# US 12,111,497 B2 · Applying stress compensation for aligning a companion chip with a host chip

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- Number: US 12,111,497 B2
- Document ID: US12111497B2
- Status: Granted
- Kind: B2
- Application number: 18/330,414
- Filed: 2023-06-07
- Published: 2023-10-05
- Granted: 2024-10-08
- Earliest claimed: 2020-09-09
- Assignees: Ciena Corporation
- Applicants: Ciena Corporation
- Inventors: Raphael Beaupré-Laflamme; Simon Savard
- Web page: https://patentgrep.com/patent/US12111497B2

## CPC

- G02B 6/13: Integrated optical circuits characterised by the manufacturing method
- B25J 15/0028: {with movable, e.g. pivoting gripping jaw surfaces}
- B25J 15/0061: {mounted on a modular gripping structure}
- B25J 15/0616: {with vacuum}
- G02B 6/26: Optical coupling means (G02B6/36, G02B6/42 take precedence)
- H10W 72/07323: {Active alignment, e.g. using optical alignment using marks or sensors}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- B25J: MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES ({manipulators specially adapted for use in surgery A61B34/70; manipulators used in cleaning hollow articles B08B9/04}; manipulators associated with rolling mills B21B39/20; manipulators associated with forging machines B21J13/10; {manipulators associated with picking-up and placing mechanisms B23P19/007}; means for holding wheels or parts thereof B60B30/00; {vehicles with ground-engaging propulsion means, e.g. walking members B62D57/02, B62D57/032; devices for picking-up and depositing articles or materials between conveyors B65G47/90, B65G47/91; manipulators with gripping or holding means for transferring packages B65H67/065}; cranes B66C; {manipulators used in the protection or supervision of pipe-line installations F17D5/00; walking equipment adapted for nuclear steam-generators F22B37/006}; manipulators specially adapted for, or associated with, nuclear reactors G21C; {apparatus used for handling wafers during manufacture or treatment of semiconductor H10P72/50})
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A stress compensating pick-up tool for aligning a companion chip with a host chip includes a tool tip and an actuator. The tool tip holds the companion chip, and includes a first tip portion and a second tip portion. The actuator applies a force to the tool tip, wherein the force causes the first tip portion and the second tip portion to rotate in opposite directions with respect to one another to optically align a portion of the companion chip with a corresponding portion of the host chip.

## Claims

### Claim 1

A method for applying stress compensation for aligning a companion chip with a host chip, the method comprising:
performing an active alignment to finely align the companion chip with the host chip by
receiving a feedback from the host chip on whether the companion chip is optically aligned with the host chip, and
activating a pick-up tool to apply a stress compensation force to the companion chip to adjust a curvature of the companion chip until the companion chip is optically aligned with the host chip; and
when the companion chip is optically aligned with the host chip, curing an adhesive to affix the companion chip to the host chip while the pick-up tool is actively applying the stress compensation force to the companion chip.

### Claim 2 (depends on 1)

The method of claim 1, wherein the feedback includes insertion loss data.

### Claim 3 (depends on 1)

The method of claim 1, further comprising
picking up the companion chip with the pick-up tool before performing the active alignment; and
releasing the companion chip from the pick-up tool after the adhesive has cured.

### Claim 4 (depends on 1)

The method of claim 1, wherein
the pick-up tool includes a first tip portion configured to hold one side of the companion chip and a second tip portion configured to hold an opposite side of the companion chip; and
activating the pick-up tool includes applying the stress compensation force to rotate the first tip portion and the second tip portion in opposite directions with respect to one another to straighten the companion chip.

### Claim 5 (depends on 1)

The method of claim 1, wherein activating the pick-up tool includes adjusting an amount of stress compensation force applied based on the feedback.

### Claim 6 (depends on 1)

The method of claim 1, further comprising
performing a passive alignment by initially moving the pick-up tool to coarsely align the companion chip with the host chip, the passive alignment performed before the active alignment.