# US 12,112,867 B2 · Multilayered substrate

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- Number: US 12,112,867 B2
- Document ID: US12112867B2
- Status: Granted
- Kind: B2
- Application number: 17/495,850
- Filed: 2021-10-07
- Published: 2022-01-27
- Granted: 2024-10-08
- Earliest claimed: 2019-07-10
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Nobuyuki Tenno; Nobuo Ikemoto; Takahiro Baba
- Web page: https://patentgrep.com/patent/US12112867B2

## CPC

- H01B 7/0838: {Parallel wires, sandwiched between two insulating layers}
- H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}
- H01B 11/203: {forming a flat arrangement}
- H01P 3/08: Microstrips; Strip lines
- H05K 1/024: {Dielectric details, e.g. changing the dielectric material around a transmission line}
- H05K 3/4635: {laminating flexible circuit boards using additional insulating adhesive materials between the boards}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H05K 1/0245: {Lay-out of balanced signal pairs, e.g. differential lines or twisted lines}
- H05K 1/148: {Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 2201/0141: Liquid crystal polymer [LCP]
- H05K 2201/015: Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
- H05K 2201/0154: Polyimide
- H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
- H05K 2201/10037: Printed or non-printed battery
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A multilayered substrate includes first, second, and third insulating layers, and a transmission line. The first insulating layer includes first and second surfaces opposite to each other. A signal conductor of the transmission line is on the first surface of the first insulating layer. The second insulating layer is in contact with the first surface of the first insulating layer. The third insulating layer is in contact with the second surface of the first insulating layer. A dielectric loss of the second insulating layer is lower than a dielectric loss of the third insulating layer. A degree of close contact between the first insulating layer and the third insulating layer is higher than a degree of close contact between the first insulating layer and the second insulating layer.

## Claims

### Claim 1

A multilayered substrate comprising:
a plurality of laminated insulating layers including a first insulating layer, a second insulating layer, a third insulating layer, a fourth insulating layer, and a fifth insulating layer; and
a transmission line; wherein
the first insulating layer includes a first surface and a second surface that are opposite to each other;
a signal conductor of the transmission line is provided on the first surface of the first insulating layer;
the second insulating layer is in contact with the first surface of the first insulating layer;
the third insulating layer is in contact with the second surface of the first insulating layer;
a dielectric loss of the second insulating layer is lower than a dielectric loss of the third insulating layer;
a degree of close contact between the first insulating layer and the third insulating layer is higher than a degree of close contact between the first insulating layer and the second insulating layer;
a material of each of the first insulating layer, the second insulating layer, and the third insulating layer is different from one another;
a boundary surface between the first insulating layer and the second insulating layer is closer to a center in a lamination direction than is a boundary surface between the first insulating layer and the third insulating layer;
the fourth insulating layer is in contact with a surface of the second insulating layer opposite to a surface with which the first insulating layer is in contact;
the fifth insulating layer is in contact with a surface of the third insulating layer opposite to a surface with which the first insulating layer is in contact;
a boundary surface between the second insulating layer and the fourth insulating layer is closer to the center in the lamination direction than is a boundary surface between the first insulating layer and the third insulating layer; and
the degree of close contact between the first insulating layer and the third insulating layer is higher than a degree of close contact between the second insulating layer and the fourth insulating layer.

### Claim 2 (depends on 1)

The multilayered substrate according to claim 1, further comprising a bent portion in which the multilayered substrate is bent in a lamination direction.

### Claim 3 (depends on 2)

The multilayered substrate according to claim 2, wherein a Young's modulus of the third insulating layer is lower than a Young's modulus of the second insulating layer.

### Claim 4 (depends on 1)

The multilayered substrate according to claim 1, wherein
the boundary surface between the second insulating layer and the fourth insulating layer is closer to the center in the lamination direction than is a boundary surface between the third insulating layer and the fifth insulating layer; and
a degree of close contact between the third insulating layer and the fifth insulating layer is higher than the degree of close contact between the second insulating layer and the fourth insulating layer.

### Claim 5 (depends on 4)

The multilayered substrate according to claim 4, wherein the fourth and fifth insulating layers are made of polyimide, modified-polyphenylene ether, or liquid crystal polymer.

### Claim 6 (depends on 1)

The multilayered substrate according to claim 1, further comprising:
a first ground conductor; wherein
the first insulating layer is between the signal conductor and the first ground conductor in a lamination direction.

### Claim 7 (depends on 1)

The multilayered substrate according to claim 1, further comprising:
a ground conductor; wherein
the second insulating layer is between the signal conductor and the ground conductor in a lamination direction.

### Claim 8 (depends on 1)

The multilayered substrate according to claim 1, wherein the first insulating layer is made of polyimide, modified-polyphenylene ether, or liquid crystal polymer.

### Claim 9 (depends on 1)

The multilayered substrate according to claim 1, wherein the second and third insulating layers are bonding material layers.

### Claim 10 (depends on 1)

The multilayered substrate according to claim 1, wherein the second insulating layer is a fluorine resin layer.

### Claim 11

A multilayered substrate comprising:
a plurality of laminated insulating layers including a first insulating layer, a second insulating layer, and a third insulating layer; and
a transmission line; wherein the first insulating layer includes a first surface and a second surface that are opposite to each other;
a signal conductor of the transmission line is provided on the first surface of the first insulating layer;
the second insulating layer is in contact with the first surface of the first insulating layer;
the third insulating layer is in contact with the second surface of the first insulating layer;
a dielectric loss of the second insulating layer is lower than a dielectric loss of the third insulating layer;
a degree of close contact between the first insulating layer and the third insulating layer is higher than a degree of close contact between the first insulating layer and the second insulating layer;
a material of each of the first insulating layer, the second insulating layer, and the third insulating layer is different from one another;
a boundary surface between the first insulating layer and the second insulating layer is closer to a center in a lamination direction than is a boundary surface between the first insulating layer and the third insulating layer; and
the third insulating layer is a prepreg layer made of polyimide or liquid crystal polymer.

### Claim 12

A multilayered substrate comprising:
a plurality of laminated insulating layers including a first insulating layer, a second insulating layer, a third insulating layer, a fourth insulating layer, and a fifth insulating layer; and
a transmission line; wherein the first insulating layer includes a first surface and a second surface that are opposite to each other;
a signal conductor of the transmission line is provided on the first surface of the first insulating layer;
the second insulating layer is in contact with the first surface of the first insulating layer;
the third insulating layer is in contact with the second surface of the first insulating layer;
a dielectric loss of the second insulating layer is lower than a dielectric loss of the third insulating layer;
a degree of close contact between the first insulating layer and the third insulating layer is higher than a degree of close contact between the first insulating layer and the second insulating layer;
a material of each of the first insulating layer, the second insulating layer, and the third insulating layer is different from one another;
a boundary surface between the first insulating layer and the second insulating layer is closer to a center in a lamination direction than is a boundary surface between the first insulating layer and the third insulating layer;
the fourth insulating layer is in contact with a surface of the second insulating layer opposite to a surface with which the first insulating layer is in contact;
the fifth insulating layer is in contact with a surface of the third insulating layer opposite to a surface with which the first insulating layer is in contact;
a boundary surface between the second insulating layer and the fourth insulating layer is closer to the center in the lamination direction than is a boundary surface between the first insulating layer and the third insulating layer;
the degree of close contact between the first insulating layer and the third insulating layer is higher than a degree of close contact between the second insulating layer and the fourth insulating layer; and
the fourth and fifth insulating layers are made of polyimide, modified-polyphenylene ether, or liquid crystal polymer.