# US 12,112,971 B2 · Multi-zone semiconductor substrate supports > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,112,971 B2 - Document ID: US12112971B2 - Status: Granted - Kind: B2 - Application number: 17/200,080 - Filed: 2021-03-12 - Published: 2022-09-15 - Granted: 2024-10-08 - Earliest claimed: 2021-03-12 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Ian Bensco - Web page: https://patentgrep.com/patent/US12112971B2 ## CPC - H10P 72/0434: {mainly by convection} - H10P 72/7624: {characterised by the mechanical construction of the susceptor, stage or support} - H10P 72/0432: {mainly by conduction} - H10P 72/7611: {characterised by edge profile or support profile} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract Exemplary support assemblies may include a top puck characterized by a first surface and a second surface opposite the first surface. The top puck may define a recessed ledge at an outer edge of the first surface of the top puck. The assemblies may include a cooling plate coupled with the top puck adjacent the second surface of the top puck. The assemblies may include a back plate coupled with the top puck about an exterior of the top puck. The back plate may at least partially define a volume with the top puck. The cooling plate may be housed within the volume. The assemblies may include a heater disposed on the recessed ledge of the top puck. The assemblies may include an edge ring seated on the heater and extending about the top puck. The edge ring may be maintained free of contact with the top puck. ## Claims ### Claim 1 A substrate support assembly comprising: a top puck characterized by a first surface and a second surface opposite the first surface, wherein the top puck defines a recessed ledge at an outer edge of the first surface of the top puck; a cooling plate coupled with the top puck adjacent the second surface of the top puck; a back plate coupled with the top puck about an exterior of the top puck, wherein the back plate at least partially defines a volume with the top puck, and wherein the cooling plate is housed within the volume; a heater disposed on the recessed ledge of the top puck, wherein: the heater defines an interior volume within which a heating element extends; and the heating element extends through the top puck into the heater; and an edge ring seated on the heater and extending about the top puck, wherein the edge ring is maintained free of contact with the top puck. ### Claim 2 (depends on 1) The substrate support assembly of claim 1, wherein the top puck defines a thermal break between an interior zone and an exterior zone of the top puck, and wherein the thermal break comprises a trench defined about an interior radius of the top puck. ### Claim 3 (depends on 2) The substrate support assembly of claim 2, wherein the trench comprises a first trench defined about an interior radius of the top puck at the first surface of the top puck, and the thermal break comprises a second trench defined about a second interior radius of the top puck at the second surface of the top puck opposite the first surface. ### Claim 4 (depends on 1) The substrate support assembly of claim 1, wherein the edge ring extends vertically above the first surface of the top puck at an outer radius of the edge ring. ### Claim 5 (depends on 4) The substrate support assembly of claim 4, wherein the edge ring recesses beneath the first surface of the top puck at an inner radius of the edge ring. ### Claim 6 (depends on 1) The substrate support assembly of claim 1, wherein the edge ring is characterized by an outer diameter equal to an outer diameter of the top puck. ### Claim 7 (depends on 1) The substrate support assembly of claim 1, wherein the edge ring comprises a skirt extending past an exterior edge of the heater. ### Claim 8 (depends on 1) The substrate support assembly of claim 1, wherein the heater contacts the top puck at two or more standoffs from the heater, wherein one of the two or more standoffs defines an access for the heating element to extend into the heater, and wherein the one of the two or more standoffs defines a channel about the access, the heater further comprising: a gasket seated within the channel about the access. ### Claim 9 (depends on 1) The substrate support assembly of claim 1, wherein the top puck comprises aluminum or a ceramic, and wherein the edge ring comprises nickel at least partially plated on the edge ring. ### Claim 10 A substrate support assembly comprising: a top puck characterized by a first surface and a second surface opposite the first surface, wherein the top puck defines a recessed ledge at an outer edge of the first surface of the top puck; a heater disposed on the recessed ledge of the top puck; a plurality of thermally insulating standoffs that are positioned between the heater and the top puck and that space the heater apart from the top puck; and an edge ring seated on the heater and extending about the top puck, wherein the edge ring is maintained free of contact with the top puck. ### Claim 11 (depends on 10) The substrate support assembly of claim 10, wherein the top puck defines a plurality of recessed ledges at the outer edge of the first surface of the top puck. ### Claim 12 (depends on 11) The substrate support assembly of claim 11, wherein the heater is seated on an outermost recessed ledge of the plurality of recessed ledges, and wherein the heater extends vertically beyond an interior recessed ledge of the plurality of recessed ledges. ### Claim 13 (depends on 12) The substrate support assembly of claim 12, wherein the heater defines a recessed ledge at an interior edge of the heater, and wherein a channel is formed between the recessed ledge of the heater and the interior recessed ledge of the plurality of recessed ledges of the top puck. ### Claim 14 (depends on 13) The substrate support assembly of claim 13, wherein the edge ring extends within the channel, and wherein an interior edge of the edge ring is disposed vertically recessed from the first surface of the top puck. ### Claim 15 (depends on 10) The substrate support assembly of claim 10, wherein the heater defines an interior volume within which a heating element extends. ### Claim 16 (depends on 15) The substrate support assembly of claim 15, wherein the heater comprises: a body defining the interior volume in which the heating element extends, and a lid coupled with the body, wherein the heating element is in direct contact with the lid about the heater. ### Claim 17 A substrate support assembly comprising: a top puck characterized by a first surface and a second surface opposite the first surface, wherein the top puck defines a recessed ledge at an outer edge of the first surface of the top puck; a heater disposed on the recessed ledge of the top puck, wherein the heater comprises: a body defining an interior volume in which a heating element extends, and a lid coupled with the body, wherein the heating element is in direct contact with the lid about the heater; and an edge ring seated on the heater and extending about the top puck, wherein the edge ring is maintained free of contact with the top puck. ### Claim 18 (depends on 17) The substrate support assembly of claim 17, wherein the heater contacts the top puck at two or more standoffs from the heater, wherein one of the two or more standoffs defines an access for the heating element to extend into the heater, and wherein the one of the two or more standoffs defines a channel about the access, the heater further comprising: a gasket seated within the channel about the access.