# US 12,109,779 B2 · Copper-clad laminate, wiring board, and copper foil with resin > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,109,779 B2 - Document ID: US12109779B2 - Status: Granted - Kind: B2 - Application number: 17/768,170 - Filed: 2020-10-15 - Published: 2023-02-23 - Granted: 2024-10-08 - Earliest claimed: 2019-10-25 - Assignees: Panasonic Intellectual Property Management Co., Ltd. - Applicants: Panasonic Intellectual Property Management Co., Ltd. - Inventors: Yuki Inoue; Tatsuya Arisawa; Yuki Kitai - Web page: https://patentgrep.com/patent/US12109779B2 ## CPC - B32B 15/14: next to a fibrous or filamentary layer - B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} - B32B 15/082: comprising vinyl resins; comprising acrylic resins - C08F 257/00: Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 - C08F 290/12: Polymers provided for in subclasses C08C or C08F - H05K 1/03: Use of materials for the substrate - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A copper-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by the following Formula (1) in a molecule, and a metal foil that is laminated on the insulating layer, and in which a chromium element amount, on an exposed surface of the insulating layer exposed by an etching treatment of the copper-clad laminate is 7.5 at % or less with respect to a total element amount on the exposed surface, and ten-point average roughness of the exposed surface is 2.0 μm or less. In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. ## Claims ### Claim 1 A copper-clad laminate comprising: an insulating layer; and a copper foil existing to be in contact with at least one surface of the insulating layer, wherein the insulating layer contains a cured product of a resin composition containing a polymer having a structural unit represented by the following Formula (1) in a molecule, the copper foil having a layer treated with a silane coupling agent having an amino group in the molecule as a silane coupling agent layer, a chromium element amount, on an exposed surface on which the insulating layer is exposed by an etching treatment of the copper-clad laminate with a copper chloride solution, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a surface roughness of the exposed surface is 1.1 μm or less in terms of ten-point average roughness, and wherein a thickness of the silane coupling agent layer is sufficient to cause a nitrogen element amount, on the exposed surface, measured by X-ray photoelectron spectroscopy to be 1.0 at % to 5.0 at % with respect to a total element amount measured by X-ray photoelectron spectroscopy: wherein in Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. ### Claim 2 (depends on 1) The copper-clad laminate according to claim 1, wherein the nitrogen element is derived from a nitrogen atom contained in a compound having an amino group. ### Claim 3 (depends on 1) The copper-clad laminate according to claim 1, wherein the structural unit represented by Formula (1) includes a structural unit represented by the following Formula (2): wherein in Formula (2), R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms and R10 represents an arylene group having 6 to 12 carbon atoms. ### Claim 4 (depends on 3) The copper-clad laminate according to claim 3, wherein the structural unit represented by Formula (2) includes a structural unit represented by the following Formula (3): wherein in Formula (3), R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. ### Claim 5 (depends on 1) The copper-clad laminate according to claim 1, wherein the polymer includes a polymer further having a structural unit represented by the following Formula (4) in a molecule: wherein in Formula (4), R11 to R13 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms and R14 represents an aryl group. ### Claim 6 (depends on 5) The copper-clad laminate according to claim 5, wherein the aryl group in the structural unit represented by Formula (4) has an alkyl group having 1 to 6 carbon atoms. ### Claim 7 (depends on 1) The copper-clad laminate according to claim 1, wherein a weight average molecular weight of the polymer is 1,500 to 40,000. ### Claim 8 (depends on 1) The copper-clad laminate according to claim 1, wherein an equivalent of a vinyl group contained in the structural unit represented by Formula (1), where R1 to R3 are each a hydrogen atom, of the polymer is 250 to 1200 g/mol. ### Claim 9 (depends on 1) The copper-clad laminate according to claim 1, wherein the resin composition further contains a polyphenylene ether compound. ### Claim 10 (depends on 1) A wiring board comprising: wiring formed by partially removing the copper foil provided in the copper-clad laminate according to claim 1; and the insulating layer. ### Claim 11 (depends on 10) The wiring board according to claim 10, comprising a plurality of the insulating layers, wherein the wiring is disposed between the insulating layers. ### Claim 12 A copper foil with resin comprising: a resin layer; and a copper foil existing to be in contact with at least one surface of the resin layer, the copper foil having a layer treated with a silane coupling agent having an amino group in the molecule as a silane coupling agent layer, wherein the resin layer contains a resin composition containing a polymer having a structural unit represented by the following Formula (1) in a molecule or a semi-cured product of the resin composition, a chromium element amount, on an exposed surface on which the cured resin layer is exposed by an etching treatment of the copper foil existing to be in contact with a surface of the cured resin layer with a copper chloride solution when the resin layer provided in the copper foil with resin is cured, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a surface roughness of the exposed surface is 1.1 um or less in terms of ten-point average roughness , and wherein a thickness of the silane coupling agent layer is sufficient to cause a nitrogen element amount, on the exposed surface, measured by X-ray photoelectron spectroscopy to be 1.0 at % to 5.0 at % with respect to a total element amount measured by X-ray photoelectron spectroscopy: wherein in Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.