# US 12,111,527 B2 · Display device, apparatus for manufacturing the same, and method of manufacturing the display device

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- Number: US 12,111,527 B2
- Document ID: US12111527B2
- Status: Granted
- Kind: B2
- Application number: 17/477,695
- Filed: 2021-09-17
- Published: 2022-06-02
- Granted: 2024-10-08
- Earliest claimed: 2020-12-01
- Assignees: Samsung Display Co., Ltd.
- Applicants: Samsung Display Co., Ltd.
- Inventors: Hyeon Deuk Hwang; Yunjeong Cho; Kyunghoon Chae; Simhee Ryu; Je Yoon Yoo; Sung Soo Lee
- Web page: https://patentgrep.com/patent/US12111527B2

## CPC

- H10W 90/00: Package configurations
- G02F 1/1303: {Apparatus specially adapted to the manufacture of LCDs}
- G02F 1/133351: {Manufacturing of individual cells out of a plurality of cells, e.g. by dicing}
- G02F 1/133354: {Arrangements for aligning or assembling substrates}
- H10K 59/871: {Self-supporting sealing arrangements}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 2201/10128: Display
- H10H 20/01: Manufacture or treatment
- H10H 20/853: characterised by their shape
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A manufacturing method of a display device includes providing a display module including a display panel, a first flexible circuit board disposed at a first side edge of the display panel, a window disposed on the display panel, and an optical film disposed between the display panel and the window on the stage; aligning the display module such that the first side edge is disposed under the bonding unit; moving the position detection sensor along the first side edge of the display module to sense a first coating path; moving the resin supply unit along the sensed first coating path to coat a first filling agent between the window and the display panel; and moving the light irradiation unit along the sensed first coating path to cure the coated first filling agent to form a first filling layer.

## Claims

### Claim 1

A method of manufacturing a display device using a display device manufacturing apparatus comprising a stage, a fixing unit, and a bonding unit disposed on the stage and comprising a position detection sensor, a light irradiation unit, and a resin supply unit disposed between the position detection sensor and the light irradiation unit, the method comprising:
disposing a display module on the stage, the display module comprising a display panel comprising an active area and a peripheral area, a first side edge, a first flexible circuit board disposed in the peripheral area near the first side edge, a window disposed on the display panel, and an optical film disposed between the display panel and the window;
aligning the display module such that the first side edge of the display module is disposed under the bonding unit;
moving the position detection sensor along the first side edge of the display module to sense a first coating path;
moving the resin supply unit along the sensed first coating path to coat a first filling agent between the window and the display panel; and
moving the light irradiation unit along the sensed first coating path to cure the coated first filling agent to form a first filling layer.

### Claim 2 (depends on 1)

The method of claim 1, wherein the position detection sensor, the resin supply unit, and the light irradiation unit are arranged in the bonding unit such that the resin supply unit is disposed between the position detection sensor and the light irradiation unit, and the resin supply unit and the position detection sensor maintain a first distance from each other while moving along the first coating path in the coating of the first filling agent.

### Claim 3 (depends on 2)

The method of claim 2, wherein the light irradiation unit and the resin supply unit maintain a second distance from each other while moving along the first coating path in the forming of the first filling layer.

### Claim 4 (depends on 1)

The method of claim 1, wherein the coating of the first filling agent comprises coating the first filling agent in a space defined by the display panel, the window facing the display panel, and a side surface of the optical film that is exposed.

### Claim 5 (depends on 1)

The method of claim 1, wherein the first coating path corresponds to a shape of the first side edge of the display module and is positioned between the window and the display panel.

### Claim 6 (depends on 1)

The method of claim 1, wherein the display module further comprises a second flexible circuit board disposed in the peripheral area near a second side edge of the display panel and spaced apart from the first flexible circuit board, and after the forming of the first filling layer, the method further comprises:
aligning the display module such that the second side edge of the display module is disposed under the bonding unit;
moving the position detection sensor along the second side edge of the display module to sense a second coating path;
moving the resin supply unit along the sensed second coating path to coat a second filling agent between the window and the display module; and
moving the light irradiation unit along the sensed second coating path to cure the coated second filling agent to form a second filling layer.

### Claim 7 (depends on 6)

The method of claim 6, wherein the second coating path corresponds to a shape of the second side edge of the display module and is positioned between the window and the display panel.
