# US 12,113,010 B2 · Plurality of bus bars intersecting a plurality electrode

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- Number: US 12,113,010 B2
- Document ID: US12113010B2
- Status: Granted
- Kind: B2
- Application number: 17/754,238
- Filed: 2019-11-15
- Published: 2022-11-24
- Granted: 2024-10-08
- Earliest claimed: 2019-11-15
- Assignees: Mitsubishi Electric Corporation
- Applicants: Mitsubishi Electric Corporation
- Inventors: Shigeto Fujita; Tetsuya Matsuda
- Web page: https://patentgrep.com/patent/US12113010B2

## CPC

- H10W 72/00: Interconnections or connectors in packages
- H05K 7/14329: {specially adapted for the configuration of power bus bars}
- H10W 72/0198: {batch processes}
- H10W 72/073: {of die-attach connectors}
- H10W 72/60: Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W 74/01: Manufacture or treatment
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 76/138: having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
- H10W 90/00: Package configurations
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A semiconductor device includes a plurality of semiconductor chips, an insulating part, a first electrode, a second electrode, a first bus bar, and a second bus bar. The insulating part surrounds the semiconductor chips. The first electrode is in pressure contact with the semiconductor chips. The semiconductor chips are sandwiched between the first electrode and the second electrode in a first direction. The second electrode is in pressure contact with the semiconductor chips. The first bus bar is connected to the first electrode. The second bus bar is connected to the second electrode. The first bus bar and the second bus bar sandwich the insulating part in a second direction intersecting the first direction.

## Claims

### Claim 1

A semiconductor device comprising:
a plurality of semiconductor chips;
an insulating part surrounding the semiconductor chips;
a first electrode in pressure contact with the semiconductor chips;
a second electrode in pressure contact with the semiconductor chips, the semiconductor chips being sandwiched between the first electrode and the second electrode in a first direction;
a first bus bar connected to the first electrode; and
a second bus bar connected to the second electrode,
wherein the first bus bar and the second bus bar sandwich the insulating part in a second direction intersecting the first direction.

### Claim 2 (depends on 1)

The semiconductor device according to claim 1, wherein
the first bus bar includes a first connection portion connected to the first electrode and a first extension portion extending from the first connection portion,
the second bus bar includes a second connection portion connected to the second electrode and a second extension portion extending from the second connection portion, and
a direction in which the first extension portion extends is a direction opposite to a direction in which the second extension portion extends.

### Claim 3 (depends on 1)

The semiconductor device according to claim 1, wherein
the first bus bar is formed integrally with the first electrode, and
the second bus bar is formed integrally with the second electrode.

### Claim 4 (depends on 1)

The semiconductor device according to claim 1, further comprising:
a first magnetic plate arranged on the first electrode on a side opposite to the semiconductor chips; and
a second magnetic plate arranged on the second electrode on a side opposite to the semiconductor chips,
wherein the first magnetic plate and the second magnetic plate are ferromagnets.

### Claim 5 (depends on 4)

The semiconductor device according to claim 4, further comprising:
a first insulating plate arranged between the first electrode and the first magnetic plate;
a second insulating plate arranged between the second electrode and the second magnetic plate, wherein
the first insulating plate and the second insulating plate are insulators,
the first electrode includes a first base portion connected to the first bus bar and a plurality of first protruding portions protruding from the first base portion in the second direction,
the second electrode includes a second base portion connected to the second bus bar and a plurality of second protruding portions protruding from the second base portion in the second direction,
the semiconductor chips are arranged between each of the first protruding portions and each of the second protruding portions,
the first protruding portions are spaced apart from each other, and
the second protruding portions are spaced apart from each other.

### Claim 6 (depends on 4)

The semiconductor device according to claim 4, wherein
the first magnetic plate includes a first body overlapping with the first electrode and a first projecting portion projecting from the first body,
the second magnetic plate includes a second body overlapping with the second electrode and a second projecting portion projecting from the second body,
the first projecting portion projects toward outside of the first electrode along the first electrode, and
the second projecting portion projects toward outside of the second electrode along the second electrode.

### Claim 7 (depends on 4)

The semiconductor device according to claim 4, wherein
the first magnetic plate and the second magnetic plate are formed of a plurality of electrical steel sheets, and
the electrical steel sheets are stacked in the second direction.