# US 12,110,446 B2 · Composite material and heat dissipation part comprising the composite material

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- Number: US 12,110,446 B2
- Document ID: US12110446B2
- Status: Granted
- Kind: B2
- Application number: 17/991,012
- Filed: 2022-11-21
- Published: 2023-06-15
- Granted: 2024-10-08
- Earliest claimed: 2021-12-13
- Assignees: The Goodsystem Corp.
- Applicants: The Goodsystem Corp.
- Inventors: Meoung-whan Cho; Seog-woo Lee; Young-suk Kim
- Web page: https://patentgrep.com/patent/US12110446B2

## CPC

- C09K 5/14: Solid materials, e.g. powdery or granular
- B22F 1/18: Non-metallic particles coated with metal
- B22F 3/02: Compacting only
- B22F 3/10: Sintering only
- B22F 7/02: of composite layers {(B22F7/002 takes precedence)}
- B22F 7/08: with one or more parts not made from powder {(B22F7/062 takes precedence)}
- C22C 1/0425: {Copper-based alloys}
- C22C 1/05: Mixtures of metal powder with non-metallic powder (C22C1/08 takes precedence)
- C22C 9/00: Alloys based on copper
- C22C 14/00: Alloys based on titanium
- C22C 26/00: Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes}
- B22F 2003/1051: {by electric discharge}
- B22F 2999/00: Aspects linked to processes or compositions used in powder metallurgy
- C22C 2026/006: {with additional metal compounds being carbides}
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- C22C: ALLOYS (treatment of alloys C21D, C22F)

## Abstract

The present invention relates to a composite material of a metal and a non-metal and a heat dissipation part composed of the composite material. More specifically, the present invention relates to a composite material including a structure in which diamond particles which have excellent thermal conductivity are dispersed in a metal matrix, and particularly, to a highly reliable composite material capable of maintaining excellent heat dissipation properties even in a use environment such as military, aviation, space, or the like to which severe thermal cycles are applied, and to a heat dissipation part including the composite material.

## Claims

### Claim 1

A composite material comprising a metal matrix and a structure in which diamond particles are dispersed inside the metal matrix, wherein:
the metal matrix consists of copper (Cu), and the diamond particles are included at a volume ratio of 15% to 80%; and
an interface layer including a composite structure of titanium (Ti) and a titanium carbide is formed in at least a portion between the metal matrix and the diamond particles,
wherein a dendrite composed of the same metal as the metal matrix is formed in the composite structure of titanium (Ti) and a titanium carbide, and
wherein an average thickness of the interface layer is 200 nm to 5 μm.

### Claim 2 (depends on 1)

A material having a stacked structure comprising:
a first layer composed of copper (Cu) or a copper (Cu) alloy;
a second layer formed on the first layer, and composed of an alloy containing copper (Cu) and molybdenum (Mo);
a third layer formed on the second layer, and composed of the composite material described in claim 1;
a fourth layer formed on the third layer, and composed of an alloy containing copper (Cu) and molybdenum (Mo); and
a fifth layer formed on the fourth layer, and composed of copper (Cu) or a copper (Cu) alloy.

### Claim 3 (depends on 1)

The composite material of claim 1, wherein in the composite structure of titanium (Ti) and a titanium carbide, the content of the titanium carbide is 1 wt % to 45 wt %.

### Claim 4 (depends on 1)

The composite material of claim 1, wherein the dendrite is formed by the penetration of a metal constituting the metal matrix into the composite structure of titanium (Ti) and a titanium carbide.

### Claim 5 (depends on 1)

The composite material of claim 1, wherein when the composite material is tested according to the MIL-STD-883K-C standard, the decrease in thermal conductivity is 10% or less.

### Claim 6 (depends on 1)

The composite material of claim 1, wherein the composite material has a plate shape, wherein:
the thermal conductivity in a thickness direction of the plate shape is 500 W/mK or greater; and
the thermal expansion coefficient in a plane direction of the plate shape is 3×10−6/K to 13×10−6/K at 25° C. to 200° C.

### Claim 7 (depends on 1)

A heat dissipation part comprising the composite material described in claim 1.

### Claim 8 (depends on 2)

The material of claim 2, wherein in the composite structure of titanium (Ti) and a titanium carbide, the content of the titanium carbide is 1 wt % to 45 wt %.

### Claim 9 (depends on 2)

The material of claim 2, wherein the dendrite is formed by the penetration of a metal constituting the metal matrix into the composite structure of titanium (Ti) and a titanium carbide.

### Claim 10 (depends on 2)

The material of claim 2, wherein when the composite material is tested according to the MIL-STD-883K-C standard, the decrease in thermal conductivity is 10% or less.

### Claim 11 (depends on 2)

The material of claim 2, wherein the composite material has a plate shape, wherein:
the thermal conductivity in a thickness direction of the plate shape is 500 W/mK or greater; and
the thermal expansion coefficient in a plane direction of the plate shape is 3×10−6/K to 13×10−6/K at 25° C. to 200° C.

### Claim 12 (depends on 2)

A heat dissipation part comprising the material described in claim 2.