# US 12,113,030 B2 · Electronic component module comprising shield and sealing resin covering electronic components

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- Number: US 12,113,030 B2
- Document ID: US12113030B2
- Status: Granted
- Kind: B2
- Application number: 17/655,376
- Filed: 2022-03-18
- Published: 2022-06-30
- Granted: 2024-10-08
- Earliest claimed: 2019-09-27
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Tadashi Nomura; Yoshihito Otsubo
- Web page: https://patentgrep.com/patent/US12113030B2

## CPC

- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/68: Shapes or dispositions thereof
- H10W 74/014: {using batch processing}
- H10W 90/00: Package configurations
- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H10W 44/248: {for antennas}
- H10W 72/0198: {batch processes}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A module substrate, a sealing resin portion, and a shield are provided. The shield is provided to cover each of the sealing resin portion and a peripheral side surface of the module substrate. The shield is connected to a ground electrode. On the peripheral side surface, the shield is separated into a first surface side and a second surface side.

## Claims

### Claim 1

An electronic component module comprising:
a module substrate including a first surface, a second surface located opposite to the first surface, and a peripheral side surface connecting the first surface and the second surface to each other, electronic components being mounted on each of the first surface and the second surface;
a sealing resin portion provided on at least one of the first surface and the second surface, the electronic component being sealed with the sealing resin portion; and
a shield provided to cover each of the sealing resin portion and the peripheral side surface, wherein
the module substrate is provided with a ground electrode,
the shield is connected to the ground electrode, and
a recess is located along the peripheral side surface, such that the shield is separated into a first surface side and a second surface side.

### Claim 2 (depends on 1)

The electronic component module according to claim 1, wherein
the sealing resin portion is provided on each of the first surface and the second surface.

### Claim 3 (depends on 1)

The electronic component module according to claim 1, wherein
at least one of the first surface and the second surface is provided with an antenna circuit.

### Claim 4 (depends on 1)

The electronic component module according to claim 1, wherein
at least one of the first surface and the second surface is provided with a connector as a connection terminal.

### Claim 5

An electronic component module comprising
a module substrate including a first surface, a second surface located opposite to the first surface, and a peripheral side surface connecting the first surface and the second surface to each other, an electronic component being mounted on at least one of the first surface and the second surface;
a sealing resin portion provided on at least one of the first surface and the second surface, the electronic component being sealed with the sealing resin portion; and
a shield provided to cover each of the sealing resin portion and the peripheral side surface, wherein
the module substrate is provided with a ground electrode,
the shield is connected to the ground electrode, and
on the peripheral side surface, the shield is separated into a first surface side and a second surface side,
wherein
the peripheral side surface is provided with at least one recess, and
on the peripheral side surface, the shield is separated into the first surface side and the second surface side by the at least one recess.

### Claim 6 (depends on 5)

The electronic component module according to claim 5, wherein
the peripheral side surface is provided with a surrounding groove as the at least one recess, the surrounding groove extending around the peripheral side surface by one round.

### Claim 7 (depends on 5)

The electronic component module according to claim 5, wherein
the peripheral side surface is provided with a plurality of recesses as the at least one recess, the plurality of recesses being located at a distance from one another.

### Claim 8 (depends on 5)

The electronic component module according to claim 5, wherein
the at least one recess includes a portion extending in a plane direction of the module substrate and a portion extending in a thickness direction of the module substrate.

### Claim 9 (depends on 5)

The electronic component module according to claim 5, wherein
the sealing resin portion is provided with a groove, and
the shield is separated by the groove and the at least one recess.

### Claim 10 (depends on 6)

The electronic component module according to claim 6, wherein
the sealing resin portion is provided with a groove, and
the shield is separated by the groove and the at least one recess.

### Claim 11 (depends on 7)

The electronic component module according to claim 7, wherein
the sealing resin portion is provided with a groove, and
the shield is separated by the groove and the at least one recess.

### Claim 12 (depends on 8)

The electronic component module according to claim 8, wherein
the sealing resin portion is provided with a groove, and
the shield is separated by the groove and the at least one recess.

### Claim 13 (depends on 5)

The electronic component module according to claim 5, wherein
an electronic component is mounted on the first surface and another electronic component is mounted on the second surface, and
the sealing resin portion is provided on each of the first surface and the second surface.

### Claim 14 (depends on 6)

The electronic component module according to claim 6, wherein
an electronic component is mounted on the first surface and another electronic component is mounted on the second surface, and
the sealing resin portion is provided on each of the first surface and the second surface.

### Claim 15 (depends on 7)

The electronic component module according to claim 7, wherein
an electronic component is mounted on the first surface and another electronic component is mounted on the second surface, and
the sealing resin portion is provided on each of the first surface and the second surface.

### Claim 16 (depends on 8)

The electronic component module according to claim 8, wherein
an electronic component is mounted on the first surface and another electronic component is mounted on the second surface, and
the sealing resin portion is provided on each of the first surface and the second surface.

### Claim 17 (depends on 9)

The electronic component module according to claim 9, wherein
an electronic component is mounted on the first surface and another electronic component is mounted on the second surface, and
the sealing resin portion is provided on each of the first surface and the second surface.

### Claim 18 (depends on 5)

The electronic component module according to claim 5, wherein
at least one of the first surface and the second surface is provided with an antenna circuit.

### Claim 19 (depends on 6)

The electronic component module according to claim 6, wherein
at least one of the first surface and the second surface is provided with an antenna circuit.

### Claim 20 (depends on 7)

The electronic component module according to claim 7, wherein
at least one of the first surface and the second surface is provided with an antenna circuit.