# US 12,113,094 B2 · Electronic device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,113,094 B2
- Document ID: US12113094B2
- Status: Granted
- Kind: B2
- Application number: 18/177,289
- Filed: 2023-03-02
- Published: 2023-07-06
- Granted: 2024-10-08
- Earliest claimed: 2018-10-24
- Assignees: Innolux Corporation
- Applicants: InnoLux Corporation
- Inventors: Jia-Yuan Chen; Tsung-Han Tsai; Kuan-Feng Lee; Yuan-Lin Wu
- Web page: https://patentgrep.com/patent/US12113094B2

## CPC

- H10W 90/00: Package configurations
- H10H 20/01: Manufacture or treatment
- H10H 20/82: Roughened surfaces, e.g. at the interface between epitaxial layers
- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10H 20/841: Reflective coatings, e.g. dielectric Bragg reflectors
- H10H 20/8513: {having two or more wavelength conversion materials}
- H10H 20/8515: {not being in contact with the bodies}
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/856: Reflecting means
- H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout}
- H10K 59/122: Pixel-defining structures or layers, e.g. banks
- H10K 59/127: comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
- H10K 59/173: comprising banks or shadow masks
- H10K 59/351: {comprising more than three subpixels, e.g. red-green-blue-white [RGBW]}
- H10K 59/38: comprising colour filters or colour changing media [CCM]
- H10K 59/873: {Encapsulations}
- H10H 20/034: {of coatings}
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0363: {of optical field-shaping means}
- H10K 59/1201: {Manufacture or treatment}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

An electronic device includes a substrate, a first light-emitting unit, a first light conversion unit, and a first buffer layer. The first light-emitting unit is disposed on the substrate. The first light conversion unit is disposed on the first light-emitting unit. The first buffer layer is disposed between the first light conversion unit and the first light-emitting unit. The thickness of the first light conversion unit is greater than the thickness of the first light-emitting unit.

## Claims

### Claim 1

An electronic device, comprising:
a substrate;
a first light-emitting unit disposed on the substrate;
a first light conversion unit disposed on the first light-emitting unit; and
a first buffer layer disposed between the first light conversion unit and the first light-emitting unit,
wherein a thickness of the first light conversion unit is greater than a thickness of the first light-emitting unit,
wherein a ratio of the thickness of the first light conversion unit to a thickness of the first buffer layer is in a range from 0.2 to 100,
wherein the first light conversion unit has a curved surface and the curved surface is in contact with the first buffer layer.

### Claim 2 (depends on 1)

The electronic device as claimed in claim 1, further comprising:
a second light-emitting unit disposed adjacent to the first light-emitting unit; and
a second light conversion unit disposed on the second light-emitting unit.

### Claim 3 (depends on 2)

The electronic device as claimed in claim 2, wherein a width of the first light conversion unit is different from a width of the second light conversion unit.

### Claim 4 (depends on 2)

The electronic device as claimed in claim 2, further comprising a light-shielding layer disposed between the first light conversion unit and the second light conversion unit.

### Claim 5 (depends on 2)

The electronic device as claimed in claim 2, further comprising a filter layer disposed on at least one of the first light conversion unit and the second light conversion unit.

### Claim 6 (depends on 2)

The electronic device as claimed in claim 2, further comprising a second buffer layer disposed between the second light conversion unit and the second light-emitting unit, and the thickness of the first buffer layer is different from a thickness of the second buffer layer.

### Claim 7 (depends on 1)

The electronic device as claimed in claim 1, wherein the first buffer layer has a curved surface.

### Claim 8 (depends on 1)

The electronic device as claimed in claim 1, further comprising a protective layer disposed on the first conversion unit, wherein the first conversion unit is disposed between the protective layer and the first buffer layer.

### Claim 9 (depends on 1)

The electronic device as claimed in claim 1, further comprising:
a second light-emitting unit disposed on the substrate and adjacent to the first light-emitting unit; and
an insulating layer disposed between the first light-emitting unit and the second light-emitting unit, wherein in a cross-sectional view, the insulating layer has an upper surface and a bottom surface, the upper surface has an upper width, the bottom surface has a bottom width, and the bottom width is larger than the upper width.