# US 12,110,408 B2 · Conductive laminate and manufacturing method of conductive laminate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,110,408 B2 - Document ID: US12110408B2 - Status: Granted - Kind: B2 - Application number: 18/173,773 - Filed: 2023-02-23 - Published: 2023-07-06 - Granted: 2024-10-08 - Earliest claimed: 2020-09-30 - Assignees: FUJIFILM Corporation - Applicants: FUJIFILM Corporation - Inventors: Kotaro Maeda; Norihide Shimohara - Web page: https://patentgrep.com/patent/US12110408B2 ## CPC - C09D 11/52: Electrically conductive inks - B05D 1/38: with intermediate treatment (intermediate treatment per se B05D3/00) - B05D 3/02: by baking {(B05D3/04 takes precedence)} - B05D 5/12: to obtain a coating with specific electrical properties - B05D 7/24: for applying particular liquids or other fluent materials - B32B 3/266: {characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12} - B32B 7/025: Electric or magnetic properties - B32B 15/00: Layered products comprising {a layer of} metal - B41M 5/0047: {by ink-jet printing} - C09D 1/00: Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances - C09D 11/322: Pigment inks - H01B 5/14: comprising conductive layers or films on insulating-supports - H01B 13/00: Apparatus or processes specially adapted for manufacturing conductors or cables - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/097: {Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence)} - H05K 3/12: using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} - H05K 3/1208: {Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38)} - H05K 3/125: {by ink-jet printing} - H05K 3/1283: {After-treatment of the printed patterns, e.g. sintering or curing methods} - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02) - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - B41M: PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING, (correction of typographical errors B41J; processes for applying transfer pictures or the like B44C1/16; fluid media for correction of typographical errors by coating C09D10/00; printing textiles D06P) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a first main surface toward a second main surface to a position being away from the first main surface by a distance equivalent to 50% of a thickness of the conductive ink film has a first void ratio of 15% to 50%, a region that extends from a position being away from the second main surface toward the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film to the second main surface has a second void ratio which is smaller than the first void ratio, and the conductive ink film comprises at least one metal selected from the group consisting of silver, gold, platinum, nickel, palladium, and copper. ## Claims ### Claim 1 A conductive laminate comprising: a base material; and a conductive ink film provided on the base material, wherein the conductive ink film has a first main surface and a second main surface, wherein the first main surface is closer to the base material than the second main surface and the second main surface is farther from the base material than the first main surface, a region that extends from the first main surface toward the second main surface to a position being away from the first main surface by a distance equivalent to 50% of a thickness of the conductive ink film has a first void ratio of 15% to 50%, a region that extends from a position being away from the second main surface toward the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film to the second main surface has a second void ratio which is smaller than the first void ratio, the second void ratio is in a range of 4% to 30%, and the conductive ink film comprises at least one metal selected from the group consisting of silver, gold, platinum, nickel, palladium, and copper. ### Claim 2 (depends on 1) The conductive laminate according to claim 1, wherein the first void ratio is 30% to 40%. ### Claim 3 (depends on 1) The conductive laminate according to claim 1, wherein the second void ratio is 20% or less. ### Claim 4 (depends on 1) The conductive laminate according to claim 1, wherein the conductive ink film has a thickness of 0.5 μm to 30 μm. ### Claim 5 (depends on 1) The conductive laminate according to claim 1, wherein a difference between the first void ratio and the second void ratio is 5% to 40%. ### Claim 6 (depends on 1) A method of manufacturing the conductive laminate according to claim 1, the method comprising: applying a first conductive ink comprising metal particles onto a base material; baking the first conductive ink; applying a second conductive ink comprising a metal salt or a metal complex onto the baked first conductive ink; baking the second conductive ink; wherein the metal particles are particles comprising at least one metal selected from the group consisting of silver, gold, platinum, nickel, palladium, and copper; and wherein each of the metal salt and the metal complex comprises at least one metal selected from the group consisting of silver, gold, platinum, nickel, palladium, and copper. ### Claim 7 (depends on 6) The method according to claim 6, wherein the metal particles have an average particle diameter of 10 nm to 200 nm. ### Claim 8 (depends on 6) The method according to claim 6, wherein the first conductive ink has a content of the metal particles of 10% by mass to 90% by mass with respect to a total amount of the first conductive ink. ### Claim 9 (depends on 6) The method according to claim 6, wherein the metal complex is a metal complex having a structure derived from at least one compound selected from the group consisting of an ammonium carbamate compound, an ammonium carbonate compound, an alkylamine, and a carboxylic acid having 8 to 20 carbon atoms, and the metal salt is a metal carboxylate having 8 to 20 carbon atoms. ### Claim 10 (depends on 6) The method according to claim 6, wherein the second conductive ink has a content of each of the metal salt and the metal complex of 10% by mass to 90% by mass with respect to a total amount of the second conductive ink. ### Claim 11 (depends on 6) The method according to claim 6, wherein the applying of the first conductive ink comprises applying the first conductive ink using an ink jet recording method, and the applying of the second conductive ink comprises applying the second conductive ink using an ink jet recording method. ### Claim 12 (depends on 6) The method according to claim 6, wherein at the time of applying the first conductive ink in the applying of the first conductive ink, a temperature of the base material is 20° C. to 120° C. ### Claim 13 (depends on 6) The method according to claim 6, wherein in the baking of the first conductive ink, a baking temperature is 250° ° C. or lower, and a baking time is 1 minute to 120 minutes. ### Claim 14 (depends on 6) The method according to claim 6, wherein at the time of applying the second conductive ink in the applying of the second conductive ink, a temperature of the base material is 20° C. to 120° C. ### Claim 15 (depends on 6) The method according to claim 6, wherein in the baking of the second conductive ink, a baking temperature is 250° C. or lower, and a baking time is 1 minute to 120 minutes. ### Claim 16 (depends on 6) The method according to claim 6, wherein a time from when the applying of the second conductive ink has finished to when the baking of the second conductive ink is started is 60 seconds or less.