Chip resistor

A chip resistor, comprising:

• a substrate including an upper surface, a back surface, and a side surface, the upper surface and the back surface intersecting a thickness-wise direction, and the side surface joining the upper surface and the back surface;
• an upper electrode and a resistor body formed on the upper surface;
• a back electrode formed on the back surface;
• a side electrode formed on the side surface;
• and
• a metal plating layer including a back plating layer covering at least a portion of the back electrode and a side plating layer covering at least a portion of the side electrode, wherein the metal plating layer has a thickness that is greater than or equal to 10 μm and less than or equal to 60 μm, wherein
• the substrate includes a corner joining the back surface and the side surface,
• the corner includes an inclined surface intersecting the back surface and the side surface, and
• the metal plating layer includes a portion that covers the corner and is roundly curved.