the first lead and the second lead have a first lead exposing plane and a second lead exposing plane disposed on a lower surface of the cavity of the housing such that the first lead and the second lead are at least partially exposed and electrically connected to the first electrode pad and the second electrode pad, respectively, and wherein the first lead exposing plane has a greater width than a width of the light emitting diode chip, wherein the first lead has a first protrusion protruding outwards from a side surface of the first lead and the second lead has a second protrusion protruding outwards from a side surface of the second lead, and wherein the first protrusion and the second protrusion extend in directions away from each other, wherein the first lead and the second lead include a Zener diode mount region and a Zener diode connection region that are portion provided in the cavity to be spaced apart from each other, wherein a distance from one side of a first groove of the first lead to one side of the first lead exposing plane is greater than a distance from the other side of the first lead exposing plane to one side of the Zener diode mount region. ### Claim 2 (depends on 1) The light emitting diode package according to claim 1, wherein the first lead includes a first groove formed on an upper surface thereof such that the first lead exposing plane is exposed to the lower surface of the cavity and the first groove of the first lead is placed within the housing and not exposed in the cavity. ### Claim 3 (depends on 2) The light emitting diode package according to claim 2, wherein the second lead exposing plane has a size that corresponds to a size of the second electrode pad, and wherein the second lead includes a second groove on an upper surface such that the second lead exposing plane is exposed to the lower surface of the cavity and the second groove of the second lead is not exposed in the cavity and placed within the housing. ### Claim 4 (depends on 1) The light emitting diode package according to claim 1, wherein: the first electrode pad has a rectangular shape; the first lead exposing plane has a rectangular shape; the first electrode pad is superimposed on the first lead exposing plane for electrical connection, and the width of the rectangular shape of the first lead exposing plane is greater than the width of the first electrode pad such that a part of the first lead exposing plane extends relative to the first electrode pad. ### Claim 5 (depends on 1) The light emitting diode package according to claim 1, wherein the first electrode pad contacts the first lead exposing plane such that at least one side of the first lead exposing plane is coincident with at least one side of the first electrode pad. ### Claim 6 (depends on 4) The light emitting diode package according to claim 4, wherein each of the first lead exposing plane and the second lead exposing plane is partially extended in an outward direction relative to the light emitting diode chip. ### Claim 7 (depends on 1) The light emitting diode package according to claim 1, wherein the first lead exposing plane has a polygonal concave shape and the second lead exposing plane has a shape symmetric to the shape of the first lead exposing plane. ### Claim 8 (depends on 7) The light emitting diode package according to claim 7, wherein each of the first lead exposing plane and the second lead exposing plane has an octagonal or dodecagonal concave shape. ### Claim 9 (depends on 1) The light emitting diode package according to claim 1, wherein each of the first lead exposing plane and the second lead exposing plane has a polygonal shape including a rectangular shape and an extended part from one side of a rectangular shape in an outward direction relative to the light emitting diode chip. ### Claim 10 (depends on 1) The light emitting diode package according to claim 1, wherein each of the first lead exposing plane and the second lead exposing plane has a polygonal shape including a rectangular shape and extended parts from three sides of the rectangular shape in an outward direction relative to the light emitting diode chip. ### Claim 11 (depends on 1) The light emitting diode package according to claim 1, wherein: the first lead exposing plane has a hexagonal shape; and the first electrode pad contacts the first lead exposing plane, such that at least one side of the first electrode pad is coincident with at least one side of the first lead exposing plane, while the entire first electrode pad contacts the first lead exposing plane. ### Claim 12 (depends on 11) The light emitting diode package according to claim 11, wherein the second lead exposing plane has the shape and a size that are symmetric to the shape and the size of the first lead exposing plane. ### Claim 13 (depends on 11) The light emitting diode package according to claim 11, wherein the first lead exposing plane has a surface not contacting the first electrode pad at a location opposite to the at least one side coincident with the first lead. ### Claim 14 (depends on 11) The light emitting diode package according to claim 11, wherein the second lead exposing plane has a first side that is coincident with at least one side of the second lead and a second side that is not coincident with the second lead. ### Claim 15 (depends on 1) The light emitting diode package according to claim 1, wherein the first lead exposing plane and the second lead exposing plane have a hexagonal shape; at least one corner of the first electrode pad contacts at least one side of the first lead exposing plane; and at least one corner of the second electrode pad contacts at least one side of the second lead exposing plane. ### Claim 16 (depends on 1) The light emitting diode package according to claim 1, wherein the Zener diode mount region is configured to mount a Zener diode chip and the Zener diode chip is electrically connected to the Zener diode connection region. ### Claim 17 (depends on 16) The light emitting diode package according to claim 16, wherein the first lead comprises a first groove having a first side and a second side that is opposite and asymmetric to the first side; and the second lead comprises a second groove having a third side and a fourth side that is opposite and asymmetric to the third side. ### Claim 18 (depends on 17) The light emitting diode package according to claim 17, wherein: the first groove is arranged between a first side surface and a second side surface of the first groove, the second side surface exposed to an outside of the housing and the first side surface placed within the housing; and the second groove is arranged between a third side surface and a fourth side surface of the second groove, the fourth side surface exposed to the outside of the housing and the third side surface placed within the housing. ### Claim 19 (depends on 17) The light emitting diode package according to claim 17, wherein: a distance between the first side and the second side of the first groove is greater than a shortest distance between the first lead exposing plane and the Zener diode mount region; and a distance between the third side and the fourth side of the second groove is greater than a shortest distance between the second lead exposing plane and the Zener diode connection region. ### Claim 20 (depends on 1) The light emitting diode package according to claim 1, wherein a portion of the first lead is exposed to a side surface of the housing and a portion of the second lead is exposed to an opposite side surface of the housing. ### Claim 21 (depends on 1) The light emitting diode package according to claim 1, further comprising: a sealing member filling the cavity of the housing.