# US 12,110,379 B2 · Articles and structures with high heat and reflectance and laser direct structuring function

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- Number: US 12,110,379 B2
- Document ID: US12110379B2
- Status: Granted
- Kind: B2
- Application number: 17/800,676
- Filed: 2021-02-11
- Published: 2023-04-20
- Granted: 2024-10-08
- Earliest claimed: 2020-02-20
- Assignees: Shpp Global Technologies B.V.
- Applicants: Shpp Global Technologies B.V.
- Inventors: Yunan Cheng; Yun Zheng
- Web page: https://patentgrep.com/patent/US12110379B2

## CPC

- C08K 13/06: Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
- C08K 3/013: Fillers, pigments or reinforcing additives
- C08K 3/22: of metals
- C08K 3/2279: {of antimony}
- C08K 3/38: Boron-containing compounds
- C08K 7/06: Elements
- C08K 7/14: Glass
- C08K 9/02: Ingredients treated with inorganic substances
- H05K 3/0032: {of organic insulating material}
- C08K 2003/2231: {of tin}
- C08K 2003/2241: {Titanium dioxide}
- C08K 2003/385: {Binary compounds of nitrogen with boron}
- H05K 1/0237: {High frequency adaptations (H05K1/0216 takes precedence)}
- H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)}
- H05K 1/0326: {containing O}
- H05K 1/0346: {containing N}
- H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
- H05K 2201/0141: Liquid crystal polymer [LCP]
- H05K 2201/2054: Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
- H05K 2203/107: Using laser light
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A thermoplastic composition includes: (a) poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof; (b) at least 10 wt % of a reinforcing filler comprising glass fiber; (c) a laser direct structuring (LDS) additive comprising a tin oxide, an antimony oxide, or a combination thereof; and (d) a reflection additive comprising a titanium compound. A weight ratio of total titanium in the composition to the LDS additive in the composition is at least 0.7:1, or a weight ratio of total titanium in the composition to the PCT is 1.1:1 or less.

## Claims

### Claim 1

A thermoplastic composition comprising:
(a) from about 34.3 wt % to about 54.3 wt % poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof;
(b) at least 10 wt % of a reinforcing filler comprising glass fiber;
(c) from about 2 wt % to about 20 wt % of a laser direct structuring (LDS) additive comprising a tin oxide and an antimony oxide; and
(d) from about 5 wt % to about 50 wt % of a reflection additive comprising a titanium compound,
wherein the composition has a dissipation factor (Df) less than 0.01 as determined using an Agilent Split Post Dielectric Resonator at 1.1 gigahertz (GHz), and
wherein the combined weight percent value of all components does not exceed 100 wt %, and all weight percent values are based on the total weight of the composition.

### Claim 2 (depends on 1)

The thermoplastic composition according to claim 1, wherein the tin oxide or the antimony oxide is in a form of a coating on an additional LDS additive.

### Claim 3 (depends on 2)

The thermoplastic composition according to claim 2, wherein the additional LDS additive comprises a titanium oxide.

### Claim 4 (depends on 1)

The thermoplastic composition according to claim 1, wherein the composition further comprises a thermally conductive filler different than the reinforcing filler in element (b).

### Claim 5 (depends on 4)

The thermoplastic composition according to claim 4, wherein the thermally conductive filler comprises boron nitride.

### Claim 6 (depends on 1)

The thermoplastic composition according to claim 1, wherein the composition comprises from about 5 wt % to about 20 wt % of the LDS additive.

### Claim 7 (depends on 6)

The thermoplastic composition according to claim 6, wherein the composition comprises from about 10 wt % to about 20 wt % of the reflection additive comprising the titanium compound.

### Claim 8 (depends on 1)

The thermoplastic composition according to claim 1, wherein the reinforcing filler further comprises ceramic fiber, carbon fiber, a mineral filler, or a combination thereof.

### Claim 9 (depends on 1)

The thermoplastic composition according to claim 1, wherein the composition has a heat distortion temperature (HDT) at 1.82 megapascals (MPa) and a sample thickness of 3.2 millimeters (mm) of at least 220° ° C., or a HDT at 0.45 MPa and a sample thickness of 3.2 mm of at least 200° C.

### Claim 10 (depends on 1)

The thermoplastic composition according to claim 1, wherein the composition has an L* of at least 70 as determined in accordance with the CIE L*a*b* color space standard.

### Claim 11 (depends on 1)

The thermoplastic composition according to claim 1, wherein the composition has a reflectance of from about 50% to about 95% at a wavelength of from 400 nanometers (nm) to 750 nm.

### Claim 12 (depends on 1)

The thermoplastic composition according to claim 1, wherein the composition has an in-plane thermal conductivity of at least 0.5 watts per meter Kelvin (W/(m·K)), or a through-plane thermal conductivity of at least 0.5 W/(m·K).

### Claim 13 (depends on 1)

The thermoplastic composition according to claim 1, wherein the composition further comprises one or more additional additives.

### Claim 14 (depends on 13)

The thermoplastic composition according to claim 13, wherein the one or more additional additives comprises an impact modifier, acid scavenger, anti-drip agent, antioxidant, antistatic agent, chain extender, colorant, de-molding agent, flow promoter, lubricant, mold release agent, plasticizer, quenching agent, flame retardant, UV reflecting additive, or a combination thereof.

### Claim 15 (depends on 1)

An article comprising the thermoplastic composition according to claim 1, wherein the article is a component of a light emitting diode (LED) or a component of a 5G network telecommunications device.

### Claim 16 (depends on 1)

The thermoplastic composition according to claim 1, wherein the composition comprises at least about 20 wt % of the reinforcing filler comprising glass fiber.