Aromatic polyamide films for transparent flexible substrates
AssigneeAkron Polymer Systems, Inc.
InventorsLimin Sun, Frank W. Harris, Jiaokai Jing, Haci B. Erdem, John D. Harvey, Dong Zhang
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AssigneeAkron Polymer Systems, Inc.
InventorsLimin Sun, Frank W. Harris, Jiaokai Jing, Haci B. Erdem, John D. Harvey, Dong Zhang
Estimating the term…
The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300° C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.
A transparent film having a glass transition temperature greater than approximately 300° C. and a coefficient of thermal expansion of less than approximately 20 ppm/° C., consisting essentially of an aromatic copolyamide characterized by:
Dependencies are inferred from the claim text.