# US 12,111,811 B2 · EDA pad package library updating/application method and system, medium and terminal

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- Number: US 12,111,811 B2
- Document ID: US12111811B2
- Status: Granted
- Kind: B2
- Application number: 17/262,447
- Filed: 2018-09-28
- Published: 2021-09-30
- Granted: 2024-10-08
- Earliest claimed: 2018-07-25
- Assignees: Vayo (Shanghai) Technology Co., Ltd.
- Applicants: Vayo (Shanghai) Technology Co., Ltd.
- Inventors: Shengjie Qian; Fengshou Liu
- Web page: https://patentgrep.com/patent/US12111811B2

## CPC

- G06F 16/23: Updating
- G06F 30/39: Circuit design at the physical level (physical level design for reconfigurable circuits G06F30/347)
- G06F 16/953: Querying, e.g. by the use of web search engines
- G06F 30/31: Design entry, e.g. editors specifically adapted for circuit design
- G06F 30/394: Routing (G06F30/396 takes precedence)
- G06F 2111/02: CAD in a network environment, e.g. collaborative CAD or distributed simulation
- G06F 2111/20: Configuration CAD, e.g. designing by assembling or positioning modules selected from libraries of predesigned modules
- G06F 2113/18: Chip packaging
- G06F 2115/12: Printed circuit boards [PCB] or multi-chip modules [MCM]
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)

## Abstract

An EDA pad package library updating/application method and system, a medium, and a terminal. The method includes: extracting a graphic data of a pad and setting information of a component based on the pad from an EDA wiring data; querying and downloading a graphic model of the component according to attribute information of the component; forming a simulated package pad by simulating and assembling the graphical model of the component and the graphical data of the pad according to setting information of the component based on the pad; storing the simulated package pad in a model database, updating an existed EDA pad package library by associating the simulated package pad to a predetermined keyword/words in the model database. A package pad created by others can be quickly obtained without a package pad library. The best pads that have been verified can be updated continuously and quickly.

## Claims

### Claim 1

An EDA pad package library updating method, comprising:
extracting a graphic data of a pad and setting information of a component based on the pad from an EDA wiring data, wherein the setting information of the component based on the pad comprises a placement angle of the component in the pad;
querying and downloading a graphic model of the component according to attribute information of the component;
forming a simulated package pad by simulating and assembling the graphical model of the component and the graphical data of the pad according to the setting information of the component based on the pad, by drawing the graphical model of the component onto the pad according to the placement angle of the component in the pad, wherein in response to determining the placement angle cannot make all pins of the component hit the pad, the placement angle is first adjusted by 90 degrees to see if all the pins hit the pad; and then in response to determining the adjusted placement angle still cannot make all the pins hit the pad, the adjusted placement angle is adjusted in increments of 1 degree until all the pins hit the pad; and
storing the simulated package pad in a model database, and updating an existed EDA pad package library by associating the simulated package pad to a predetermined keyword/words in the model database.

### Claim 2 (depends on 1)

The EDA pad package library updating method according to claim 1, further comprising:
uploading the updated EDA pad package library to a server.

### Claim 3 (depends on 1)

The EDA pad package library updating method according to claim 1, wherein:
the attribute information of the component includes a manufacturer name and a manufacturer code of the component, or a bill of material; and
the setting information of the component based on the pad includes coordinate information of the component on the pad and the placement angle of the component in the pad.

### Claim 4 (depends on 3)

The EDA pad package library updating method according to claim 3, wherein said querying and downloading of the graphic model of the component according to the attribute information of the component comprises:
querying and downloading the graphic model of the component from the model database according to the manufacturer name and the manufacturer code of the component, or according to the bill of material.

### Claim 5 (depends on 3)

The EDA pad package library updating method according to claim 3, wherein said updating of the existed EDA pad package library comprises:
creating the package pad stored in the model database or updating the package pad stored in the model database to the EDA pad package library by using an API interface of the EDA.

### Claim 6 (depends on 1)

An application method based on the EDA pad package library updating method according to claim 1, comprising:
sending a connection request from a client terminal to a server to be uploaded, wherein the EDA pad packaging library is stored on the server; and
querying a corresponding EDA pad package library according to attribute information of the pad or a keyword/words of the pad.

### Claim 7 (depends on 1)

The EDA pad package library updating method according to claim 1, wherein the setting information of the component based on the pad further comprises coordinate information of the component on the pad.

### Claim 8 (depends on 7)

The EDA pad package library updating method according to claim 7, wherein before drawing the graphical model of the component onto the pad, the method further comprises finding a position on the graphical data of the pad according to the coordinate information of the component on the pad.

### Claim 9 (depends on 1)

The EDA pad package library updating method according to claim 1, the simulated package pad comprises one or more of a pad layer, a silk screen layer, a solder resist layer, and a keepout layer.

### Claim 10

An EDA pad package library updating system, comprising:
an extraction module for extracting a graphic data of a pad and setting information of a component based on the pad from an EDA wiring data, wherein the setting information of the component based on the pad comprises a placement angle of the component in the pad;
a query download module for querying and downloading a graphic model of the component according to attribute information of the component;
a simulation module for forming a simulated package pad by simulating and assembling the graphical model of the component and the graphical data of the pad according to the setting information of the component based on the pad, by drawing the graphical model of the component onto the pad according to the placement angle of the component in the pad, wherein in response to determining the placement angle cannot make all pins of the component hit the pad, the placement angle is first adjusted by 90 degrees to see if all the pins hit the pad; and then in response to determining the adjusted placement angle still cannot make all the pins hit the pad, the adjusted placement angle is adjusted in increments of 1 degree until all the pins hit the pad;
a storage module for storing the simulated package pad in a model database; and
an association module for updating an existed EDA pad package library by associating the simulated package pad to a predetermined keyword/words in the model database.

### Claim 11 (depends on 10)

An application system based on the EDA pad package library updating system according to claim 10, comprising:
a communication module for sending a connection request from a client terminal to a server to be uploaded, wherein the EDA pad packaging library is stored on the server; and
a query module for querying a corresponding EDA pad package library according to attribute information of the pad or a keyword/words of the pad.

### Claim 12 (depends on 7)

A non-transitory storage medium storing a computer program, when executed by a processor, the computer program causes the processor to implement an EDA pad package library updating method or the application method based on the EDA pad package library updating method according to claim 7, wherein the EDA pad package library updating method comprises:
extracting a graphic data of a pad and setting information of a component based on the pad from an EDA wiring data;
querying and downloading a graphic model of the component according to attribute information of the component;
forming a simulated package pad by simulating and assembling the graphical model of the component and the graphical data of the pad through the setting information of the component based on the pad, by drawing the graphical model of the component onto the pad according to the placement angle of the component in the pad, wherein in response to determining the placement angle cannot make all pins of the component hit the pad, the placement angle is first adjusted by 90 degrees to see if all the pins hit the pad; and then in response to determining the adjusted placement angle still cannot make all the pins hit the pad, the adjusted placement angle is adjusted in increments of 1 degree until all the pins hit the pad; and
storing the simulated package pad in a model database, and updating an existed EDA pad package library by associating according to a predetermined keyword/word in the model database.

### Claim 13 (depends on 7)

A terminal, comprising a processor and a memory; wherein
the memory is configured to store a computer program, and the processor is configured to execute the computer program stored in the memory, such that the terminal implements an EDA pad package library updating method or the application method based on the EDA pad package library updating method according to claim 7, wherein the EDA pad package library updating method comprises:
extracting a graphic data of a pad and setting information of a component based on the pad from an EDA wiring data;
querying and downloading a graphic model of the component according to attribute information of the component;
forming a simulated package pad by simulating and assembling the graphical model of the component and the graphical data of the pad through the setting information of the component based on the pad, by drawing the graphical model of the component onto the pad according to the placement angle of the component in the pad, wherein in response to determining the placement angle cannot make all pins of the component hit the pad, the placement angle is first adjusted by 90 degrees to see if all the pins hit the pad; and then in response to determining the adjusted placement angle still cannot make all the pins hit the pad, the adjusted placement angle is adjusted in increments of 1 degree until all the pins hit the pad; and
storing the simulated package pad in a model database, and updating an existed EDA pad package library by associating according to a predetermined keyword/word in the model database.