# US 12,112,006 B2 · Input sensing panel, display device having the same, and method of manufacturing the display device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,112,006 B2
- Document ID: US12112006B2
- Status: Granted
- Kind: B2
- Application number: 18/227,754
- Filed: 2023-07-28
- Published: 2023-11-23
- Granted: 2024-10-08
- Earliest claimed: 2021-06-23
- Assignees: Samsung Display Co., Ltd.
- Applicants: Samsung Display Co., Ltd.
- Inventors: Jin-Su Byun; Woongsik Kim
- Web page: https://patentgrep.com/patent/US12112006B2

## CPC

- G06F 3/0445: {using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer}
- G06F 3/0446: {using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes}
- G06F 3/0412: {Digitisers structurally integrated in a display}
- G06F 3/0443: {using a single layer of sensing electrodes}
- H10K 59/40: OLEDs integrated with touch screens
- G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
- G06F 2203/04111: Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
- G06F 2203/04112: Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
- G09G 3/3233: with pixel circuitry controlling the current through the light-emitting element
- G09G 2300/0426: Layout of electrodes and connections
- G09G 2300/0809: Several active elements per pixel in active matrix panels
- G09G 2320/0238: Improving the black level
- H10K 59/122: Pixel-defining structures or layers, e.g. banks
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- G09G: ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION (arrangements for transferring data between digital computers and displays G06F3/14; static indicating arrangements comprising an association of a number of separate sources or light control cells G09F9/00; static indicating arrangements comprising integral associations of a number of light sources H01J, H01K, H10H, H05B33/12; scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission, details thereof H04N1/00)

## Abstract

A method of manufacturing a display device, including forming a first sensing insulating layer on a display panel comprising an active area and a peripheral area; forming a first conductive layer on the first sensing insulating layer; forming a second sensing insulating layer to cover the first conductive layer; forming a second conductive layer comprising a conductive material on the second sensing insulating layer; forming a passivation layer on the second conductive layer; substantially simultaneously etching the second conductive layer and the passivation layer through a photolithography process; and forming a third sensing insulating layer to cover the passivation layer. The passivation layer includes an inorganic material.

## Claims

### Claim 1

A method of manufacturing a display device, comprising:
forming a first sensing insulating layer on a display panel comprising an active area and a peripheral area;
forming a first conductive layer on the first sensing insulating layer;
forming a second sensing insulating layer to cover the first conductive layer;
forming a second conductive layer comprising a conductive material on the second sensing insulating layer;
forming a passivation layer on the second conductive layer;
substantially simultaneously etching the second conductive layer and the passivation layer through a photolithography process; and
forming a third sensing insulating layer to cover the passivation layer,
wherein the passivation layer comprises an inorganic material.

### Claim 2 (depends on 1)

The method of claim 1, wherein, when the second conductive layer and the passivation layer are substantially simultaneously etched, at least a portion of the second sensing insulating layer is removed to form a side surface of the second sensing insulating layer, which is aligned with a side surface of the second conductive layer.

### Claim 3 (depends on 2)

The method of claim 2, further comprising forming a contact hole through the first sensing insulating layer and the second sensing insulating layer in the peripheral area after the forming of the second sensing insulating layer and before the forming of the second conductive layer.

### Claim 4 (depends on 3)

The method of claim 3, further comprising removing the passivation layer in an area overlapping the contact hole to expose the second conductive layer after the second conductive layer and the passivation layer are substantially simultaneously etched.
