# US 12,112,110 B2 · Multi-physics co-simulation method of power semiconductor modules > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,112,110 B2 - Document ID: US12112110B2 - Status: Granted - Kind: B2 - Application number: 17/890,354 - Filed: 2022-08-18 - Published: 2023-02-23 - Granted: 2024-10-08 - Earliest claimed: 2021-08-20 - Assignees: Huazhong University of Science and Technology; Shenzhen Union Semiconductor Co., LTD - Applicants: Huazhong University of Science and Technology; Shenzhen Union Semiconductor Co., LTD - Inventors: Zhiqiang Wang; Yayong Yang; Yuxin Ge; Guoqing Xin; Xiaojie Shi - Web page: https://patentgrep.com/patent/US12112110B2 ## CPC - G06F 30/367: Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods - G06F 30/31: Design entry, e.g. editors specifically adapted for circuit design - G06F 30/398: Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM] (optical proximity correction [OPC] design processes G03F1/36) - G06F 2119/06: Power analysis or power optimisation - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract The present invention belongs to the technical field of simulation of power semiconductor modules, and discloses a multi-physics co-simulation method of a power semiconductor module. The multi-physics co-simulation method of the power semiconductor module comprises: adopting professional circuit simulation software PSpice supporting a spice model to be imported into a device, and by designing a specific collaborative analysis method and performing secondary development of a software data exchange interface, i.e. constructing a coupling interface of co-simulation, performing electricity-heat-force co-simulation of two types of software PSpice and COMSOL by adopting an indirect coupling manner. The simulation time is greatly shortened, and the simulation efficiency is improved. ## Claims ### Claim 1 A multi-physics co-simulation method of a power semiconductor module, comprising the following steps: step 1, predefining parameters, performing a circuit simulation under a given initial temperature in a PSpice, and suspending circuit simulation when a preset step length of data exchange is reached; step 2, calculating a power loss data by adopting a power loss calculation method in a MATLAB, and transmitting power loss data into a COMSOL; step 3, performing a heat-force simulation in the COMSOL, and suspending heat-force simulation when the preset step length of data exchange is reached; step 4, feeding back an extracted parameter of a junction temperature to a circuit model of the PSpice by the MATLAB; and taking the parameter of junction temperature as a new initial value, and continuing to perform simulation of a next time step length of data exchange based on a former state; step 5, taking a state when a former loop is terminated as the initial state of a next loop, iterating to perform dynamic continuous multi-physics simulation, and terminating co-simulation when an iteration termination condition is met; wherein the multi-physics co-simulation method of the power semiconductor module further comprises: enabling a time step length of data exchange of the PSpice and the COMSOL to be equal to the time step length of data exchange of the COMSOL and the PSpice; and setting different time step lengths of data exchange to control a rate of the circuit simulation and a rate of the heat-force simulation, and performing multi-rate multi-physics coupling simulation; the step of setting the different time step lengths of data exchange comprises the following steps: constructing a first-order variable step length three-point numerical differentiation formula based on a Lagrange function by extracting and iterating numerical solutions of temperature coupling state variables of nodes, and calculating and obtaining a first-order derivative of an interpolation function of a current node: L n ′ ( t i ) = λ i λ i - 1 ( λ i - 1 + λ i ) ⁢ T ⁡ ( t i - 2 ) - λ i - 1 + λ i λ i - 1 ⁢ λ i ⁢ T ⁡ ( t i - 1 ) + λ i - 1 + 2 ⁢ λ i λ i ( λ i - 1 + λ i ) ⁢ t ⁡ ( t i ) wherein ti−2, ti−1, ti represent three adjacent continuous data exchange time points; ti represents a current time node; the relational expressions: ti−1=ti−2+λi−1, and ti=ti−2+λi−1+λi are met; T(ti−2), T(ti−1) and T(ti) represent corresponding numerical solutions of temperature at ti−2, ti−1, ti; and λi and λi−1 represent time step lengths; a step length adjustment strategy is established according to the first-order derivative of the interpolation function of the current node; and a step length decision interval is set as [ε1, ε2], and step length adjustment coefficients are set as a and b respectively, wherein a∈(0,1), b∈(1,+∞), and the following conditions are met: (1) if |L′n(ti)|∈[ε1, ε2], λi+1=λi; (2) if |L′n(ti)|≤ε1, λi+1=λi×b; and a time step length of data exchange is appropriately increased; and (3) if |L′n(ti)|≥ε2, λi+1=λi×a; and a step length is decreased. ### Claim 2 (depends on 1) An information data processing terminal, comprising a memory and a processor, wherein a computer program is stored in the memory; and when the computer program is executed by the processor, the processor is configured to execute the multi-physics co-simulation method of the power semiconductor module of claim 1. ### Claim 3 (depends on 1) A non-transitory computer readable storage medium, storing a computer program, wherein when the computer program is executed by a processor, the processor is enabled to execute the multi-physics co-simulation method of power semiconductor module according to claim 1.