# US 12,110,425 B2 · Electromagnetic curable novel toughened epoxy-hybrid structural adhesives and applications using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,110,425 B2 - Document ID: US12110425B2 - Status: Granted - Kind: B2 - Application number: 17/403,941 - Filed: 2021-08-17 - Published: 2023-03-09 - Granted: 2024-10-08 - Earliest claimed: 2021-08-17 - Assignees: Uniseal, Inc. - Applicants: Thanikaivelan Tindivanam Veeraraghavan; Ramanathan Lakshminarayan - Inventors: Thanikaivelan Tindivanam Veeraraghavan; Ramanathan Lakshminarayan - Web page: https://patentgrep.com/patent/US12110425B2 ## CPC - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - C08G 59/066: {with chain extension or advancing agents} - C08G 59/4021: {Ureas; Thioureas; Guanidines; Dicyandiamides} - C08G 59/5073: {having two nitrogen atoms in the ring} - C08G 59/54: Amino amides> - C08K 3/04: Carbon - C08K 3/36: Silica - C08G 59/50: Amines - C08G 2270/00: Compositions for creating interpenetrating networks - C08K 3/013: Fillers, pigments or reinforcing additives - C08K 3/346: {Clay} - C08L 75/04: Polyurethanes - C09J 2301/408: additives as essential feature of the adhesive layer - C09J 2301/416: use of irradiation - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) ## Abstract One-component electromagnetic curable novel toughened epoxy-hybrid structural adhesives, generally including: (a) a bisphenol A liquid epoxy resin, (b) a bisphenol F liquid epoxy resin, (c) a bisphenol A solid epoxy resin, (d) a novel toughening agent, (e) one or more mineral fillers, and (f) a curing agent. The structural adhesives of the present invention can be cured within seconds and are useful for a plurality of applications, including bonding OEM closure panel components, such as doors, hoods, fenders, etcetera. ## Claims ### Claim 1 A vehicle component assembly, comprising: a first substrate having a first surface and a second surface, wherein the first substrate comprises a first material and includes a thickness ranging from approximately 0.25 mm to approximately 5.00 mm; a second substrate having a first surface and a second surface, wherein the second substrate comprises a second material and includes a thickness ranging from approximately 0.25 mm to approximately 5.00 mm; wherein the first and second substrates comprise dissimilar materials; a one-component structural adhesive, comprising: a bisphenol A liquid epoxy resin; a bisphenol F liquid epoxy resin; a bisphenol A solid epoxy resin; a toughening agent, wherein the toughening agent comprises an epoxy terminated polyurethane interpenetrating network represented by the following chemical structure: A1-R1-A2 wherein A1 is represented by the following chemical structure: wherein R1 comprises an alkyl, alkenyl, and/or alkynyl group containing approximately 1 to approximately 36 carbon atoms, an oligomer, and/or a urethane polymer; and wherein A2=A1; a three-component filler, wherein the three-component filler consists of fumed silica, carbon black, and calcium metasilicate; a three-component curing agent system, wherein the three-component curing system consists of dicyandiamide, 1-phenyl-3,3 dimethyl urea, and 2,4 toluene bis dimethyl urea; and wherein the structural adhesive is able to be fully electromagnetically cured at 190° C./4 sec; and wherein the one-component structural adhesive contacts and is positioned between the second surface of the first substrate and the first surface of the second substrate. ### Claim 2 A one-component structural adhesive, comprising: a bisphenol A liquid epoxy resin, wherein the bisphenol A liquid epoxy resin comprises a diglycidyl ether of bisphenol A, and wherein the bisphenol A liquid epoxy resin is present from approximately 30 percent to approximately 50 percent by weight of the structural adhesive; a bisphenol F liquid epoxy resin, wherein the bisphenol F liquid epoxy resin comprises a diglycidyl ether of bisphenol F, and wherein the bisphenol F liquid epoxy resin is present from approximately 40 percent to approximately 60 percent by weight of the structural adhesive; a bisphenol A solid epoxy resin, wherein the bisphenol A solid epoxy resin comprises a bisphenol A unmodified solid epoxy resin, and wherein the bisphenol A solid epoxy resin is present from approximately 5 percent to approximately 15 percent by weight of the structural adhesive; a toughening agent, wherein the toughening agent comprises an epoxy terminated polyurethane interpenetrating network represented by the following chemical structure: A1-R1-A2 wherein A1 is represented by the following chemical structure: wherein R1 comprises an alkyl, alkenyl, and/or alkynyl group containing approximately 1 to approximately 36 carbon atoms, an oligomer, and/or a urethane polymer; and wherein A2=A1, and wherein the toughening agent is present from approximately 5 percent to approximately 15 percent by weight of the structural adhesive; a three-component filler, wherein the three-component filler consists of fumed silica, carbon black, and calcium metasilicate, and wherein the three-component filler is present from approximately 2 percent to approximately 10 percent by weight of the structural adhesive; a three-component curing system, wherein the three-component curing system consists of dicyandiamide, 1-phenyl-3,3 dimethyl urea, and 2,4 toluene bis dimethyl urea, and wherein the three-component curing system is present from approximately 6 percent to approximately 10 percent by weight of the structural adhesive; and wherein the structural adhesive is electromagnetically curable.