# US 12,112,962 B2 · Arrangement apparatus and arrangement method

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- Number: US 12,112,962 B2
- Document ID: US12112962B2
- Status: Granted
- Kind: B2
- Application number: 17/599,535
- Filed: 2020-08-20
- Published: 2022-10-06
- Granted: 2024-10-08
- Earliest claimed: 2020-08-20
- Assignees: Kabushiki Kaisha Shinkawa
- Applicants: Shinkawa Ltd.
- Inventors: Kohei Seyama
- Web page: https://patentgrep.com/patent/US12112962B2

## CPC

- H10P 72/0606: {Position monitoring, e.g. misposition detection or presence detection}
- G03F 7/70433: {Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors}
- G03F 7/70691: {Handling of masks or workpieces}
- H10P 72/53: {using optical controlling means}
- H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10W 72/071: {Connecting or disconnecting}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An arrangement apparatus includes a stage, an arrangement part, and a control part. The stage supports a substrate. The arrangement part holds a die and arranges multiple dies on the substrate supported by the stage. The control part has a map data indicating arrangement positions of the dies and generated based on a positional relationship among patterns formed by an exposure apparatus, and controls, based on the map data, relative positions between the stage and the arrangement part when arranging the dies on the substrate.

## Claims

### Claim 1

An arrangement apparatus which arranges a plurality of dies on a substrate in correspondence with a plurality of patterns so as to bond to a wafer having the patterns formed by an exposure apparatus, the arrangement apparatus comprising:
a stage which supports the substrate;
an arrangement part which holds the die and arranges the dies on the substrate supported by the stage; and
a control part which has a map data indicating arrangement positions of the dies and generated based on a positional relationship among the patterns formed by the exposure apparatus, and controls, based on the map data, relative positions between the stage and the arrangement part when arranging the dies on the substrate.

### Claim 2 (depends on 1)

The arrangement apparatus according to claim 1, wherein, based on a deviation amount of positions between the dies and the patterns acquired in a state in which the dies arranged on the substrate and the wafer are bonded together, the control part updates the map data to cancel out the deviation amount.

### Claim 3 (depends on 1)

The arrangement apparatus according to claim 1, wherein
in each shot which comprises the patterns, the exposure apparatus forms the patterns on the wafer,
the map data comprises a positional relationship among the shots, and
the control part arranges the dies on the substrate based on the positional relationship among the shots.

### Claim 4 (depends on 2)

The arrangement apparatus according to claim 2, wherein
in each shot which comprises the patterns, the exposure apparatus forms the patterns on the wafer,
the map data comprises a positional relationship among the shots, and
the control part arranges the dies on the substrate based on the positional relationship among the shots.

### Claim 5

An arrangement method of arranging a plurality of dies on a substrate in correspondence with a plurality of patterns so as to bond to a wafer having the patterns formed by an exposure apparatus, the arrangement method comprising:
a step of acquiring a map data indicating arrangement positions of the dies based on measurement of positions of the patterns on the wafer on which the patterns are formed by the exposure apparatus; and
a step of arranging the dies on the substrate based on the acquired map data.

### Claim 6 (depends on 5)

The arrangement method according to claim 5, further comprising:
a step of acquiring a deviation amount of positions between the dies and the patterns in a state in which the dies arranged on the substrate and the wafer are bonded together; and
a step of updating the map data to cancel out the deviation amount.

### Claim 7 (depends on 5)

The arrangement method according to claim 5, wherein
in each shot which comprises the patterns, the exposure apparatus forms the patterns on the wafer,
the map data comprises a positional relationship among the shots, and
in the arranging step, the dies are arranged on the substrate based on the positional relationship among the shots.

### Claim 8 (depends on 6)

The arrangement method according to claim 6, wherein
in each shot which comprises the patterns, the exposure apparatus forms the patterns on the wafer,
the map data comprises a positional relationship among the shots, and
in the arranging step, the dies are arranged on the substrate based on the positional relationship among the shots.