Lead adapters for semiconductor package
AssigneeInfineon Technologies AG
InventorsAjay Poonjal Pai, Tino Karczewski, Adrian Lis
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Abstract
A semiconductor package includes a first semiconductor die, an encapsulant body of electrically insulating mold compound that encapsulates the first semiconductor die, a plurality of power leads that protrude out of the encapsulant body and form power connections with the first semiconductor die, and a signal lead that protrudes out of the encapsulant body and forms a signal connection with the first semiconductor die, wherein the signal lead comprises a lead adapter retention feature that is configured to form an interlocked connection with a lead adapter that is fitted over an outer end of the signal lead.
Claims20
A semiconductor package comprising:
- a first semiconductor die;
- an encapsulant body of electrically insulating mold compound that encapsulates the first semiconductor die;
- a plurality of power leads that protrude out of the encapsulant body and form power connections with the first semiconductor die;
- and
- a signal lead that protrudes out of the encapsulant body and forms a signal connection with the first semiconductor die,
- wherein the signal lead comprises a lead adapter retention feature that is configured to form an interlocked connection with a lead adapter that is fitted over an outer end of the signal lead.
A semiconductor device assembly, comprising:
- a semiconductor package comprising a first semiconductor die, an encapsulant body of electrically insulating mold compound that encapsulates the first semiconductor die, a plurality of power leads that protrude out of the encapsulant body and form power connections to the first semiconductor die, and a signal lead that protrudes out of the encapsulant body and forms a signal connection with the first semiconductor die;
- a signal lead adapter comprising a sleeve that is configured to be fitted over an outer end of the signal lead, and
- wherein the signal lead comprises a signal lead adapter retention feature that is configured to engage with the signal lead adapter so as to reach an interlocked position as the sleeve is fitted over an outer end of the signal lead.
Dependencies are inferred from the claim text.