# US 12,110,412 B2 · Curable silicone composition, encapsulant and optical semiconductor device

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- Number: US 12,110,412 B2
- Document ID: US12110412B2
- Status: Granted
- Kind: B2
- Application number: 17/387,573
- Filed: 2021-07-28
- Published: 2022-03-03
- Granted: 2024-10-08
- Earliest claimed: 2020-08-28
- Assignees: DuPont Toray Specialty Materials Kabushiki Kaisha
- Applicants: DuPont Toray Specialty Materials Kabushiki Kaisha
- Inventors: Akito Hayashi; Sawako Horie
- Web page: https://patentgrep.com/patent/US12110412B2

## CPC

- C08L 83/04: Polysiloxanes
- C09D 183/04: Polysiloxanes
- C08G 77/08: characterised by the catalysts used
- C08G 77/12: containing silicon bound to hydrogen
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10W 74/476: {Organic materials comprising silicon}
- C08G 77/045: {containing less than 25 silicon atoms}
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C08L 2203/206: use in coating or encapsulating of electronic parts
- C08L 2205/025: containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A curable silicone composition is capable of forming a cured product having excellent elongation characteristics. The curable silicone composition, comprises: (A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I): (R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d(XO1/2)e, where in formula (I), each R1 is independently a monovalent hydrocarbon group including an alkenyl group, while the number of alkenyl groups per molecule is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c<0.9, 0≤d<0.5, 0≤e<0.4, a+b+c+d=1.0, and c+d>0; (B) an organohydrogenpolysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule; and (C) a curing reaction catalyst.

## Claims

### Claim 1

A curable silicone composition comprising:
(A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (1): (R13SiO1/2)a (R12SiO2/2)b (R1SiO3/2)c (SiO4/2)d (XO1/2)e, where in formula (1), each R1 is independently a monovalent hydrocarbon group, while the number of alkenyl groups per molecule is one or more and is less than two on average, X is a hydrogen atom or an alkyl group, a is 0.05≤a≤0.8, b is 0≤b≤0.9, c is 0.1≤c≤0.9, d=0, e is 0≤e≤0.15, a+b+c=d=1.0 and c+d>0;
(B) an organohydrogenpolysiloxane having three or more silicon atom-bonded hydrogen atoms per molecule;
(C) a curing reaction catalyst; and
(D) an organopolysiloxane which is different from components (A) and (B).

### Claim 2 (depends on 1)

The curable silicone composition as claimed in claim 1, wherein the mass ratio of the resinous organopolysiloxane and linear organopolysiloxane is 9:1 to 1:9.

### Claim 3 (depends on 1)

An encapsulant comprising the curable silicone composition described in claim 1.

### Claim 4 (depends on 3)

An optical semiconductor device comprising the encapsulant described in claim 3.

### Claim 5 (depends on 1)

The curable silicone composition as claimed in claim 1, wherein the resinous alkenyl group-containing organopolysiloxane (A) contains an alkenyl group in its molecular terminal.

### Claim 6 (depends on 1)

The curable silicone composition as claimed in claim 1, wherein the resinous alkenyl group-containing organopolysiloxane (A) has from 1 to 1.9 alkenyl groups per molecule on average.

### Claim 7 (depends on 1)

The curable silicone composition as claimed in claim 1, wherein the organohydrogenpolysiloxane of component (B) is a branched structure.

### Claim 8 (depends on 1)

The curable silicone composition as claimed in claim 1, wherein the organohydrogenpolysiloxane of component (B) includes at least one siloxane unit (unit T) represented by SiO3/2 and/or siloxane unit (unit Q) represented by SiO4/2.

### Claim 9 (depends on 1)

The curable silicone composition as claimed in claim 1, wherein the organopolysiloxane of component (D) includes a linear organopolysiloxane represented by general formula (II):
R13SiO(R12SiO)mSR13
where in formula (II), each R1 is independently a monovalent hydrocarbon group, and m is an integer of from 5 to 1000.

### Claim 10

A curable silicone composition comprising:
(A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I): (R13SiO1/2) a (R12SiO2/2) b (R1SiO3/2) c (SiO4/2) d (XO1/2) e, where in formula (I), each R1 is independently a monovalent hydrocarbon group, while the number of alkenyl groups per molecule is one or more and is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c<0.9, d=0, 0≤e<0.4, a+b+c+d=1.0, and c+d>0;
(B) an organohydrogenpolysiloxane having three or more silicon atom-bonded hydrogen atoms per molecule;
(C) a curing reaction catalyst; and
(D) an organopolysiloxane which is different from components (A) and (B), wherein the organopolysiloxane of component (D) includes a cyclic organopolysiloxane represented by general formula (III):
(R12SiO)n,
where in formula (III), each R1 is independently a monovalent hydrocarbon group, and n is an integer of from 3 to 50.

### Claim 11 (depends on 10)

An optical semiconductor device comprising an encapsulant which comprises the curable silicone composition described in claim 10.

### Claim 12

A curable silicone composition comprising:
(A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I): (R13SiO2) a (R12SiO2/2) b (R1SiO3/2) c (SiO4/2) d (XO1/2) e, where in formula (I), each R1 is independently a monovalent hydrocarbon group, while the number of alkenyl groups per molecule is one or more and is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c<0.9, d=0, 0≤e<0.4, a+b+c+d=1.0, and c+d>0;
(B) an organohydrogenpolysiloxane having three or more silicon atom-bonded hydrogen atoms per molecule;
(C) a curing reaction catalyst; and
(D) an organopolysiloxane which is different from components (A) and (B), wherein the organopolysiloxane of component (D) includes an epoxy group-containing resinous organopolysiloxane represented by average unit formula (IV):
(R23SiO1/2)a(R22SiO2/2)b(R2SiO3/2)c(SiO4/2)d(XO1/2)
where in formula (IV), each R2 is the same or different optionally halogen-substituted monovalent hydrocarbon group or epoxy group-containing organic group, at least one R2 is an epoxy group-containing organic group, X is a hydrogen atom or an alkyl group, and 0≤a≤1, 0≤b≤1, 0≤c<0.9, 0≤d<0.5, 0≤e<0.4, a+b+c+d=1.0, and c+d>0.

### Claim 13 (depends on 12)

An optical semiconductor device comprising an encapsulant which comprises the curable silicone composition described in claim 12.

### Claim 14 (depends on 12)

The curable silicone composition as claimed in claim 12, wherein the organopolysiloxane of component (D) further includes a linear organopolysiloxane represented by general formula (II):
R13SiO(R12SiO)mSR13
where in formula (II), each R1 is independently a monovalent hydrocarbon group, and m is an integer of from 5 to 1000.

### Claim 15

A curable silicone composition comprising:
(A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (1): (R13SiO1/2)a (R12SiO2/2)b (R1SiO3/2)c (SiO4/2)d (XO1/2)e, where in formula (1), each R1 is independently a monovalent hydrocarbon group, where the number of alkenyl groups per molecule is from 1 to 1.9 alkenyl groups per molecule on average, X is a hydrogen atom or an alkyl group, a is 0≤a≤1, b is 0≤b≤1, c is 0≤c≤0.9, d=0, e is 0≤e≤0.4, a+b+c=d=1.0 and c+d>0;
(B) an organohydrogenpolysiloxane having three or more silicon atom-bonded hydrogen atoms per molecule;
(C) a curing reaction catalyst; and
(D) an organopolysiloxane which is different from components (A) and (B).