# US 12,111,234 B2 · Device and method of detecting defective electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,111,234 B2 - Document ID: US12111234B2 - Status: Granted - Kind: B2 - Application number: 17/886,636 - Filed: 2022-08-12 - Published: 2023-02-23 - Granted: 2024-10-08 - Earliest claimed: 2021-08-19 - Assignees: Samsung Electro-Mechanics Co., Ltd.; UIF (University Industry Foundation), Yonsei University - Applicants: Samsung Electro-Mechanics Co., Ltd.; UIF (University Industry Foundation), Yonsei University - Inventors: Heung Kil Park; Seong Hoon Kim; Won Suk Ohm; Seong Hun Im - Web page: https://patentgrep.com/patent/US12111234B2 ## CPC - G01M 7/00: Vibration-testing of structures; Shock-testing of structures (G01M9/00 takes precedence) - G01M 7/025: {Measuring arrangements} - G01N 29/12: by measuring frequency or resonance of acoustic waves {(measuring frequency or resonant frequency of mechanical vibrations or acoustic waves in general G01H1/06, G01H3/04, G01H13/00; acoustic resonators G10K11/04; vibration or shock testing of structures G01M7/00)} - G01N 29/2431: {using other means for acoustic excitation, e.g. heat, microwaves, electron beams (sound producing devices not otherwise provided for G10K15/04)} - G01N 29/4427: {with stored values, e.g. threshold values} - G01N 29/4445: {Classification of defects} - G01N 2291/014: Resonance or resonant frequency - G01N 2291/0289: Internal structure, e.g. defects, grain size, texture - G01N 2291/2697: Wafer or (micro)electronic parts - G01M: TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) ## Abstract A device and method use a heat source to generate heat energy and transfer the generated thermal energy to a plurality of electronic components in a non-contact manner through air to cause the plurality of electronic components to vibrate simultaneously. The device and method use a mechanical resonance detector to detect vibration resonances of the plurality of electronic components simultaneously. The device and method use a post-processing processor to compare the detected vibration resonances of the plurality of electronic components with a reference vibration resonance of a normal product to simultaneously determine whether the plurality of electronic components have defective electronic components. ## Claims ### Claim 1 A device for detecting whether a plurality of electronic components have one or more defective electronic components, comprising: a heat source generating heat energy due to a photothermal effect and transferring the generated thermal energy to the plurality of electronic components in a non-contact manner to cause the plurality of electronic components which are spaced apart from each other to vibrate simultaneously; a mechanical resonance detector detecting vibration resonances of the plurality of electronic components simultaneously; and a post-processing processor comparing the detected vibration resonances of the plurality of electronic components with a reference vibration resonance of a normal product to simultaneously determine whether the plurality of electronic components have one or more defective electronic components and then extracting determined information, wherein the heat energy is transmitted to the plurality of electronic components in the non-contact manner through air. ### Claim 2 (depends on 1) The device of claim 1, wherein the mechanical resonance detector detects displacements, velocities, or accelerations of magnitudes with respect to vibration frequencies of the plurality of electronic components. ### Claim 3 (depends on 1) The device of claim 1, wherein the determined information extracted by the post-processing processor include the number of defective products, positions of the defective products, and/or types of defects. ### Claim 4 (depends on 1) The device of claim 1, further comprising an extraction device extracting the one or more defective electronic components determined by the post-processing processor. ### Claim 5 (depends on 1) The device of claim 1, further comprising a display displaying the determined information. ### Claim 6 A method of detecting whether a plurality of electronic components have one or more defective electronic components, the method comprising: an energy transfer operation of transferring heat energy due to a photothermal effect generated by a heat source to the plurality of electronic components in a non-contact manner to cause the plurality of electronic components which are spaced apart from each other to vibrate simultaneously; a mechanical resonance detecting operation of detecting vibration resonances of the plurality of electronic components simultaneously; and a defective product determining operation of comparing the detected vibration resonances of the plurality of electronic components with a reference vibration resonance of a normal product through a post-processing processor to simultaneously determine whether the plurality of electronic components have one or more defective electronic components and then extracting determined information, wherein the heat energy is transmitted to the plurality of electronic components in the non-contact manner through air. ### Claim 7 (depends on 6) The method of claim 6, wherein the mechanical resonance detecting operation includes an operation of detecting displacements, velocities, or accelerations of magnitudes with respect to vibration frequencies of the plurality of electronic components. ### Claim 8 (depends on 6) The method of claim 6, wherein the defective product determining operation includes an operation of extracting the determined information which is at least one of the number of defective products, positions of the defective products, and/or types of defects. ### Claim 9 (depends on 6) The method of claim 6, further comprising a defective product extracting operation of extracting the one or more defective electronic components determined by the post-processing processor. ### Claim 10 (depends on 6) The method of claim 6, further comprising a defective product displaying operation of displaying the determined information.