# US 12,110,413 B2 · Coatings for waterproofing electronic components

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- Number: US 12,110,413 B2
- Document ID: US12110413B2
- Status: Granted
- Kind: B2
- Application number: 17/448,404
- Filed: 2021-09-22
- Published: 2022-01-06
- Granted: 2024-10-08
- Earliest claimed: 2019-03-22
- Assignees: Henkel AG & Co. KGaA
- Applicants: Henkel AG & Co. KGaA
- Inventors: John L. Zimmerman; John D. McGee; Gregory T. Donaldson; Thomas S. Smith, II; William G. Kozak; Lisa K. Miller; Eric C. Kuhns
- Web page: https://patentgrep.com/patent/US12110413B2

## CPC

- C09D 5/00: Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced {(electrically insulating plastics, resins or waxes H01B3/30)}; Filling pastes
- C09D 4/06: {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
- C09D 7/20: Diluents or solvents
- C09D 7/65: macromolecular (C09D7/41-C09D7/48 take precedence)
- C09D 109/02: Copolymers with acrylonitrile
- C09D 135/02: Homopolymers or copolymers of esters (C09D135/06, C09D135/08 take precedence)
- C09D 153/00: Coating compositions based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
- H05K 3/282: {for inhibiting the corrosion of the circuit, e.g. for preserving the solderability}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A circuit board water-proofing coating composition is provided comprising: at least one passivating agent, preferably containing a molecule comprising a thio-functional group, desirably a thiol group, an azolic moiety, or an azole, and combinations thereof; at least one binder component comprising an organic or inorganic film-forming polymer, and/or one or more polymer pre-cursors polymerizable on a substrate surface; and optionally one or more additive(s); also provided are methods of making and using the coating composition and coated circuit boards.

## Claims

### Claim 1

A circuit board water-proofing coating composition, comprising:
A) at least one dissolved and/or dispersed passivating agent containing a molecule comprising a thio-functional group and/or an azolic moiety, the passivating agent in a concentration greater than a solubility limit of the passivating agent in the binder component;
B) a dissolved and/or dispersed binder component comprising one or more of the following types of binders:
1) an organic or inorganic film-forming polymer that is unreactive with (A);
2) an organic or inorganic film-forming polymer, which is capable of reacting with (A);
3) one or more polymer pre-cursors polymerizable on a substrate surface and unreactive to (A);
4) one or more polymer pre-cursors polymerizable on a substrate surface and capable of reacting with (A); and
C) optionally, one or more dissolved and/or dispersed additive(s), selected from wax, adhesion promoter, leveling agent, flow modifier, wetting agent, rheology modifier, stabilizer, catalyst, pigment, photoinitiator, biocide and biostat; and
D) optionally at least one organic solvent.

### Claim 2 (depends on 1)

The circuit board water-proofing coating composition of claim 1, wherein the molecule comprising the thio-functional group and/or the azolic moiety; further comprises a secondary functional group.

### Claim 3 (depends on 1)

The circuit board water-proofing coating composition of claim 1, wherein at least a portion of the binder component (B) is grafted to at least some molecules of the passivating agent (A).

### Claim 4 (depends on 1)

The circuit board water-proofing coating composition of claim 1, wherein the organic or inorganic film-forming polymer of (B) comprises a polymer or copolymer of olefin monomer(s) and vinyl ester(s).

### Claim 5 (depends on 1)

The circuit board water-proofing coating composition of claim 1, wherein the one or more polymer pre-cursors comprise UV-curable monomers, oligomers and/or pre-polymers.

### Claim 6 (depends on 1)

The circuit board water-proofing coating composition of claim 1, wherein (A) comprises molecules having both a thiol functional group and an azolic moiety.

### Claim 7 (depends on 1)

The circuit board water-proofing coating composition of claim 1, wherein (A) comprises a mercapto silane oligomer.

### Claim 8 (depends on 1)

The circuit board water-proofing coating composition of claim 1, wherein (C) comprises a wax having a melting point of about 50 to 100° C.

### Claim 9 (depends on 1)

The circuit board water-proofing coating composition of claim 1, wherein the one or more polymer pre-cursors (B) is present and includes olefinic monomer comprising at least one of (meth)acrylate monomer(s), a vinyl monomer(s), styrene(s), acrylonitrile(s), and mixtures thereof.

### Claim 10 (depends on 1)

A method of waterproofing a circuit board comprising steps of:
a) applying the coating composition of claim 1 to a substrate surface, wherein the substrate constitutes at least a portion of a circuit board or electronic component, optionally comprising one or more electrically conductive traces affixed thereto;
b) drying the coating composition on the substrate surface;
c) optionally UV curing the coating composition on the substrate surface;
d) during any of steps a)-c) reacting available reactive functional groups of binder component (B) and passivating agent (A) with coating composition components, and optionally the electrically conductive traces, thereby depositing a water-insoluble, passivating polymeric film on the substrate surface.

### Claim 11 (depends on 10)

The passivating polymeric film deposited on the substrate surface according to the method of claim 10, wherein the passivating polymeric film is removable from the circuit board by peeling.

### Claim 12 (depends on 10)

The passivating polymeric film deposited on the substrate surface according to the method of claim 10, wherein the substrate surface is a tape, backing or other support thereby forming a removable film for later transfer to an end use article.

### Claim 13 (depends on 10)

An electronic component comprising the substrate surface coated according to claim 10, wherein the electronic component shows no current leakage during immersion in distilled water for 30 minutes under applied electrical power of 10 Volts.

### Claim 14 (depends on 1)

A method of water-proofing a circuit board, the method comprising:
(a) providing the coating composition of claim 1, wherein the passivating agent(s) (A) is present in the amount of at least 16 wt. % of the composition;
(b) applying the coating composition onto an exposed surface of the circuit board and maintaining the composition in a liquid state thereby by enabling reaction and adsorption of (A) to metal portions of the surface; and
(c) solidifying, and optionally curing, the composition to form an ultra-thin film having a thickness sufficient to render the surface waterproof.

### Claim 15 (depends on 1)

A printed circuit board comprising a substrate, electrically conductive traces affixed to the substrate and an adherent passivating polymeric coating adhered to at least one surface of the substrate and electrically conductive traces, the adherent passivating polymeric coating being derived application of the coating composition of claim 1, wherein the adherent passivating polymeric coating comprises:
a) a cured binder matrix comprising one or more of an organic or inorganic film-forming polymer, optionally cross-linked; reaction products of one or more polymer pre-cursors; and/or reaction products of the film-forming polymer with one or more polymer precursors;
b) a passivating agent in a concentration greater than a solubility limit of the passivating agent in the binder component such that there is a secondary phase of passivating agent, the passivating agent comprising a thiol group, an azolic moiety, an azole, and combinations thereof; and/or reaction products of the passivating agent with the electrically conductive traces and/or at least a portion of component a); and
c) optionally particles of wax, insoluble in the cured binder matrix and dispersed therein.

### Claim 16 (depends on 15)

The printed circuit board of claim 15 wherein the adherent polymeric coating comprises a polymer made from olefinic monomer comprising at least one of (meth)acrylate monomer(s), a vinyl monomer(s), styrene(s), acrylonitrile(s), and mixtures thereof.

### Claim 17 (depends on 1)

The circuit board water-proofing coating composition of claim 1, wherein the coating composition contains no more than 0.001 wt. % fluorine and the at least one dissolved and/or dispersed passivating agent, contains a molecule comprising a thio-functional group.

### Claim 18 (depends on 1)

The circuit board water-proofing coating composition of claim 1, wherein the passivating agent (A) is different from the binder component (B); (A) is present in an amount up to about 60 wt. %; (B) is present in an amount of about 1 wt. % to about 97 wt. %; (C) is present in an amount of about 1-80 wt. %; and the remainder to 100 wt. % being (D) at least one organic solvent, all based on a total weight of the coating composition.

### Claim 19 (depends on 18)

The circuit board water-proofing coating composition of claim 18, wherein at least a portion of the passivating agent (A) comprises a thiol group; azolic moiety; or azole; and further comprises a secondary functional group.

### Claim 20 (depends on 18)

The circuit board water-proofing coating composition of claim 18, wherein the passivating agent (A) is present in an amount of at least 16 wt. % and at least a portion of the binder component (B) is grafted to at least some molecules of the passivating agent (A).

### Claim 21 (depends on 4)

The circuit board water-proofing coating composition of claim 4, wherein the polymer or copolymer of olefin monomer(s) and vinyl ester(s) is an ethylene vinyl acetate block copolymer.

### Claim 22 (depends on 18)

The circuit board water-proofing coating composition of claim 18, wherein the one or more polymer pre-cursors of (B) are present and comprise UV-curable monomers, oligomers and/or pre-polymers.

### Claim 23 (depends on 18)

The circuit board water-proofing coating composition of claim 18, wherein (A) comprises molecules having both a thiol functional group and an azolic moiety.

### Claim 24 (depends on 1)

The circuit board water-proofing coating composition of claim 1, wherein (A) comprises a mercapto silane oligomer and (C) comprises a wax.

### Claim 25 (depends on 5)

The circuit board water-proofing coating composition of claim 5, wherein the one or more polymer pre-cursors of (B) are present and include olefinic monomer comprising at least one of (meth)acrylate monomer(s), a vinyl monomer(s), styrene(s), acrylonitrile(s), and mixtures thereof.