# US 12,113,011 B2 · Semiconductor device and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,113,011 B2 - Document ID: US12113011B2 - Status: Granted - Kind: B2 - Application number: 17/955,709 - Filed: 2022-09-29 - Published: 2023-04-20 - Granted: 2024-10-08 - Earliest claimed: 2021-10-18 - Assignees: Fuji Electric Co., Ltd. - Applicants: Fuji Electric Co., Ltd. - Inventors: Hiroto Watanabe; Sho Takano - Web page: https://patentgrep.com/patent/US12113011B2 ## CPC - H10W 72/00: Interconnections or connectors in packages - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 70/611: {for connecting multiple chips together} - H10W 70/68: Shapes or dispositions thereof - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 99/00: Subject matter not provided for in other groups of this subclass - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 90/00: Package configurations - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A bus bar includes a laminated body formed by directly laminating a flat plate-shaped first conductive plate, flat plate-shaped insulating sheet, and flat plate-shaped second conductive plate. The laminated body has main terminal connection parts into which end portions of external connection terminals are inserted, and is sealed in a sealing body, except the main terminal connection parts. The first conductive plate, insulating sheet, and second conductive plate are pressurized toward the insulating sheet in the lamination direction of the laminated body so that volumes of air spaces inside the insulating sheet (and air spaces between the first conductive plate and the insulating sheet and between the second conductive plate and the insulating sheet) are compressed. ## Claims ### Claim 1 A semiconductor device, comprising: a semiconductor module including a plurality of semiconductor chips and a plurality of external connection terminals, the plurality of external connection terminals being electrically connected to respective ones of the plurality of semiconductor chips and each extending outside the semiconductor module, the semiconductor module being sealed with a first sealing material with parts of the plurality of external connection terminals being exposed outside of the sealing material; and a bus bar including a laminated body that includes a flat plate-shaped first conductive member, a flat plate-shaped organic insulating member and a flat plate-shaped second conductive member that are directly and sequentially laminated in this order in a lamination direction, the organic insulating member having a void or a surface with roughness, the laminated body having a plurality of insertion holes into which exposed parts of the plurality of external connection terminals are respectively inserted, the first and second conductive members having end portions that respectively form a first external connection portion and a second external connection portion, the bus bar being sealed with a second sealing material with the plurality of insertion holes and the first and second external connection portions being exposed outside of the second sealing material. ### Claim 2 (depends on 1) The semiconductor device according to claim 1, wherein the bus bar has a rear surface facing the semiconductor module, the rear surface having a lattice pattern with a plurality of openings respectively including the plurality of insertion holes, and the bus bar has a front surface opposite to the rear surface, the front surface having a lattice pattern with a plurality of openings respectively including the plurality of insertion holes. ### Claim 3 (depends on 2) The semiconductor device according to claim 2, wherein an outer edge of the first conductive member and an outer edge of the second conductive member overlap in a plan view of the semiconductor device in the second sealing material. ### Claim 4 (depends on 1) The semiconductor device according to claim 1, wherein the organic insulating member is an aramid paper. ### Claim 5 (depends on 4) The semiconductor device according to claim 4, wherein the organic insulating member contains an air space. ### Claim 6 (depends on 5) The semiconductor device according to claim 5, wherein a thickness of the air space in the lamination direction is less than 7 μm. ### Claim 7 (depends on 1) A method of manufacturing the semiconductor device of claim 1, the method comprising: preparing the flat plate-shaped first conductive member, the flat plate-shaped organic insulating member having the void or the surface with roughness, and the flat plate-shaped second conductive member; directly and sequentially laminating the first conductive member, the organic insulating member, and the second conductive member in this order in the lamination direction, to form the laminated body; pressurizing the laminated body in the lamination direction to compress the laminated body to thereby reduce the void or roughness; conductively connecting the first conductive member and the second conductive member to the semiconductor chips; sealing the semiconductor module with the first sealing material with parts of the plurality of external connection terminals being exposed outside of the first sealing material; inserting the exposed parts of the plurality of external connection terminals respectively into the plurality of insertion holes; and sealing the bus bar, including the laminated body, with the second sealing material, with the plurality of insertion holes and the first and second external connection portions being exposed outside of the second sealing material. ### Claim 8 (depends on 7) The method according to claim 7, further comprising after the laminating, setting the laminated body in a mold, and filling an inside of the mold with the second sealing material to seal the laminated body while performing the pressurizing with the second sealing material. ### Claim 9 (depends on 8) The method according to claim 8, wherein the filling includes filling the inside of the mold with the second sealing material to seal the laminated body, and further filling the inside of the mold with the second sealing material to perform the pressurizing. ### Claim 10 (depends on 7) The method according to claim 7, further comprising after the pressurizing, setting the compressed laminated body in a mold, and filling an inside of the mold with the second sealing material to seal the laminated body with the second sealing material. ### Claim 11 A semiconductor device, comprising: a semiconductor module including a plurality of semiconductor chips and a plurality of external connection terminals, the plurality of external connection terminals being electrically connected to respective ones of the plurality of semiconductor chips and each extending outside the semiconductor module; and a bus bar including a laminated body that includes a flat plate-shaped first conductive member, a flat plate-shaped organic insulating member and a flat plate-shaped second conductive member that are directly and sequentially laminated in this order in a lamination direction, the organic insulating member having a void or a surface with roughness, the laminated body having a plurality of insertion holes into which the plurality of external connection terminals are respectively inserted, the first and second conductive members having end portions that respectively form a first external connection portion and a second external connection portion, the bus bar being sealed with a sealing material with the plurality of insertion holes and the first and second external connection portions being exposed outside of the sealing material, wherein the semiconductor module has a main body that is rectangular in a plan view of the semiconductor device, the plurality of external connection terminals are aligned in an alignment direction along a long side of the main body, and the first external connection portion and the second external connection portion each extend in a direction perpendicular to the alignment direction. ### Claim 12 (depends on 11) The semiconductor device according to claim 11, wherein the first external connection portion extends in parallel to a long side of the first conductive member, the second external connection portion extends in parallel to a long side of the second conductive member, and the first external connection portion and the second external connection portion are positioned at different heights in the lamination direction. ### Claim 13 (depends on 11) The semiconductor device according to claim 11, wherein the laminated body has at least one of a groove or a protrusion between two of the plurality of insertion holes in which two of the plurality of external connection terminals are inserted, the two external connection terminals having different electrical potentials.