# US 12,113,026 B2 · Multi-chip package and method of providing die-to-die interconnects in same

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- Number: US 12,113,026 B2
- Document ID: US12113026B2
- Status: Granted
- Kind: B2
- Application number: 18/377,991
- Filed: 2023-10-09
- Published: 2024-02-01
- Granted: 2024-10-08
- Earliest claimed: 2009-06-24
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Henning Braunisch; Chia-Pin Chiu; Aleksandar Aleksov; Hinmeng Au; Stefanie M. Lotz; Johanna M. Swan; Sujit Sharan
- Web page: https://patentgrep.com/patent/US12113026B2

## CPC

- H10W 70/611: {for connecting multiple chips together}
- H10W 70/618: {the bridge chips being embedded in the package substrates, interposers or redistribution layers}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/68: Shapes or dispositions thereof
- H10W 90/00: Package configurations
- H10W 90/293: {characterised by non-galvanic coupling between the chips, e.g. capacitive coupling}
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 70/682: {comprising holes having chips therein}
- H10W 72/07204: {using temporary auxiliary members, e.g. sacrificial coatings}
- H10W 72/07207: {Temporary substrates, e.g. removable substrates}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07254: {changes in dispositions}
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 72/247: {Dispositions of multiple bumps}
- H10W 72/251: {Materials}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/50: Bond wires
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/551: {Materials of bond wires}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/859: {Bump connectors and bond wires}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 90/24: at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

## Claims

### Claim 1

A multi-chip package comprising:
a substrate having a first side, an opposing second side, and a third side that extends from the first side to the second side, the third side constituting a portion of an outside perimeter of the substrate;
a first die attached to the first side of the substrate;
a second die attached to the first side of the substrate; and
a bridge within an opening of the substrate, the bridge attached to the first die and to the second die, wherein the bridge creates a connection between the first die and the second die, wherein the bridge has a first side, a second side, a third side and a fourth side from a plan view perspective, the plan view perspective parallel with the first side of the substrate, wherein the first die overlaps the first side and second side of the bridge but not the third side and fourth side of the bridge from the plan view perspective, and wherein the second die overlaps the third side and fourth side of the bridge but not the first side and second side of the bridge from the plan view perspective.

### Claim 2 (depends on 1)

The multi-chip package of claim 1, further comprising:
a third die attached to the first side of the substrate.

### Claim 3 (depends on 2)

The multi-chip package of claim 2, wherein the bridge further creates a connection between the first die and the third die.

### Claim 4 (depends on 2)

The multi-chip package of claim 2, further comprising:
a fourth die attached to the first side of the substrate.

### Claim 5 (depends on 4)

The multi-chip package of claim 4, wherein the bridge further creates a connection between the first die and the fourth die.

### Claim 6 (depends on 1)

The multi-chip package of claim 1, wherein the bridge comprises silicon.

### Claim 7 (depends on 1)

The multi-chip package of claim 1, wherein the opening of the substrate completely laterally surrounds the bridge.

### Claim 8 (depends on 1)

The multi-chip package of claim 1, wherein the bridge has an exposed backside opposite the first die and the second die.

### Claim 9 (depends on 1)

The multi-chip package of claim 1, wherein portions of the first die and the second die overhanging the bridge have interconnect structures with a smaller pitch than interconnect structures of portions of the first die and the second die not overhanging the bridge.

### Claim 10 (depends on 1)

The multi-chip package of claim 1, wherein the first die and the second die are flip chip or controlled collapse attached to the bridge.

### Claim 11 (depends on 1)

The multi-chip package of claim 1, wherein the bridge does not include a through silicon via.

### Claim 12 (depends on 1)

The multi-chip package of claim 1, further comprising one or more wire bonds coupling the bridge die to the substrate.

### Claim 13 (depends on 1)

The multi-chip package of claim 1, further comprising an underfill material along sides and a bottom of the bridge.

### Claim 14

A multi-chip package comprising:
a substrate having a first side, an opposing second side, and a third side that extends from the first side to the second side, the third side constituting a portion of an outside perimeter of the substrate;
a first die attached to the first side of the substrate;
a second die attached to the first side of the substrate; and
a bridge within a cavity within the substrate, the bridge attached to the first die and to the second die, wherein the bridge creates a connection between the first die and the second die, wherein the bridge has a first side, a second side, a third side and a fourth side from a plan view perspective, the plan view perspective parallel with the first side of the substrate, wherein the first die overlaps the first side and second side of the bridge but not the third side and fourth side of the bridge from the plan view perspective, and wherein the second die overlaps the third side and fourth side of the bridge but not the first side and second side of the bridge from the plan view perspective.

### Claim 15 (depends on 14)

The multi-chip package of claim 14, wherein the bridge is surrounded by a protective material within the cavity, the protective material selected from the group consisting of an encapsulant, an underfill material, and an epoxy.

### Claim 16 (depends on 14)

The multi-chip package of claim 14, further comprising:
a third die attached to the first side of the substrate.

### Claim 17 (depends on 16)

The multi-chip package of claim 16, wherein the bridge further creates a connection between the first die and the third die.

### Claim 18 (depends on 16)

The multi-chip package of claim 16, further comprising:
a fourth die attached to the first side of the substrate.

### Claim 19 (depends on 18)

The multi-chip package of claim 18, wherein the bridge further creates a connection between the first die and the fourth die.

### Claim 20 (depends on 14)

The multi-chip package of claim 14, further comprising an underfill material along sides and a bottom of the bridge.