# US 12,110,594 B2 · Composition for electroless platinum plating and electroless platinum plating method using the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,110,594 B2
- Document ID: US12110594B2
- Status: Granted
- Kind: B2
- Application number: 17/476,508
- Filed: 2021-09-16
- Published: 2022-04-14
- Granted: 2024-10-08
- Earliest claimed: 2020-10-13
- Assignees: Foundation of Soongsil University-Industry Cooperation
- Applicants: Foundation of Soongsil University-Industry Cooperation
- Inventors: Kuan Soo Shin; Jeong Hei Choi; Yoon Kyung Jung; Min Young Cho
- Web page: https://patentgrep.com/patent/US12110594B2

## CPC

- C23C 18/44: using reducing agents
- C23C 18/1641: {Organic substrates, e.g. resin, plastic}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)

## Abstract

The present invention relates to a composition for electroless platinum plating and an electroless platinum plating method using the same, wherein it is possible to easily and safely produce a uniformly dispersed platinum thin film without expensive additional equipment by performing electroless platinum plating with a composition for electroless platinum plating containing an alcohol, an aqueous solution of a platinum chloride compound, and an aqueous solution of a basic compound.

## Claims

### Claim 1

An electroless platinum plating method, comprising:
preparing a composition for electroless platinum plating, the composition consisting of:
an alcohol;
an aqueous solution of chloroplatinic acid (H2PtCl6) included in the composition at a concentration of 6.3 to 7.9 mM; and
an aqueous solution of potassium hydroxide included in the composition at a concentration of 0.2 M;
dipping a substrate in the composition; and
shaking the composition at 100 to 200 rpm to form a platinum thin film on the substrate,
wherein the substrate is selected from the group consisting of glass, rubber, ceramic, paper, carbon paper, wood, and leaves.

### Claim 2 (depends on 1)

The electroless platinum plating method according to claim 1, wherein the shaking is performed at a temperature of 50 to 100° C. for 1 to 80 hours.

### Claim 3 (depends on 1)

The electroless platinum plating method according to claim 1, wherein the alcohol is a C1-C4 alcohol.

### Claim 4 (depends on 1)

The electroless platinum plating method according to claim 1, wherein the alcohol is included in an amount of 30 to 90 parts by weight based on 100 parts by weight of the composition.