# US 12,112,929 B2 · Cathode unit for magnetron sputtering apparatus and magnetron sputtering apparatus

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- Number: US 12,112,929 B2
- Document ID: US12112929B2
- Status: Granted
- Kind: B2
- Application number: 17/891,809
- Filed: 2022-08-19
- Published: 2023-05-04
- Granted: 2024-10-08
- Earliest claimed: 2021-10-29
- Assignees: Ulvac, Inc.
- Applicants: Ulvac, Inc.
- Inventors: Koji Suzuki; Hideto Nagashima; Katsuya Hara; Hideki Mataga
- Web page: https://patentgrep.com/patent/US12112929B2

## CPC

- H01J 37/3435: {Target holders (includes backing plates and endblocks)}
- C23C 14/3407: {Cathode assembly for sputtering apparatus, e.g. Target}
- C23C 14/35: by application of a magnetic field, e.g. magnetron sputtering {(C23C14/3457 takes precedence)}
- H01J 37/3405: {Magnetron sputtering}
- H01J 37/3408: {Planar magnetron sputtering}
- H01J 37/345: {Magnet arrangements in particular for cathodic sputtering apparatus (material of magnets or magnets in general H01F1/00, H01F7/00)}
- H01J 37/3497: {Temperature of target}
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)

## Abstract

A cathode unit for a magnetron sputtering apparatus includes a backing plate joined to an upper side opposed to a sputtering surface of a target set in a posture facing an inside of a vacuum chamber and a magnet unit disposed above the backing plate at an interval, a refrigerant passage through which a refrigerant can flow being formed in the backing plate, in which a surface pressure applying unit is provided, the surface pressure applying unit applying, toward an upper outer surface of the backing plate from above the backing plate, a surface pressure equivalent to pressure applied to an upper inner surface of the backing plate when the refrigerant is circulated.

## Claims

### Claim 1

A cathode unit for a magnetron sputtering apparatus comprising:
a backing plate joined to an upper side opposed to a sputtering surface of a target set in a posture facing an inside of a vacuum chamber and comprising two support plates that are joined together, wherein a refrigerant passage is formed by the two support plates; and
a magnet unit disposed above the backing plate at an interval, the refrigerant passage through which a refrigerant configured to flow at a first pressure on an upper inner surface of the backing plate by an inflow port and an outflow port,
wherein a surface pressure applying unit is provided, the surface pressure applying unit applying, toward an upper outer surface of the backing plate at a second pressure on the upper outer surface, the second pressure equivalent to the first pressure by the refrigerant applied to the upper inner surface of the backing plate when the refrigerant is circulated, and
wherein the surface pressure applying unit includes a magnet case filled with the refrigerant and having a sealed structure that is connected to an upper outer surface of the backing plate and that stores the magnet unit, and the refrigerant is directly contacting the magnet case,
wherein a circulating unit that is connected to the magnet case is provided, the refrigerant between the magnet case and a fluid supplying unit being circulated to flow at the second pressure on the upper outer surface of the backing plate by an inflow port and an outflow port,
the magnet case, the inflow port, and the outflow port connects a chiller unit of the circulating unit and the upper outer surface backing plate.

### Claim 2 (depends on 1)

The cathode unit for the magnetron sputtering apparatus according to claim 1, wherein the surface pressure applying unit includes the fluid supplying unit that enables supply of refrigerant into the magnet case.

### Claim 3 (depends on 1)

The magnetron sputtering apparatus comprising: the cathode unit for the magnetron sputtering apparatus according to claim 1;
a vacuum chamber in which the target of the cathode unit is set in a posture facing the inside of the vacuum chamber and a substrate to be treated is disposed in a space in front of the sputtering surface;
a sputtering power supply that supplies power to the target; and a gas introducing unit that enables introduction of a sputtering gas into the vacuum chamber in a vacuum atmosphere.