# US 12,112,964 B2 · Chip carrier, chip testing module, and chip handling module

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- Number: US 12,112,964 B2
- Document ID: US12112964B2
- Status: Granted
- Kind: B2
- Application number: 17/679,158
- Filed: 2022-02-24
- Published: 2022-09-01
- Granted: 2024-10-08
- Earliest claimed: 2021-02-26
- Assignees: Chroma Ate Inc.
- Applicants: Sheng-Hung Wang; Po-Hsiang Chang; Zhe-Min Liao
- Inventors: Sheng-Hung Wang; Po-Hsiang Chang; Zhe-Min Liao
- Web page: https://patentgrep.com/patent/US12112964B2

## CPC

- H10P 72/16: {Trays for chips}
- B25J 15/0616: {with vacuum}
- G01R 31/2874: {related to temperature}
- G01R 31/2893: {Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00)}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B25J: MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES ({manipulators specially adapted for use in surgery A61B34/70; manipulators used in cleaning hollow articles B08B9/04}; manipulators associated with rolling mills B21B39/20; manipulators associated with forging machines B21J13/10; {manipulators associated with picking-up and placing mechanisms B23P19/007}; means for holding wheels or parts thereof B60B30/00; {vehicles with ground-engaging propulsion means, e.g. walking members B62D57/02, B62D57/032; devices for picking-up and depositing articles or materials between conveyors B65G47/90, B65G47/91; manipulators with gripping or holding means for transferring packages B65H67/065}; cranes B66C; {manipulators used in the protection or supervision of pipe-line installations F17D5/00; walking equipment adapted for nuclear steam-generators F22B37/006}; manipulators specially adapted for, or associated with, nuclear reactors G21C; {apparatus used for handling wafers during manufacture or treatment of semiconductor H10P72/50})
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

The invention provides a chip carrier, a chip testing module and a chip handling module. The chip carrier for carrying a plurality of chips comprises a main body with an upper surface and a lower surface. The main body has a plurality of air guide holes, and two ends of each air guide hole are respectively exposed on the upper surface and the lower surface. A part of the air guide holes are defined as a first group, and the air guide holes of the first group are connected. The main body is made of conductive material.

## Claims

### Claim 1

A chip carrier for carrying a plurality of chips, comprising:
a main body with an upper surface and a lower surface;
wherein the main body has a plurality of air guide holes, and two ends of each air guide hole are respectively exposed on the upper surface and the lower surface;
wherein a part of the air guide holes are defined as a first group, and the air guide holes of the first group are connected;
wherein the main body is made of conductive material,
wherein the main body has a first recess, and the first recess is used to connect with the air guide holes of the first group.

### Claim 2 (depends on 1)

The chip carrier according to claim 1, wherein the first recess is exposed on the lower surface.

### Claim 3 (depends on 2)

The chip carrier according to claim 2, wherein the main body has a first positioning hole and a second positioning hole, the first positioning hole and the second positioning hole are exposed on the lower surface, and the first recess is formed between the first positioning hole and the second positioning hole.

### Claim 4 (depends on 1)

The chip carrier according to claim 1, wherein a plurality of accommodating positions are defined on the upper surface, each of the accommodating positions has one of the air guide holes, and each of the accommodating positions is corresponded to one of the chips.

### Claim 5 (depends on 4)

The chip carrier according to claim 4, wherein when one of the accommodating positions accommodates the corresponding chip, the chip covers the air guide hole within the accommodating position.

### Claim 6 (depends on 4)

The chip carrier according to claim 4, wherein the main body is provided with a first upper guide groove and a second upper guide groove, the first upper guide groove and the second upper guide groove are exposed on the upper surface, and the accommodating positions are located between the first upper guide groove and the second upper guide groove.

### Claim 7 (depends on 4)

The chip carrier according to claim 4, wherein each of the accommodating positions is a recess, and the recess encircles one of the air guide holes.