# US 12,113,155 B2 · Method of manufacturing optical semiconductor device and optical semiconductor device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,113,155 B2
- Document ID: US12113155B2
- Status: Granted
- Kind: B2
- Application number: 17/754,113
- Filed: 2020-09-18
- Published: 2022-09-15
- Granted: 2024-10-08
- Earliest claimed: 2019-09-27
- Assignees: Dowa Electronics Materials Co., Ltd.
- Applicants: DOWA Electronics Materials Co., Ltd.
- Inventors: Tsukasa Maruyama; Takashi Araki; Takehiro Miyaji
- Web page: https://patentgrep.com/patent/US12113155B2

## CPC

- H10H 20/8506: {Containers}
- H01S 5/022: Mountings; Housings
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 76/10: Containers or parts thereof
- H10H 20/036: {of packages}
- H10H 20/0364: {of interconnections}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The method of manufacturing an optical semiconductor device includes: a mounting step of placing an optical semiconductor chip on a package substrate made of ceramic; a storing step of storing the package substrate after the mounting step in a first dry atmosphere; a placing step of subjecting the optical semiconductor chip on the package substrate to a second dry atmosphere and placing a light transparent window on a joint portion of the package substrate with a joint material therebetween; and a sealing step of joining the joint portion and the light transparent window with the joint material in a low oxygen concentration atmosphere having an oxygen concentration of 1 vol % or less, thereby encapsulating the optical semiconductor chip in a confined space formed by the package substrate and the light transparent window.

## Claims

### Claim 1

A method of manufacturing an optical semiconductor device, comprising:
a mounting step of placing an optical semiconductor chip on a package substrate made of ceramic;
a storing step of storing the package substrate after the mounting step in a first dry atmosphere;
a placing step of subjecting the optical semiconductor chip on the package substrate to a second dry atmosphere and placing a light transparent window on a joint portion of the package substrate with a joint material therebetween; and
a sealing step of joining the joint portion and the light transparent window with the joint material in a low oxygen concentration atmosphere having an oxygen concentration of 1 vol % or less, thereby encapsulating the optical semiconductor chip in a confined space formed by the package substrate and the light transparent window,
wherein the confined space after the sealing step has a moisture concentration of 1000 ppm or less and an oxygen concentration of 3 vol % or less.

### Claim 2 (depends on 1)

The method of manufacturing an optical semiconductor device, according to claim 1,
wherein the first dry atmosphere has a moisture concentration of 1000 ppm or less, and
the second dry atmosphere has a moisture concentration of 1000 ppm or less and an oxygen concentration of 4 vol % or less.

### Claim 3 (depends on 1)

The method of manufacturing an optical semiconductor device, according to claim 1,
wherein the confined space after the sealing step has a moisture concentration of 300 ppm or less and an oxygen concentration of 0.8 vol % or less.

### Claim 4 (depends on 1)

The method of manufacturing an optical semiconductor device, according to claim 1,
wherein the second dry atmosphere has a moisture concentration of 200 ppm to 1000 ppm and an oxygen concentration of 3 vol % or less.

### Claim 5 (depends on 4)

The method of manufacturing an optical semiconductor device, according to claim 4,
wherein the second dry atmosphere has a moisture concentration of 200 ppm to 550 ppm.

### Claim 6

An optical semiconductor device, comprising:
a package substrate made of ceramic; and
an optical semiconductor chip placed on the package substrate,
wherein the optical semiconductor chip is encapsulated in a confined space between a light transparent window and the package substrate, the light transparent window being joined to a joint material on a joint portion of the package substrate therebetween, and
the confined space has a moisture concentration of 1000 ppm or less and an oxygen concentration of 3 vol % or less.

### Claim 7 (depends on 6)

The optical semiconductor device according to claim 6, wherein a center emission wavelength of the optical semiconductor chip is 200 nm to 350 nm.